Other Wafer Defect Detection Instruments
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| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 1012 |
| Pricing | Upon Request |
| Wafer Diameter | 200 mm, 300 mm |
| Accuracy | ±0.1 µm |
| Resolution | 10 nm |
| Spatial Resolution | 1 mm |
| Max Scan Passes | 8 |
| Software | MX-NT |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 1018 |
| Pricing | Upon Request |
| Wafer Diameters | 200 mm, 300 mm, 450 mm |
| Measurement Accuracy | ±0.3 µm |
| Vertical Resolution | 10 nm |
| Lateral Spatial Resolution | 1 mm |
| Scan Profiles | Up to 8 radial scans (standard: 4 at 45° intervals) |
| Software Platform | MX-NT |
| Measurement Types | Single-point thickness, full-surface TTV, bow, warp, site flatness |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 102-6 / MX 102-8 |
| Wafer Diameter Support | 100 mm, 125 mm, 150 mm, 200 mm |
| Measurement Accuracy | ±0.1 µm |
| Resolution | 10 nm |
| Spatial Resolution | 1 mm |
| Scan Profiles | 4 radial profiles at 45° intervals |
| Software | MX-NT |
| Application | Thickness & TTV metrology post-grinding and post-lapping |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 2012 |
| Pricing | Available Upon Request |
| Wafer Diameter | 300 mm (configurable for 200 mm) |
| Measurement Accuracy | ±0.5 µm |
| Resolution | 50 nm |
| Thickness Range | 500–1000 µm |
| Measurement Points | 69 |
| TTV (Total Thickness Variation) | Supported |
| Bow & Warp | Supported |
| Stress Evaluation | Optional |
| Measurement Orientation | Vertical (gravity-compensated) |
| Automation Level | Semi-automated (manual load/unload, automated measurement cycle) |
| Software | MX-NT |
| Sensor Principle | Capacitive displacement sensing |
| Probe Architecture | Dual orthogonal aluminum plates (1″ thick), each embedded with 69 capacitive sensors |
| Positioning Repeatability | ≤0.1 µm |
| Vacuum Fixture | Triple-circuit independent vacuum suction with dielectric-compensated polymer membrane |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 204 |
| Pricing | Available Upon Request |
| Wafer Diameter | 100 mm, 125 mm, 150 mm, 200 mm, 300 mm |
| Thickness Accuracy | ±0.5 µm to ±1.0 µm |
| Thickness Resolution | 75 nm to 1.0 µm |
| Thickness Range | 100–1000 µm |
| Measurement Principle | Dual-Sided Capacitive Sensing |
| Measured Parameters | Thickness, Total Thickness Variation (TTV), Bow, Warp, Surface Flatness, Stress-Induced Deformation |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 301 |
| Wafer Diameters Supported | 50 mm, 75 mm, 100 mm, 150 mm, 200 mm, 300 mm |
| Thickness Accuracy | ±0.5 µm |
| Resolution | 10 nm |
| Dynamic Range | 800 µm |
| Standard Thickness Range | 0–1600 µm |
| Measurement Principle | Dual-Sided Capacitive Distance Sensing |
| Calibration Method | Certified Gauge Blocks |
| Output Interface | RS-232 Serial Interface |
| Display | 5-Digit LED |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 7012 |
| Pricing | Upon Request |
| Brand | Endress+Hauser Metrology |
|---|---|
| Country of Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | MX 203 |
| Pricing | Upon Request |
| Wafer Diameter Range | 50 mm – 450 mm (2″ – 18″) |
| Thickness Accuracy | ±0.5 µm |
| Thickness Resolution | 50 nm |
| Thickness Measurement Range | 100 µm – 1000 µm |
| Measurement Principle | Dual-Sided Capacitive Sensing |
| Automation Level | Manual Operation |
| Compatible Substrates | Si, SiC, GaN, GaAs, InP |
| Brand | k-Space |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | kSA 400 |
| Pricing | Upon Request |
| Brand | Kainova |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Product Category | Domestic (Taiwan-made) |
