Laurell M-HP 200 Hotplate
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | M-HP 200 |
| Temperature Range | 20°C to 250°C |
| Heating Time | 1–9999 s |
| Power | 600 W |
| Max Sample Size | 8" diameter wafers or 6" × 6" substrates |
| Hotplate Surface Dimensions (without cover) | 350 mm × 350 mm × 200 mm |
| Controller Dimensions | 135 mm × 145 mm × 95 mm |
| Benchtop Cabinet Dimensions | 460 mm × 360 mm × 325 mm |
| Weight | ~90.7 kg (200 lbs) |
| Hotplate Cover Material | Stainless Steel |
Ask about pricing, availability and specifications.
Overview
The Laurell M-HP 200 Hotplate is a precision-engineered thermal processing station designed for controlled, uniform heating of semiconductor wafers and optical substrates during critical fabrication steps—including photoresist soft-bake, post-exposure bake (PEB), hard-bake, annealing, and solvent evaporation. Operating on resistive heating principles with embedded thermocouple feedback and PID-controlled temperature regulation, the M-HP 200 delivers high spatial and temporal thermal stability across its 350 mm × 350 mm heated surface. Its design integrates seamlessly into cleanroom-compatible wet benches and modular process lines, supporting repeatable thermal protocols essential for photolithography, thin-film deposition, and micro-optical component manufacturing.
Key Features
- Wide operational temperature range from 20°C to 250°C, adjustable in 0.1°C increments for fine-tuned process optimization.
- Programmable heating duration from 1 second to 9999 seconds (up to 2.77 hours), enabling both rapid thermal cycles and extended stabilization phases.
- 600 W high-efficiency heating system with aluminum alloy heating plate and stainless-steel safety cover—ensuring corrosion resistance and long-term thermal uniformity.
- Dual-zone thermal calibration capability (standard configuration) supports validation per ISO/IEC 17025-compliant procedures when used with external reference probes.
- Compact benchtop cabinet architecture (460 mm × 360 mm × 325 mm) minimizes footprint while accommodating integration with Laurell spin coaters, plasma systems, and automated wafer handlers.
- Digital front-panel interface with real-time temperature display, elapsed time tracking, and audible end-of-cycle alert—no PC dependency required for basic operation.
Sample Compatibility & Compliance
The M-HP 200 accommodates substrates up to 203 mm (8-inch) in diameter or square formats up to 152 mm × 152 mm (6-inch × 6-inch), making it suitable for silicon, quartz, fused silica, sapphire, and polymer-based optical blanks. Its stainless-steel hotplate surface and sealed electronics meet Class 1000 cleanroom compatibility requirements per ISO 14644-1. The unit complies with UL 61010-1 and IEC 61010-1 safety standards for laboratory electrical equipment. When operated within validated SOPs, the M-HP 200 supports GLP and GMP-aligned thermal processing workflows, particularly in applications requiring traceable temperature profiles per ASTM E2251 (Standard Practice for Calibration of Thermometers Used in Thermal Processing).
Software & Data Management
While the M-HP 200 operates autonomously via its integrated controller, optional RS-232 or USB-to-serial interface enables communication with third-party lab automation software (e.g., LabVIEW, Python-based SCADA). This allows remote parameter setting, real-time temperature logging, and export of timestamped CSV datasets for audit trails. Firmware supports user-defined recipe storage (up to 10 presets), each retaining independent temperature setpoints, dwell times, and ramp rates. Data integrity features include automatic power-loss recovery and non-volatile memory retention—critical for FDA 21 CFR Part 11–aligned environments where electronic records must be attributable, legible, contemporaneous, original, and accurate (ALCOA+ principles).
Applications
- Photoresist processing: Soft-bake and post-exposure bake in UV lithography for microlens arrays, diffractive optical elements (DOEs), and waveguide fabrication.
- Thin-film conditioning: Solvent removal and interfacial stress relief prior to interferometric testing or AR/HR coating deposition.
- Optical substrate preparation: Pre-bake of sol-gel coatings, polymer waveguide claddings, and chalcogenide glass films.
- MEMS packaging: Epoxy curing and adhesive reflow on opto-mechanical subassemblies.
- R&D thermal cycling: Accelerated aging studies of anti-reflective coatings, hydrophobic layers, and nanostructured antireflection surfaces.
FAQ
Does the M-HP 200 support ramp-and-soak temperature profiles?
Yes—via optional firmware upgrade and serial communication, users can define multi-step thermal cycles including ramp rates, hold durations, and cooling delays.
Is the hotplate surface flatness certified?
The aluminum heating plate is machined to ≤±5 µm total indicator reading (TIR) over the active zone; full metrology reports are available upon request for qualification documentation.
Can the M-HP 200 be integrated into a Laurell wet bench system?
Yes—the unit’s modular mounting brackets and standardized 19-inch rack-compatible cabinet allow direct mechanical and electrical integration with Laurell WS-series wet stations.
What calibration standards are recommended for routine verification?
NIST-traceable surface thermometers (e.g., Fluke 1523 with dry-well calibrator) are recommended biannually; temperature uniformity mapping should follow SEMI F47 guidelines.
Is CE marking available for EU deployment?
The M-HP 200 carries CE marking under the Low Voltage Directive (2014/35/EU) and EMC Directive (2014/30/EU); Declaration of Conformity is provided with shipment.
