Hengyi HY(BL)TYU Computer-Controlled 90° Peel Adhesion Tester
| Brand | Hengyi / Hengyitest |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic |
| Model | HY(BL)TYU |
| Instrument Type | Electronic Tensile Testing Machine |
| Maximum Test Force | 0.2 kN (200 N) |
| Force Measurement Range | 0.2–200% of Full Scale (FS) |
| Force Accuracy | ±0.5% of reading |
| Test Stroke | 250 mm |
| Displacement Resolution | 0.001 mm |
| Effective Test Width | 50 mm |
| Speed Range | 0.001–300 mm/min (adjustable) |
| Speed Accuracy | ±0.5% of set value |
| Displacement Measurement Accuracy | ±0.5% of reading |
| Load Cell Resolution | 500,000 counts (full-scale, no range switching) |
| Motor Power | 200 W |
| Net Weight | 40 kg |
Overview
The Hengyi HY(BL)TYU Computer-Controlled 90° Peel Adhesion Tester is a precision-engineered mechanical testing system designed specifically for standardized 90° peel adhesion evaluation of pressure-sensitive adhesive (PSA) materials and thin flexible substrates. It operates on the principle of controlled unidirectional tensile separation under a fixed 90° angle between the adherend and substrate—complying with internationally recognized test methodologies including ASTM D3330, ASTM D903, ISO 8510-2, and GB/T 2792. The system employs a high-stiffness dual-column frame, servo-controlled electromechanical actuation, and real-time closed-loop force-displacement feedback to ensure repeatability and traceability in low-force peel measurements. Its 200 N capacity and sub-milligram force resolution make it suitable for characterizing delicate laminates, conductive foils (e.g., copper or aluminum), printed circuit board (PCB) coverlays, medical tapes, and functional films used in electronics, packaging, and biomedical device assembly.
Key Features
- Computer-integrated control and data acquisition via dedicated Windows-based software with real-time graphical display of load vs. displacement curves.
- Precisely engineered 90° peel fixture geometry ensuring consistent angular alignment throughout testing—minimizing bending moments and enabling true interfacial separation measurement.
- High-resolution load cell with 500,000 internal counts and no auto-ranging—maintaining constant resolution across the entire 0.2–200 N test range.
- Adjustable crosshead speed from 0.001 to 300 mm/min with ±0.5% speed accuracy, supporting both quasi-static and dynamic peel rate protocols.
- Electronic limit switches and overload protection (110% FS activation) safeguarding hardware integrity during operator error or specimen failure.
- Motorized crosshead with dual-speed (fast/slow) jog control and programmable return-to-start functionality for high-throughput lab environments.
- Modular mounting interface compatible with standard 50 mm-wide specimen grips and optional auxiliary fixtures for tape, film, or foil specimens.
Sample Compatibility & Compliance
The HY(BL)TYU accommodates a broad spectrum of thin, flexible bonded structures: acrylic- and rubber-based PSAs, silicone release liners, PET/PVC/PI films, electrolytic copper foils, solder mask laminates, and medical-grade hypoallergenic tapes. Specimen widths up to 50 mm are supported with standardized preparation per ASTM D3330 Annex A2 (conditioning at 23°C/50% RH for 48 h). All force, displacement, and timing parameters meet ISO/IEC 17025 calibration traceability requirements when operated with accredited verification procedures. The system supports GLP-compliant audit trails when configured with user-access logging and electronic signature modules.
Software & Data Management
The proprietary Hengyi TestMaster™ software provides ISO 17025-aligned data handling: automatic calculation of average peel force (N/mm), peak force, and energy-to-peel (mJ/mm); statistical reporting (mean, SD, CV%) across multiple cycles; and export to CSV, PDF, or XML formats. Raw data files include embedded metadata (operator ID, timestamp, environmental conditions, calibration certificate ID). Optional 21 CFR Part 11 compliance package enables electronic signatures, role-based access control, and immutable audit logs for regulated QA/QC labs.
Applications
- Quality assurance of adhesive tapes in automotive interior trim bonding and electronics EMI shielding applications.
- R&D validation of peel performance for flexible printed circuit (FPC) coverlay lamination processes.
- Comparative analysis of aging effects on PSA bond strength after thermal/humidity cycling per IPC-TM-650 2.6.25.
- Regulatory submission support for Class I/II medical devices requiring ISO 10993-5 cytotoxicity-correlated peel data.
- Supplier qualification testing per OEM specifications (e.g., Apple MFi, Samsung QCT, Bosch ADAS module standards).
FAQ
What peel angle does this instrument enforce, and how is angular accuracy maintained?
The HY(BL)TYU mechanically constrains the peel angle to precisely 90° using a rigid, calibrated roller fixture and fixed anchor geometry—verified annually per ASTM E251 calibration protocol.
Can the system be calibrated to national metrology institute (NMI) standards?
Yes—load cell and encoder subsystems are compatible with NIST-traceable calibration kits; full-system verification follows ISO 7500-1 Class 0.5 requirements.
Is third-party software integration supported (e.g., LabVIEW or Python APIs)?
Native DLL drivers and TCP/IP command protocol documentation are provided for custom automation and LIMS integration.
Does the instrument comply with FDA 21 CFR Part 11 for electronic records?
With optional Part 11 add-on license, the software delivers full electronic signature enforcement, audit trail generation, and data integrity controls per FDA guidance.
What maintenance intervals are recommended for long-term force accuracy stability?
Biannual verification of load cell linearity and displacement encoder drift is advised; annual recalibration by an ISO/IEC 17025-accredited service provider ensures continued compliance.
