Assembly & Packaging Equipment
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| Brand | Acona |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | Acona 7000 AD |
| Price Range | USD $1,400 – $98,000 |
| Brand | Acona |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | Acona A7000 APS |
| Price Range | USD 1,400 – 140,000 |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Model | 6110 |
| Spindle Power | 2.2 kW |
| Max Spindle Speed | 60,000 rpm |
| Spindle Torque | 0.42 N·m |
| θ-Axis Drive | Direct-Drive (DD) Motor |
| Machine Width | 490 mm |
| Control Interface | 17-inch LCD Touchscreen GUI |
| Standard Features | Auto-Calibration, Auto-Cutting, Blade-Trace Inspection |
| Optional Features | Fragment Shape Recognition, One-Touch Position Verification |
| Sample Compatibility | Si, SiC, GaAs, Glass, Ceramic, Solar Wafers |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Region of Manufacture | Domestic (China) |
| Model | 7234 |
| Pricing | Upon Request |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Model | 7920 |
| Blade Diameter Range | 2"–3" |
| Maximum Spindle Speed | 60,000 rpm |
| Spindle Power | 1.2 kW per axis |
| Workpiece Capacity | Ø12" or 12" × 10" |
| X-Axis | Pneumatic Linear Slide |
| Y-Axis Resolution | 0.1 µm |
| Z1/Z2-Axis Resolution | 0.2 µm |
| Z1/Z2 Travel | 30 mm |
| Z1/Z2 Repeatability | ±1.0 µm |
| θ-Axis Repeatability | ±4 arc-sec |
| θ-Axis Travel | 350° |
| Cumulative Positioning Accuracy | ±1.5 µm |
| Step Positioning Accuracy | ±1.0 µm |
| Electrical Supply | 200–240 VAC, 50–60 Hz, Single-Phase |
| Dimensions (W×D×H) | 875 × 975 × 1450 mm |
| Weight | 900 kg |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (China) |
| Model | 8230 |
| Pricing | Available Upon Request |
| Brand | Amadyne |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Fab1 / catAP / EMU |
| Pricing | Upon Request |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model Series | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Maximum Wafer Size | 200 mm |
| Heating Range | Up to 650 °C |
| Bonding Chamber Vacuum | ≤1 × 10⁻⁵ mbar (with turbomolecular pump) |
| Control Interface | Windows-based HMI with full process logging |
| Compliance | Designed for GLP/GMP-aligned R&D and pilot-line environments |
| Automation Level | Semi-automatic (manual load/unload, fully automated alignment, activation, and bonding) |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04 & AWB-08 Platform |
| Vacuum Base Pressure | ≤1×10⁻⁶ mbar |
| Maximum Bonding Force | 40 kN |
| Maximum Temperature | 560 °C |
| Anodic Bonding Voltage | 0–2.5 kV DC (up to 40 mA) |
| Alignment Accuracy | ±1 µm (in-situ, hot or cold) |
| Compatible Wafer Sizes | 2″, 3″, 4″, 5″, 6″, and 8″ |
| Bonding Environments | High vacuum, UHV (optional), controlled process gas (e.g., forming gas), or atmospheric inert gas |
| Optical System | Dual CCD microscope with through-the-lens illumination, visible + infrared imaging, real-time side-by-side wafer alignment display |
| Control Architecture | Fully automated PC-based system with recipe-driven operation, full parameter logging (voltage, current, integrated charge, temperature, pressure, force, separation, event timestamps), SPC-compliant data export, and remote diagnostic capability via secure network interface |
| Brand | Analysis |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Bonder300 |
| Pricing | Available Upon Request |
| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AX-LS100 |
| Maximum Linear Cutting Speed | 800 mm/s |
| Application Scope | Semiconductor Wafer Dicing |
| Maximum Wafer Size | 300 mm (12-inch) |
| Laser Class | Class 1 Enclosure |
| Dimensions (W×L×H) | 1530 × 900 × 2229 mm |
| Weight | 750 kg |
| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | AX-LS1000 |
| Maximum Linear Cutting Speed | 200 mm/s |
