Physical Vapor Deposition Equipment
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| [Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | APD |
| Vacuum Chamber Dimensions | 400 × 400 × 300 mm (L×W×H) |
| Pumping System | 450 L/s Turbomolecular Pump |
| Plasma Source | Up to 3 Configurable Arc Cathodes |
| Operating Pressure Range | High Vacuum to Low-Pressure Reactive Gases (N₂, O₂, H₂, Ar) |
| Target Geometry | Cylindrical or Tubular, Ø10 mm × 17 mm |
| Target Resistivity | < 0.01 Ω·cm |
| Energy Storage Capacitance | 360 µF × 5 (Optional Expansion) |
| Pulse Frequency | 1–5 Hz |
| Discharge Voltage | 70–400 V (Max 150 V at 1800 µF) |
| Human-Machine Interface | Integrated Touchscreen Control Panel |
| Powder Collection Module (APD-P) | Ø95 mm × 30 mm Vessel, 1–50 rpm Rotation, Yield: 13–20 cm³/h (Density- and Size-Dependent) |
| Thin-Film Configuration (APD-S) | Uniform Deposition on 2-inch Substrates] |
| Brand | Angstrom Engineering |
|---|---|
| Origin | Canada |
| Model | Amod |
| Base Plate Size | 500 mm × 500 mm |
| Max. Source Capacity | 8 |
| Vacuum Capability | UHV-compatible (≤1×10⁻⁹ Torr base pressure) |
| Deposition Methods | DC/RF/Pulsed DC/HIPIMS Sputtering, Thermal Evaporation, E-beam Evaporation, Reactive Sputtering, Plasma & Ion Beam Surface Treatment |
| Substrate Handling Options | Heated/Cooled Stages, Variable-Angle Rotation, Planetary Motion, Dome & Masking Fixtures, Substrate Biasing |
| Control System | Aeres™ Software with Recipe Management, Real-time Rate Monitoring, and Torque-Sensing Crucible Indexing |
| Brand | Angstrom Engineering |
|---|---|
| Origin | Canada |
| Model | Box-Type PVD Coater |
| Substrate Range | 100 mm – 1200 mm |
| PVD Process Compatibility | Thermal Evaporation, Electron Beam Evaporation, Sputtering (DC/RF/Magnetron), Pulsed Laser Deposition (PLD) |
| Vacuum Capability | Optional Ultra-High Vacuum (UHV) Configuration (≤1×10⁻⁹ Torr base pressure) |
| Application Domain | Microelectronics, Thin-Film Optics, MEMS, Quantum Devices, R&D Prototyping |
| Brand | Angstrom Engineering |
|---|---|
| Origin | Canada |
| Model | COVAP |
| Vacuum Pumping | Turbo-molecular pump system |
| Substrate Size Range | Up to 1200 mm (customizable) |
| Deposition Technologies | DC/RF/MF/Pulsed DC sputtering, thermal evaporation (boat/wire/crucible), electron beam evaporation, reactive sputtering, ion-assisted deposition |
| Plasma & Ion Beam Sources | Integrated glow discharge plasma cleaning, broad-beam ion sources for substrate pre-treatment and film densification |
| Film Thickness Monitoring | Isolated quartz crystal microbalance (QCM) sensors with cross-source interference mitigation |
| Automation | Recipe-driven multi-layer deposition control (sequential or co-deposition), programmable substrate rotation/tilt/heating |
| Integration Readiness | Glovebox-compatible design, modular chamber architecture |
| Compliance | Designed for GLP/GMP-aligned lab environments |
| Brand | Angstrom |
|---|---|
| Origin | Canada |
| Model | EvoVac |
| Chamber Dimensions | 500 mm × 700 mm substrate stage |
| Vacuum capability | UHV-compatible (≤1×10⁻⁹ Torr base pressure) |
| Source options | RF sputtering, DC sputtering, Pulsed DC sputtering, HIPIMS, reactive sputtering |
| Cathode configurations | circular, linear, and cylindrical |
| Application domain | microelectronics |
| Brand | Angstrom Engineering |
|---|---|
| Origin | Canada |
| Model | Nexdep |
| Substrate Size | 6-inch (150 mm) |
| Chamber Dimensions | 400 × 400 × 500 mm (L×W×H) |
| Base Pressure | <5 × 10⁻⁷ Torr |
| Vacuum Gauging | Inficon MPG400 (3.75 × 10⁻⁹–760 Torr) |
| Roughing Pump | Oil-sealed rotary vane pump, ≥9 cfm |
| High-Vacuum Pump | Turbomolecular pump, ≥685 L/s |
| Evaporation Source | Resistive-heated metal source, 2.5 kW max power, SCR-controlled |
| Thickness Monitor | Water-cooled quartz crystal microbalance (QCM) probe with rigid mounting |