| Model | KAR-211 |
| Pricing | Upon Request |
| Load Ports | 2–8 configurable |
| Motion Control | 5-axis dual-end-effector robot |
| Wafer Compatibility | 200 mm (8″), 300 mm (12″), and thinned wafers (≤725 µm) |
| Dual-Side Wafer ID Reading | OCR + barcode (SEMI P17 compliant) |
| Interface Standards | SECS/GEM v2.0, SEMI E84 OHT Handshake Protocol |
| Cleanroom Certification | ISO Class 3 (FS-209E Class 1) |
| Throughput | ≥700 WPH |
| Positioning Accuracy | ±0.05 mm |
| Airflow Design | FFU-controlled laminar downflow with CFD-validated uniform velocity profile (0.45 ±0.05 m/s) |
| Safety & Compliance | SEMI S2-0215 Certified |
| Brand | Kainova |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Taiwan |
| Model | Kainova Tech KAS-381 / KAS-382 / KAP-541 |
| Pricing | Upon Request |
| Maximum Cassette Capacity (KAS-381) | 87 FOUPs (2175 wafers) |
| Throughput | ≥180 WPH |
| Cleanroom Classification | ISO Class 4 (FS-209E Class 10) |
| Compatible Wafer Sizes | 200 mm and 300 mm |
| Substrate Compatibility | Standard and thinned wafers |
| Operating Environment | Nitrogen-purged (KAS-381/KAS-382) |
| Cassette Handling | Fully automated lid actuation, dual-lane unpacking/packing, recipe-driven sorting, batch merging/splitting, and Wafer ID–based routing |
| Brand | KAINOVA |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Asia-Pacific Sourced |
| Model | Kainova Tech – Microcontamination Control Solution |
| Pricing | Available Upon Request |
| Brand | Photonic Lattice |
|---|---|
| Origin | Japan |
| Model | PA-300-XL |
| Measurement Wavelength | 520 nm |
| Birefringence Range | 0–130 nm |
| Minimum Resolution | 0.001 nm |
| Repeatability | <0.1 nm |
| Field of View (Standard) | 40×48 mm to 240×320 mm |
| Polarization Camera | 2056×2464 pixels |
| Output Parameters | Retardance [nm], Fast-Axis Orientation [°], Stress-Converted Value [MPa] (optional) |
| Optional Modules | Real-time Analysis Software, Lens Aberration Analysis Software, External Control Interface, Interchangeable Lens Kits |
| Brand | ZENO |
|---|---|
| Origin | Shanghai, China |
| Model | PULSAR L-Series & PULSAR H-Series |
| Category | Semiconductor Wafer Defect Detection Instrument |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (China) |
| Pricing | Upon Request |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | CC Series |
| Cooling Option | Optional Water-Cooled FXT 160.51 X-ray Tube |
| Detector Modes | Standard & Low-Dose Mode |
| Software Suite | micro3Dslice, FF CT, VoidInspect, eHDR Dynamic Enhancement Filters |
| Load Capacity (Optional) | < 20 kg |
| Voltage Range | Optimized for Low-Voltage High-Resolution Imaging (≤ 160 kV) |
| Compliance | Designed for ISO/IEC 17025-aligned QA workflows, supports GLP/GMP audit trails via software logging |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF Series |
| Operating Voltage | Up to 600 kV |
| Detector | 3-Line Detector Array (LDA) with 254 µm pixel pitch |
| Dynamic Range | High |
| Signal-to-Noise Ratio | Exceptional |
| Scan Modes | 2D, 3D, Helical (HeliExtend), Field-of-View Extension (Horizontal/Vertical), Virtual Rotation Axis |
| Image Enhancement | ScatterFix 2.0, Beam Hardening Correction (BHC), Metal Artifact Reduction (MAR) |
| Applications | R&D material analysis, dimensional metrology, failure analysis, assembly verification, digital dissection |
| Sample Compatibility | Aluminum, steel, superalloys, AM parts, Li-ion battery cells/modules/systems, CFRP, injection-molded plastics, cultural heritage objects, geological/paleontological/biological specimens, mechatronic assemblies |