| Maximum Dicing Speed (YAG variant) | 140 mm/s |
| Maximum Dicing Speed (Semiconductor Laser variant) | 220 mm/s |
| Kerf Width | 30 µm |
| Cooling | Integrated Air-Cooling System |
| Configuration | T-Stage Dual-Station Platform |
| Laser Source Type | Fiber Laser (Standard), Optional YAG or Diode-Pumped Semiconductor Laser |
| Brand | budatec® |
|---|---|
| Origin | Germany |
| Model | VS 160 |
| Chamber Size | 160 × 160 mm² |
| Max. Chamber Height | 50 mm |
| Max. Process Temperature | 450 °C |
| Heating/Cooling Rate | up to 3 K/s |
| Atmosphere Control | Programmable N₂, N₂/H₂ (95/5), or Formic Acid (HCOOH) via Proportional Flow Valves |
| Temperature Monitoring | Independent Thermocouple Feedback Loop |
| Max. Load Capacity | 2.5 kg |
| Power Supply | 400 V / 16 A |
| Cooling Water Requirement | 10 slm |
| Process Visualization | Real-time Graphical Component Overview |
| Key | Origin: Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | Eagle-I |
| Inspection Speed | 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | CAMTEK Eagle-I / Eagle-AP / EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Throughput | Up to 50 million bump measurement points per wafer |
| 2D Detection Resolution | 0.2 µm |
| 3D Height Measurement Accuracy | ±0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Feature Size | 2 µm bump / 2 µm line width |
| Defect Sensitivity | Down to 0.2 µm surface anomalies |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Speed | Up to 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Line Width/Spacing | 2 µm (post-RDL) |
| Defect Detection Limit | 0.2 µm surface anomalies |
| Compatible Substrates | Flat and warped wafers, square dies, compound semiconductor substrates |
| Brand | Camtek / FRT |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | MicroProf®100 |
| Detection Speed | Up to 50 million measurement points per wafer |
| 2D Lateral Resolution | 0.2 µm |
| 3D Vertical Height Accuracy | ±0.05 µm (measuring range: 2–100 µm) |
| Dual-Sided Measurement Capability | Yes (TTV/Bow/Warp/TIR/LTV) |
| Optical Principle | White-light Interferometry & Chromatic Confocal Sensing |
| Optional IR Sensor | Integrated for backside thickness monitoring of Si, GaAs, InP, SiC, GaN wafers |
| Compliance | SEMI Standard-compliant dual-probe architecture |
| Form Factor | Compact benchtop metrology platform |
| Brand | Coruna |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Regional Category | Domestic (PRC) |
| Model | Screen Printer |
| Price | USD 1.00 (FOB Jiangsu, Ex-Works) |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Wafer Size Support | Up to 200 mm |
| Maximum Bonding Temperature | 650 °C |
| Heating Control | Independent top/bottom platen |
| Vacuum Level | ≤10⁻⁵ mbar (with turbomolecular pump) |
| Bonding Processes Supported | Anodic, Thermocompression, Eutectic, Glass Frit, Direct Si–Si, Intermediate Layer Adhesive, SOI, and Plasma-Activated Bonding |
| Automation Level | Semi-automatic (manual load/unload, fully automated bonding cycle) |
| Nanopatterning Capability | Integrated nanoimprint functionality |
| Brand | SET/Sensor Electronic Technology |
|---|---|
| Origin | Germany |
| Model | G5/2017 Series |
| Bonding Accuracy | ±0.5 µm |
| Bonding Methods | Thermocompression, Reflow Soldering, UV Curing |
| Compatible Materials | Au, Au/Sn, In, Cu, Cu/Sn |
| Applications | Flip-Chip, Die-to-Substrate (D2S), Chip-to-Chip (C2C), Chip-to-Substrate (C2S), MEMS, MOEMS, MCM, Photonic Integrated Circuits (PICs), Silicon Photonics, Optoelectronic Assembly |
| Brand | Fastmicro |
|---|---|
| Origin | Netherlands |
| Model | FM-PS-PFS-V01 |
| Minimum Detectable Particle Size | 0.5 µm |
| Measurement Speed | Real-time, second-level continuous monitoring |
| Output Formats | KLARF, Excel |
| Interface | USB, Ethernet |
| Sample Stage Diameter | 50 mm (base), compatible with 25 mm wafers |