| Sample Stage | Motorized rotation (10–30 rpm), tilt-free horizontal design, shutter-integrated |
| Chamber Sealing | Dual O-ring sealed front sliding door and rear hinged door with integrated anti-coating viewport |
| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Model | CY-MSV325-II |
| Instrument Category | DC Magnetron Sputtering System |
| Application Field | Microelectronics |
| Substrate Diameter | 100 mm |
| Maximum Substrate Temperature | 500 °C |
| Base Pressure | ≤1.0 × 10⁻⁵ Pa |
| Power Supply | Dual 500 W DC |
| Target Configuration | Two Independent 1" or 2" Magnetron Sources |
| Vacuum Chamber | Ø325 mm × 500 mm, SUS304 Stainless Steel |
| Sample Stage | Ø150 mm, Heated (up to 600 °C, ±1 °C stability), Rotatable (0–20 rpm) |
| Gas Control | Standard 1-channel MFC (Ar, 200 SCCM), Optional up to 4-channel MFC |
| Vacuum Pumping | Turbo-molecular pump system (600 L/s nominal speed), Integrated solenoid-valve gas ballast for venting without pump shutdown |
| Optional In-situ Monitoring | Quartz Crystal Thickness Monitor (0.10 Å resolution) |
| Dimensions (W×D×H) | 540 × 540 × 1000 mm |
| Weight | 145 kg |
| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Equipment Type | DC Magnetron Sputtering Coater |
| Application Field | Microelectronics |
| Substrate Diameter | 100 mm |
| Maximum Substrate Temperature | 500 °C |
| Base Vacuum | 1.0 × 10⁻⁴ Pa |
| Chamber Material | High-Purity Fused Quartz |
| Chamber Dimensions | Ø180 mm × 200 mm |
| Observation Window | Full-360° Transparent Quartz Viewport |
| Target Size | Ø50 mm (2-inch), Thickness ≤ 3 mm |
| DC Power Supply | 300 W, Adjustable |
| Pumping Speed | Turbo Molecular Pump — 600 L/s |
| Vacuum Gauge | Composite Gauge (10⁻⁵–10⁵ Pa) |
| Sample Stage | Rotating & Heated |
| Interface | Intuitive Modular Control Panel |
| Overall Dimensions | 550 mm × 350 mm × 1200 mm |
| Total Power Consumption | 2 kW |
| Brand | Moorfield |
|---|---|
| Origin | UK |
| Model | MiniLab |
| Vacuum Base Pressure | 5×10⁻⁷ mbar |
| Maximum Substrate Diameter | 11 inches |
| Deposition Techniques | Thermal Evaporation, Low-Temperature Organic Evaporation, Magnetron Sputtering, Electron Beam Evaporation |
| Chamber Configurations | Front-Loading Box, Top-Hinged Bell Jar, Glovebox-Compatible Dual-Door, Tall-Aspect-Ratio Vertical |
| Compliance | ISO 9001–Certified Manufacturing, GLP-Ready Architecture, FDA 21 CFR Part 11–Compatible Software Options Available |
| Brand | Moorfield |
|---|---|
| Origin | UK |
| Model | oPVD S10A, oPVD S10A-WA, oPVD T15A |
| Vacuum Base Pressure | <5×10⁻⁷ mbar |
| Substrate Size | up to 8 inches (S10A-WA), up to 4 inches (S10A & T15A) |
| Substrate Heating | up to 500 °C |
| Target Compatibility | 2-inch water-cooled magnetron sputtering targets (S10A/S10A-WA) |
| Gas Control | up to 3 MFC-controlled process gases (Ar, O₂, N₂) |
| Deposition Modes | DC/RF magnetron sputtering, reactive sputtering, co-sputtering, resistive/low-temperature organic evaporation |
| Film Uniformity | high across full substrate area |
| Cleanroom-Compatible Design | yes |
| Software | integrated touchscreen HMI with programmable recipes, audit-trail-capable control logic |
| Brand | Nano-Master |
|---|---|
| Origin | USA |
| Manufacturer | Nano-Master, Inc. |
| Type | Magnetron Sputter Deposition System |
| Substrate Size | 6-inch (152 mm) |
| Maximum Substrate Temperature | 700 °C |
| Thickness Uniformity | <1% (1σ, across 6″ wafer) |
| Base Pressure | ≤1 × 10⁻⁷ Torr |
| Pumping Speed | 260 L/s Turbo Molecular Pump (optional) |
| Power Supplies | 1 kW DC + 300–600 W RF (13.56 MHz) |
| Magnetron Configuration | Up to 3 off-axis planar magnetrons |
| Chamber | 14″ cubic aluminum vacuum chamber with viewport |
| Control Interface | LabVIEW-based PC control with multi-level password protection and full interlock safety architecture |
| Brand | Shenyang K.Y. |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | PVD400 |
