SPS SPIN150i Spin Coater

Overview

The SPS SPIN150i Spin Coater is a precision-engineered, benchtop single-wafer spin processing system designed for R&D laboratories and low-volume production environments in microelectronics, MEMS, photovoltaics (PV), microfluidics, and advanced materials research. It operates on the principle of centrifugal force-driven thin-film deposition—where liquid precursor (e.g., photoresist, polymer solution, sol-gel ink) is dispensed onto a rotating substrate and uniformly distributed via controlled rotational acceleration and dwell time. This process enables reproducible film thickness control down to sub-10 nm resolution (dependent on material rheology and process parameters), with high spatial uniformity (<±1.5% across 150 mm wafers). The system features a modular architecture built around NPP (polypropylene copolymer) wetted components as standard—offering excellent chemical resistance to common solvents (acetone, IPA, PGMEA, DMSO, HF-based etchants) and compliance with cleanroom ISO Class 5 (Class 100) operational requirements.

Key Features

• Programmable bidirectional rotation: Continuous clockwise (CW) and counterclockwise (CCW) spin modes, plus oscillatory stirring for enhanced solution homogenization prior to coating.
• High-resolution motion control: Speed range 0–12,000 rpm with ±0.1 rpm accuracy; acceleration/deceleration rates adjustable from 1 to 30,000 rpm/sec in 1 rpm/sec increments.
• Integrated safety interlock system: Motor automatically halts upon lid opening, verified by proximity sensors; transparent polycarbonate safety cover with injection-molded NPP gasket ensures full visibility and chemical containment.
• Modular dispensing interface: Standard syringe mount compatible with 1–50 mL glass or plastic Luer-lock syringes; optional add-ons include ultrasonic nozzle cleaning modules, multi-channel fluidic manifolds, and solvent-resistant PTFE-coated dispensing lines.
• Intuitive HMI: 7-inch full-color capacitive touchscreen with detachable mounting bracket; supports up to 99 user-defined recipes with timestamped versioning and parameter locking (speed, time, acceleration, dispense volume, dwell delay).
• Universal substrate handling: Accommodates round wafers from Ø2.5 mm to Ø300 mm and square substrates up to 150 × 150 mm; includes vacuum chuck A-V36 (for Ø50–150 mm) and fragment adapter D-V10 (for irregular or diced pieces ≥2.5 mm).

Sample Compatibility & Compliance

The SPIN150i supports broad substrate compatibility—including silicon, fused silica, quartz, sapphire, glass, PET, PI, stainless steel, and flexible polymer foils. Its NPP construction meets EU REACH Annex XIV and RoHS 2011/65/EU directives. All wetted surfaces are non-metallic and static-dissipative (surface resistivity 10⁶–10⁹ Ω/sq), minimizing particle generation and electrostatic attraction. The system is compatible with GLP-compliant documentation workflows and supports audit-ready operation when integrated with external LIMS or electronic lab notebooks (ELN). Optional IQ/OQ documentation packages are available per ISO 9001:2015 and ASTM E2500-13 guidelines.

Software & Data Management

The embedded firmware provides real-time monitoring of motor torque, chamber humidity (via optional sensor), and dispense volume confirmation (via stepper motor step-count validation). Recipe data is stored locally in encrypted SQLite format and exportable via USB 2.0 to CSV or XML. For regulated environments, optional software add-ons enable 21 CFR Part 11 compliance—including electronic signatures, role-based access control, and immutable audit trails for all parameter changes and run logs. Remote diagnostics and firmware updates are supported over Ethernet (TCP/IP) with TLS 1.2 encryption.

Applications

• Photoresist spin-coating for lithographic patterning in semiconductor prototyping (0.5–5 µm films).
• Functional layer deposition in perovskite solar cell R&D (e.g., PEDOT:PSS, spiro-OMeTAD, metal oxide ETLs).
• Microfluidic channel fabrication using SU-8, PDMS prepolymers, or thermoset epoxies.
• Antireflective, hydrophobic, and conductive thin-film development (e.g., TiO₂, ITO, graphene oxide dispersions).
• Surface passivation and dielectric encapsulation in MEMS packaging processes.
• Spin-assisted layer-by-layer (LbL) assembly for biosensor platforms.

FAQ

What vacuum pressure does the A-V36 chuck achieve?
The A-V36 vacuum chuck delivers ≥−80 kPa (absolute) at 25 °C using an integrated diaphragm pump; optional high-vacuum upgrade supports −95 kPa for warped or low-porosity substrates.
Is PTFE wetted-path configuration available as a factory option?
Yes—PTFE-lined chamber, chuck seal, and fluid path components are offered as configurable option PTFE-SPIN150i, certified for use with concentrated acids (e.g., 49% HF) and strong oxidizers (e.g., piranha solution) under strict SOP controls.
Can the SPIN150i be integrated into automated cluster tools?
Yes—RS-485 Modbus RTU and digital I/O (8 in / 8 out) ports support SECS/GEM protocol translation via third-party gateways; mechanical footprint and height are compliant with SEMI E19.02-0209 standards.
Does the system meet CE marking requirements for electromagnetic compatibility?
Yes—the SPIN150i carries full CE marking per EMC Directive 2014/30/EU and Machinery Directive 2006/42/EC, including conducted/radiated emissions testing per EN 61326-1:2013.