| Environmental Operation | Ambient air and vacuum-compatible |
| Dimensions (L×W×H) | 405 mm × 183 mm × 209 mm |
| Detection Principle | Mie scattering-based surface particle imaging |
| Brand | Fastmicro |
|---|---|
| Country of Origin | Netherlands |
| Model | FM-PS-PRS-V01 |
| Detection Principle | Mie Scattering |
| Minimum Detectable Particle Size | 0.5 µm (PSL) |
| Measurement Speed | Full-surface imaging in seconds |
| Position Accuracy | 80 µm |
| Position Repeatability | 30 µm |
| Size Accuracy (PSL) | <20% error |
| Surface Roughness Requirement | Ra < 50 nm |
| Output Formats | KLARF, Excel |
| Interface | USB, Ethernet |
| Contactless Operation | Yes |
| Compliance | Designed for ISO 14644-1 cleanroom environments and SEMI S2/S8 safety standards |
| Brand | G&N |
|---|---|
| Origin | Germany |
| Model | MPS R400CV |
| Wafer Compatibility | 2″, 3″, 4″, 5″, 6″, 8″ |
| Chuck Flatness Error | ≤2 µm |
| Grinding Method | Z-axis plunge grinding with synchronized wafer and spindle rotation |
| Spindle Type | Integrated high-precision air-bearing spindle |
| Spindle Speed | 2560 rpm |
| Spindle Power | 3.7 kW |
| Grinding Wheel Diameter | 200 mm |
| Number of Spindles | 1 |
| Coarse/Fine Feed Range | 170 mm |
| Feed Resolution | ≤1 µm |
| Minimum Step Size | 0.1 µm |
| Coarse Grinding Rate | 2–1000 µm/min |
| Fine Grinding Rate | 2–1000 µm/min |
| Surface Roughness (Ra) | Down to 0.016 µm (with D7 diamond wheel) |
| Total Thickness Variation (TTV) | ≤3 µm per wafer |
| Inter-wafer Thickness Uniformity | ≤2 µm |
| Wheel Material | Diamond or CBN |
| Wheel Mounting | Single or dual-wheel configuration (manual or optional automatic change) |
| Chuck Sizes | Multiple vacuum chucks for 2″–8″ wafers |
| Sample Table Diameter | 400 mm |
| Sample Table Speed | 2–20 rpm |
| Control System | High-precision PLC-based controller with touchscreen HMI |
| Recipe Storage | Multiple programmable process recipes |
| Optional Module | In-situ thickness measurement unit |
| Enclosure | Fully enclosed grinding chamber |
| Machine Weight | 1130 kg |
| Footprint | 1640 × 1210 mm |
| Brand | GLASER |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | SMART ETCH II |
| Price | Upon Request |
| Laser Type | Air-Cooled Fiber Laser |
| Scanning Head | German High-Precision Digital Galvo Scanner |
| Wavelength | 1064 nm |
| Output Power | 20 W (Adjustable 1–100%) |
| Pulse Width | 1 ns – 250 ns |
| Beam Quality | M² ≤ 1.3 |
| Repetition Rate | 1 kHz – 4000 kHz |
| Decapsulation Depth Range | 0.01 mm – 3 mm |
| Maximum Scan Area | 150 mm × 150 mm |
| Focusing | Motorized Auto-Focus with Real-Time Red Dot Indicator |
| Imaging System | Integrated Coaxial Color CCD (Same-Optical-Path, Confocal Design) |
| Image Import Formats | X-Ray, SAM, SEM, JPG, PLT |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | MPPS |
| Maximum Wire Saw Speed | 400 mm/s |
| Sample Stage | Vacuum-Chuck with Rotatable Platform (Max Ø200 mm) |
| Angular Adjustment Resolution | 0.006° (Range ±4°) |
| Scribing Stroke Length | 250 mm |
| Scribing Width | 240 mm |
| Positioning Accuracy | 0.01 mm |
| Max Sample Thickness | 10 mm |
| Adjustable Scribing Force | 5–581 g |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Manual Pull Testing System for Wire Bond Strength Evaluation |
| Measurement Principle | Mechanical Force Transduction via Precision Dial Gauge |
| Test Modes | Destructive and Non-Destructive Pull Testing |
| Vertical Travel Range | 10–150 mm (Coarse) + Micrometer-Driven Fine Adjustment (0.1 mm resolution) |
| Hook Tip Diameter | 15–50 µm |
| Max Test Wire/Die Bond Diameter | 200 µm |
| Z-Axis Control | Manual Handwheel |
| Damping Mechanism | Adjustable Mechanical Damping to Suppress Vibration Artifacts |
| Preset Force Threshold | User-Adjustable for Non-Destructive Mode |