| Instrument Type | Magnetron Sputtering Coater |
| Application Field | Microelectronics |
| Substrate Size | Ø100 mm (1 × 4-inch wafer) |
| Targets | Three Ø50.8 mm (2-inch) Permanent-Magnet DC/RF Sputtering Targets |
| Maximum Substrate Temperature | 800 °C |
| Thickness Uniformity (within wafer) | ≤ ±3% |
| Base Vacuum | ≤ 6.6 × 10⁻⁵ Pa |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | Co-Sputter |
| Instrument Type | Magnetron Sputtering Deposition System |
| Substrate Size | 12-inch (300 mm) |
| Substrate Temperature Range | Up to 1000 °C |
| Film Thickness Uniformity | ±3% |
| Base Pressure | 1×10⁻⁸ Torr |
| Sputter Sources | Up to 8 magnetron cathodes |
| Power Options | DC, Pulsed DC, RF |
| Gas Lines | Up to 4 mass flow controlled lines |
| Optional KRI Ion Source | Yes |
| Load-Lock Configuration | Single- or multi-wafer compatible |
| Vacuum Sealing | All-CF flanged, bakeable |
| Process Monitoring | Full-range vacuum gauges + Baratron capacitance manometer |
| Compliance | Designed for GLP/GMP-aligned thin-film R&D environments |
| Brand | SYSKEY |
|---|---|
| Origin | Taiwan |
| Model | E-beam |
| Instrument Type | Electron Beam Evaporator |
| Substrate Size | Up to 12-inch wafer |
| Substrate Temperature Range | Ambient to 800 °C (heating) / Down to –70 °C (liquid nitrogen cooling) |
| Thickness Uniformity | ±3% |
| Base Pressure | ≤5×10⁻¹⁰ Torr (with cryopump) |
| Crucible Configuration | 1–6 water-cooled rotating crucibles (7–25 cc each) |
| Optional Integration | KRI ion source, load-lock, transfer chamber, glovebox, plasma cleaner |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | FPD-PVD |
| Instrument Type | Magnetron Sputtering Coater |
| Substrate Size | Up to 12-inch (300 mm) wafers or 550 × 650 mm² glass panels |
| Base Pressure | ≤1×10⁻¹⁰ Torr |
| Substrate Temperature Range | Ambient to 1000°C (with high-temp heating stage option) |
| Thickness Uniformity | ±3% across full substrate |
| Configurable Chamber Count | 4 independent sputter chambers |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China (Taiwan) |
| Model | In-Line Sputter |
| Instrument Type | Magnetron Sputtering Deposition System |
| Application Field | Microelectronics |
| Maximum Substrate Size | 1100 × 1300 mm² (glass) |
| Substrate Temperature Range | Up to 400 °C |
| Film Thickness Uniformity | ±5% |
| Ultimate Vacuum | 10⁻⁷ Torr |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | Lift-Off E-beam |
| Instrument Type | Electron Beam Evaporator |
| Application Domain | Microelectronics |
| Substrate Diameter | 12-inch (300 mm) |
| Maximum Substrate Temperature | 800 °C |
| Film Thickness Uniformity | ±3% |
| Base Pressure | 10⁻⁸ Torr |
| Cooling Options | Water-cooled or Liquid Nitrogen-cooled Substrate Holder (down to –70 °C) |
| Source Configuration | Multi-pocket e-beam gun (1/2/4/6 pockets) |
| Deposition Modes | Sequential or Co-evaporation |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | Metal Thermal |
| Instrument Type | Thermal Evaporation Coater |
| Application Field | Solar Cells, Nanomaterials, Metal Thin Film Research |
| Substrate Size | Up to 12-inch wafer or 470 × 370 mm² glass |
| Substrate Temperature Range | Ambient to 800 °C |
| Thickness Uniformity | ±3% |
| Base Pressure | ≤1×10⁻⁸ Torr |
| Vacuum Sealing | Nickel gasket + Viton O-rings |
| Evaporation Sources | Multiple configurable boat/crucible sources (7–25 cc) |
| Substrate Manipulation | Rotatable heated stage, adjustable source-to-substrate distance, individual shutters per source |
| Optional Integration | KRI ion source (for in-situ substrate cleaning and film densification), load-lock, glovebox interface, RGA, e-beam assist |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Equipment Type | Magnetron Sputter Deposition System |
| Substrate Size | Up to 300 mm (12-inch) |
| Base Pressure | ≤1×10⁻⁸ Torr |
