Sanotac BM-200 High-Purity Bellows Pump for Semiconductor Wet Process Chemical Delivery

Overview

The Sanotac BM-200 is an electromechanically driven, metal-free bellows pump engineered for ultra-high-purity fluid handling in semiconductor front-end wet process applications. It operates on a positive displacement principle, utilizing a hermetically sealed, PTFE- or PFA-lined metallic bellows that expands and contracts under precise stepper motor–driven screw actuation. This architecture eliminates dynamic seals, rotating shafts, and elastomeric components from the fluid path—ensuring zero particle generation, no external gas ingress, and absolute chemical compatibility with aggressive reagents including hydrofluoric acid (HF), tetramethylammonium hydroxide (TMAH), photoresists, battery electrolytes, and ultrapure water (UPW). Designed specifically for Class 1–10 cleanroom environments, the BM-200 delivers continuous low-pulsation flow or discrete high-accuracy dispense events with traceable volumetric control—making it suitable for critical unit operations such as spin-coating, develop rinse, etch solution circulation, and electrolyte filling in Li-ion battery manufacturing.

Key Features

• Metal-free wetted path constructed entirely from fluoropolymer (PTFE/PFA) and specialized ceramic—validated for compatibility with ISO 14644-1 Class 3 cleanroom requirements and SEMI F57 chemical resistance standards.
• Stepper-motor–driven precision screw mechanism enables digital volumetric control with ±1% flow accuracy and 0.1 mL/min incremental resolution across the full 1.0–200.0 mL/min range.
• Zero-leakage, sealless design: The static bellows structure prevents both fluid leakage and ambient contamination—critical for maintaining HF solution stability and avoiding crystallization due to moisture ingress.
• Integrated real-time pressure monitoring with programmable overpressure cutoff (≤0.5 MPa threshold), safeguarding downstream tooling and process integrity during sudden line blockages or valve closures.
• Multi-protocol industrial communication interface (USB, RS232, RS485) supporting Modbus RTU protocol for seamless integration into SECS/GEM-compliant factory automation systems and MES-controlled batch records.
• Low particulate generation (<1 particle ≥0.1 µm per mL at 100 mL/min, per JIS B 8201-2 test methodology) due to absence of sliding or rubbing contact surfaces in the fluid path.

Sample Compatibility & Compliance

The BM-200 is qualified for use with a broad spectrum of process chemicals classified under SEMI C1–C12 purity grades, including but not limited to: photoresist formulations (novolac, chemically amplified), developer solutions (TMAH-based), etchants (HF/NH₄F, HNO₃/HF mixtures), strippers (sulfuric acid/peroxide blends), and non-aqueous electrolytes (LiPF₆ in EC/DMC). Its all-fluoropolymer fluid path meets ASTM D471 resistance criteria for >90 days immersion in concentrated HF (49%) at 25°C without measurable swelling or weight gain. The pump complies with IEC 61000-6-2 (immunity) and IEC 61000-6-4 (emission) for industrial environments and supports audit-ready electronic log generation required under FDA 21 CFR Part 11 and ISO 9001:2015 quality management systems.

Software & Data Management

The BM-200 interfaces natively with Sanotac’s PumpControl Suite v3.2—a Windows-based configuration and diagnostics platform enabling remote parameter setting, real-time flow/pressure trending, event logging (start/stop, error, pressure fault), and CSV export of time-stamped operational data. All parameter changes are timestamped and user-logged with role-based access control (admin/operator modes). Audit trails include operator ID, timestamp, pre-change and post-change values, and system status flags—fully compliant with GLP and GMP documentation requirements. Optional OPC UA server module allows bidirectional data exchange with Siemens PCS7, Yokogawa CENTUM VP, or Rockwell FactoryTalk systems.

Applications

• Semiconductor photolithography: Metered delivery of photoresist to spin coaters; controlled dispensing of developers and TMAH-based strippers in track systems.
• Wet etch and clean modules: Precise recirculation of HF-based etchants in single-wafer tools; UPW rinse metering with pulseless flow stability.
• Advanced packaging: Underfill and molding compound dosing with sub-milliliter repeatability.
• Lithium-ion battery production: Electrolyte injection into prismatic and pouch cells with <±0.5% volume consistency across 10,000-cycle validation runs.
• Lab-scale R&D: Quantitative reagent addition in microreactors, catalyst screening platforms, and electrochemical cell testing rigs requiring inert, low-shear fluid transfer.

FAQ

What materials are in direct contact with the fluid path?
PTFE, PFA, and high-purity alumina ceramic—no stainless steel, nickel alloys, or elastomers are present in any wetted component.
Can the BM-200 handle viscous photoresists up to 300 cP?
Yes—the dual-stage bellows actuation and optimized inlet geometry maintain stable volumetric delivery across the full specified viscosity range without cavitation or slip.
Is the pump compatible with cleanroom ISO Class 1 environments?
It meets ISO 14644-1 Class 3 airborne particle limits when installed with certified HEPA-filtered purge air; optional nitrogen-purged enclosure kits are available for Class 1 integration.
How is calibration traceability maintained?
Each unit ships with NIST-traceable calibration certificate (flow and pressure), and field recalibration is supported via gravimetric verification using Class E2 weights and certified analytical balances per ISO/IEC 17025 procedures.
Does the pump support automated recipe-based dispensing?
Yes—via Modbus register mapping, the BM-200 accepts external trigger signals and executes preloaded dispense profiles (volume, rate, dwell time) synchronized with tool-level PLC logic.