| Compliance | Designed to Support ISO/IEC 17025 Traceability Requirements (Manual Recording Pathway) |
| Optional Accessories | High-Precision XYZ+Theta Stage (25 × 25 mm travel, 1 µm resolution |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Imported Semiconductor Assembly & Packaging Equipment |
| Model | PP Stacker |
| Application | Precision Pick-and-Place, Stacking & De-stacking of Laser Diode Bars |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Software | JFP StackerControl v3.2 with Audit Trail & Event Logging |
| Power Supply | 100/230 VAC, 1 kW |
| Pneumatic Requirements | Dry air at 5 bar, vacuum ≥90% |
| Dimensions (W×D×H) | 900 × 830 × 1750 mm |
| Throughput | 600 units/hour (single bar + single spacer cycle) |
| Pick-up Force | <5 g (non-damaging micro-handling) |
| XY Stage Resolution | 1 µm (micrometer-adjustable manual stage) |
| Vision System | Triple 5 MP color cameras (vertical orientation), independent digital video control, LED illumination (adjustable intensity), field-of-view up to 20 mm, continuous optical zoom, 11× digital zoom, PIP mode (3 windows), calibrated scale bar (0.6 mm @ 20×) |
| Sample Compatibility | Laser diode bars (max. 18 mm length |
| Tooling Options | Manual blue-tape ejection kit |
| Brand | JFP |
|---|---|
| Country of Origin | France |
| Model | PP6 / PP7 / MPS |
| Type | Manual Semiconductor Die Bonder & Pick-and-Place System |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Control Interface | Ergonomic joystick + 7-inch capacitive touchscreen |
| Optical System | UHD coaxial camera with adjustable magnification (10×–100×) |
| Bonding Capabilities | Epoxy, solder, eutectic, and formic acid-compatible chucks |
| Max Substrate Thickness | 100 mm |
| Min Die Size | 70 µm × 70 µm |
| Placement Accuracy | ±1 µm (repeatability under controlled lab conditions) |
| Optional Modules | Flip-chip alignment stage, dispensing module, ultrasonic bonding head, thermal chuck (60–250 °C) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | PP7 |
| Type | Semi-Automatic Pick-and-Place Die Bonder for Precision Semiconductor Assembly |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Mechanical Architecture | Vibration-isolated granite base with motorized Z-axis and coaxial optical alignment system |
| Imaging | Dual-axis programmable high-magnification telecentric optics with real-time focus tracking |
| Placement Accuracy | ≤ ±1.5 µm (3σ, under controlled environmental conditions) |
| Bond Height Independence | Achieved via dynamic focus-servo loop synchronized with Z-motion control |
| Substrate Compatibility | Wafers (up to 8″), ceramic packages, leadframes, and custom carriers with curvature compensation |
| Tooling Interface | Standard vacuum nozzle exchange (ISO 9409-1-22-6-40) |
| Software Platform | JFP ControlSuite v4.x with audit trail, user-level permissions, and exportable placement logs (CSV/Excel) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S100 Semi-Automatic Scribe & Break System |
| Scribing force range | 10–80 g (constant-weight mechanism, optional auxiliary weights) |
| Diamond scribe tip | adjustable angle and rotational orientation |
| Wafer chuck capacity | up to 4-inch diameter |
| Die size compatibility | 100 µm × 100 µm minimum to 10 mm × 10 mm maximum |
| Wafer thickness tolerance | ≥50 µm |
| XY stage resolution | 0.23 µm |
| Optical imaging system | 22″ TFT display + ultra-HD color camera |
| Digital zoom | ×10 electronic |
| Break mode | manual or programmable auto-actuation |
| Break mechanism | top rubber clamping + bottom linear blade actuation |
| Control interface | 7″ capacitive touchscreen |
| Y-axis scribing speed | 0.1–20 mm/s |
| Power supply | 100/230 VAC, 1 kW |
| Pneumatic supply | 70 psi |
| Vacuum requirement | full vacuum (100%), 15 L/min flow rate |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm (25 × 32 × 60 in) |
| Weight | 70 kg |