| Substrate Temperature Range | Ambient to 600 °C |
| Thickness Uniformity | ±3% (across 300 mm wafer) |
| Sputter Sources | Up to 6 configurable magnetron cathodes (RF/DC/pulsed DC) |
| Gas Lines | Up to 4 mass flow controllers (Ar, N₂, O₂) |
| Substrate Motion | Planetary rotation + independent rotation |
| Optional Integration | KRI ion source, load-lock, RGA/OES ports, RF bias, film thickness monitor |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | OLED, OPV |
| Instrument Type | Thermal Evaporation Coater |
| Substrate Size | Up to 12-inch wafer or 470 × 370 mm |
| Thickness Uniformity | ±3% |
| Evaporation Source Control Resolution | 0.01 Å/s |
| Source Temperature Stability | ±0.1 °C |
| Alignment Accuracy (CCD-based mask-to-substrate) | ±5 µm |
| Base Pressure | ≤5 × 10⁻⁷ Torr |
| Chamber Material | 304 Stainless Steel |
| Max. Evaporation Sources | 12 |
| Cooling | External Water-Cooled Jacket |
| Integration Options | Load-lock transfer chamber, robotic handler, glovebox interface, RGA |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | Organic Material |
| Instrument Type | Thermal Evaporation Coater |
| Application Field | Microelectronics |
| Substrate Size | 12-inch (300 mm) wafer or 470 × 370 mm² glass |
| Substrate Temperature Range | Up to 800 °C |
| Film Thickness Uniformity | ±3% |
| Ultimate Vacuum | 5 × 10⁻⁹ Torr |
| Brand | SYSKEY |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Instrument Type | Electron Beam Evaporator |
| Substrate Diameter | Up to 8 inches (203 mm) |
| Substrate Temperature Range | –70 °C (LN₂ cooling) to +800 °C |
| Thickness Uniformity | ±3% |
| Base Pressure | ≤5×10⁻¹⁰ Torr |
| E-beam Source Configuration | 4–6 crucibles (7–25 cm³ each) |
| Vacuum Sealing | All-metal CF flanges with bakeable elastomer O-rings |
| Pumping System | Cryopump (standard), optional turbomolecular pump |
| Process Monitoring | Bayard-Alpert gauge + quartz crystal microbalance (QCM) |
| Control Mode | Sequential or co-evaporation |
| Compliance | Designed for GLP/GMP-aligned thin-film R&D environments |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Model | UHV Sputter |
| Baseplate Size | Up to 12-inch (300 mm) wafers |
| Substrate Temperature Range | Ambient to 1000 °C |
| Film Thickness Uniformity | ±3% |
| Ultimate Vacuum | ≤5×10⁻¹⁰ Torr |
| Sputter Sources | Up to 8 configurable magnetron cathodes (RF/DC/pulsed DC) |
| Gas Lines | Up to 4 mass flow-controlled channels (Ar, N₂, O₂, etc.) |
| Chamber Sealing | All-metal ConFlat (CF) flanges, bakeable to 150 °C |
| Substrate Manipulation | Motorized rotation with ceramic bearing & internal water cooling |
| Optional Integration | Load-lock, transfer chamber, glovebox, ion source (100 keV Kr⁺), e-beam evaporation, RGA/OES ports |
| Brand | Vector Scientific |
|---|---|
| Origin | Guangdong, China |
| Model | SLKX-102-11 |
| Film Thickness Uniformity | ≤±2.5% over 4-inch wafer area, ≤±3.5% over 8-inch wafer area (measured on Ti film, 200–500 nm, edge exclusion of 5 mm, 5-point random sampling) |
| System Architecture | Interconnected multi-chamber PVD platform with load-lock and transfer robot |
| Base Pressure | ≤5×10⁻⁸ Torr (typical, after bake-out) |
| Chamber Interface Standard | CF flanges (DN100/DN160 compatible) |
| Target-to-Substrate Distance | Externally adjustable manually |
| Control Architecture | Modular PLC + real-time OS with role-based user permissions |
| Compliance | Designed to support GLP/GMP-aligned process documentation |
| Brand | VSParticle |
|---|---|
| Origin | Netherlands |
| Model | VSP-P1 |
| Target Materials | Conductive metals and alloys |
| Substrate Size | 10 mm (monodisperse deposition), 47 mm (filter-based deposition) |
| Substrate Temperature | Ambient (~25 °C) |
| Film Thickness Uniformity | 0–20 nm (monodisperse nanoparticle deposition) |
| Base Pressure | 0.8–1.2 bar (note: this is *absolute pressure*, not vacuum level |