Nanoimprint Lithography Equipment
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Showing all 8 results
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Application | In-situ alignment, surface activation, wafer bonding, and nanoimprint lithography (NIL) |
| Compliance | Designed for Class 100 cleanroom integration |
| Control Architecture | Motorized precision stages with sub-micron alignment repeatability |
| Vacuum Compatibility | <5×10⁻⁶ mbar base pressure |
| Thermal Bonding Range | Ambient to 500 °C |
| Alignment Accuracy | ≤±25 nm (3σ, optical auto-alignment mode) |
| NIL Capability | Compatible with rigid and soft stamps |
| Brand | Appo |
|---|---|
| Origin | Shanghai, China |
| Model | NIL-100 |
| Imprint Area | 4-inch (100 mm) wafers/substrates |
| Max. Pressure | 8 bar (integrated air compressor), 20 bar (external cleanroom supply) |
| Temperature Range | Ambient to 250 °C |
| UV Source | 400 W high-pressure Hg lamp, dominant wavelength 365 nm |
| Vacuum Level | ≤10 Pa |
| Heating Method | Electromagnetic single-side heating |
| Automation | Motorized auto-demolding |
| Compatible imprint modes | Thermal embossing & UV-curable step-and-flash imprint lithography (S-FIL) |
| Optional consumables | Full suite of nanoimprint resists (thermal, UV-curable, lift-off, deep-etch), anti-sticking agents, adhesion promoters, and custom mold fabrication support (Ni, SFP®, Hybrid Mold®) |
| Resolution capability | ≤20 nm (with appropriate mold and process optimization) |
| Compliance | Designed for R&D and pilot-line use under GLP-aligned lab practices |
| Brand | Germanlitho (Tianren Micronano) |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | OEM Manufacturer |
| Origin Category | Domestic (China) |
| Model | GL8 CLIV Gen2 |
| Pricing | Upon Request |
| Brand | Huaweina |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | LDW-P |
| Price Range | USD 14,000 – 28,000 |
| Maximum Writing Resolution | 50 nm |
| Minimum Spot Size | 275 nm |
| Minimum Grid Pitch | 75 nm |
| Stage Resolution | 1 nm |
| Absolute Positioning Accuracy | <10 nm |
| Writing Field Options | 100×100 to 1500×1500 µm |
| Laser Power Stability | <±1% RMS |
| Software Platform | LDW-SC Control Suite |
| Optical Principle | Nonlinear Threshold-Dependent Ablation/Modification via Gaussian-Focused Ultrafast Laser Pulses |
| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CNI V4.0 PV |
| Pricing | Upon Request |
| Imprint Area | Up to Ø210 mm (8″) |
| Chamber Height | 20 mm |
| Thermal NIL Max Temp | 200 °C (optional 250 °C module) |
| UV-NIL Wavelength | 365 nm (optional 405 nm module) |
| Vacuum Level | ≤0.1 mbar |
| Maximum Imprint Pressure | 11 bar |
| Control Interface | Laptop-based with dedicated software |
| Automation Level | Fully automated process execution (manual stamp/substrate loading) |
| Form Factor | Benchtop, modular, plug-and-play |
| Brand | PolyPico |
|---|---|
| Origin | Denmark |
| Model | UniA6 |
| Imprint Methods | Thermal, UV (365 nm), Vacuum-assisted |
| Max Substrate/Stamp Diameter | 210 mm (8″) |
| Chamber Height | 20 mm |
| Max Imprint Pressure | 11 bar |
| Thermal Range | Up to 200 °C (optional 250 °C module) |
| UV Wavelengths | 365 nm (standard), 405 nm (optional) |
| Vacuum Level | ≤ 0.1 mbar |
| Control | Fully automated via laptop-based software |
| Form Factor | Benchtop, modular, plug-and-play |
| Brand | SCIL |
|---|---|
| Origin | Netherlands |
| Model | LabSCIL |
| Wafer Size | Up to 8-inch (200 mm) |
| Alignment Accuracy | < 1 µm |
| Imprint Technology | Low-Force Soft-Mold Substrate-Conformal Nanoimprint |
| Compatible Resists | Thermal Sol-Gel, UV Sol-Gel, UV Organic |
| Wafer Thickness Range | 0.3–2.5 mm |
| Footprint (W×L×H) | 1.8 × 1.4 × 2.2 m |
| Resist Application | External Spin-Coater Required |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Software | SCIL Control Suite with Audit Trail & Parameter Logging |
| Brand | SHNTI |
|---|---|
| Origin | Shanghai, China |
| Model | YPL-NIL-SI400 |
| Temperature Range | RT to 350 °C |
| Pressure Range | 0–20 psi (on 4″ wafer) |
| Vacuum Range | 101.3 kPa to 0.1 Pa |
| UV Exposure System | Integrated |
| Sample Holder Max Diameter | 100 mm (4″) |
| Cooling | Integrated Water-Cooled System |
| Control | PLC-based with Touchscreen HMI |
| Software | Proprietary SI400 Machine Control Suite |
| Loading Method | Manual Wafer/Template Handling |
| Sealing | Bellows-Sealed Vacuum Chamber |
| Compliance | Designed for Class 100–1000 cleanroom integration |
