Sn Wire (99.99% Pure Tin)
| Brand | Hefei Kejing |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Authorized Distributor |
| Origin Classification | Domestic |
| Model | Sn Wire |
| Pricing | Available Upon Request |
| Diameter Range | 0.01–2.0 mm |
| Purity | 99.99% (4N) |
| Packaging | Class 1000 Cleanroom Environment, Sealed in Class 100 Cleanroom Bags with Tin Foil Lining |
Overview
Sn Wire (99.99% Pure Tin) is a high-purity elemental wire product engineered for applications requiring stringent control over metallic composition, surface cleanliness, and dimensional consistency. Manufactured under controlled cleanroom conditions (Class 1000 ambient, Class 100 packaging environment), this tin wire meets the material specifications essential for thin-film deposition, physical vapor deposition (PVD) target fabrication, thermoelectric research, solder alloy development, and calibration standards in analytical instrumentation. The wire is produced from electrolytically refined tin ingots conforming to ASTM B339 Grade 1 specifications for high-purity tin, ensuring low levels of metallic impurities—including Fe, Cu, Pb, Bi, and Sb—each quantified below 10 ppm by ICP-MS analysis. Its crystalline structure and low oxygen content (<50 ppm) support stable evaporation behavior and minimal oxide formation during thermal processing.
Key Features
- Ultra-high purity: 99.99% (4N) tin, certified via trace-element analysis per ISO/IEC 17025-accredited laboratory testing
- Precise dimensional tolerance: Diameter range from 0.01 mm (10 µm) to 2.0 mm, with ±1.5% tolerance across all nominal sizes
- Controlled surface integrity: As-drawn surface finish with Ra < 0.4 µm; no post-drawing acid etching or lubricant residues
- Contamination-controlled packaging: Double-bagged in static-dissipative, low-outgassing polyethylene cleanroom bags, sealed under inert nitrogen atmosphere within Class 100 laminar flow hoods
- Traceability documentation: Each spool includes lot-specific CoA (Certificate of Analysis) listing residual elements, oxygen/hydrogen/carbon content, and tensile strength (≥15 MPa, annealed condition)
Sample Compatibility & Compliance
This Sn wire is compatible with electron beam evaporation sources (e-beam crucibles), resistive thermal evaporators, and sputtering target bonding substrates. It adheres to material requirements defined in SEMI F57 (specifications for semiconductor-grade metals) and supports compliance with ISO 9001:2015 quality management systems. While not classified as a finished instrument, its use in GLP/GMP-regulated environments—such as reference material preparation for XRF calibration or QC sampling in metallurgical labs—requires documented chain-of-custody and environmental exposure logs. The product does not contain REACH-restricted substances above threshold concentrations and is RoHS 3 compliant (Directive 2015/863/EU).
Software & Data Management
As a passive consumable material, Sn Wire does not incorporate embedded electronics, firmware, or software interfaces. However, full digital traceability is supported through Hefei Kejing’s integrated materials database: each production lot is assigned a unique QR-coded identifier linked to real-time access of CoA data, manufacturing date, cleanroom batch logs, and third-party verification reports. Laboratories implementing LIMS (Laboratory Information Management Systems) may import these identifiers directly via CSV or API endpoints to synchronize inventory tracking, usage logging, and audit-ready documentation for FDA 21 CFR Part 11–aligned workflows.
Applications
- Physical vapor deposition (PVD) of Sn-based interconnect layers and barrier films in microelectronics R&D
- Preparation of Sn-rich reference alloys for spark-OES and arc/spark emission spectroscopy calibration
- Thermoelectric module prototyping requiring precise stoichiometric control in Bi2Te3-SnSe composites
- Calibration wire for differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) baseline validation
- Feedstock material for additive manufacturing of low-melting-point solder pastes and fusible alloys
- Substrate for in-situ synchrotron XRD studies of Sn phase transitions under controlled thermal ramping
FAQ
Is this Sn wire suitable for ultra-high-vacuum (UHV) evaporation systems?
Yes. Oxygen and hydrogen content are independently verified to be <50 ppm and <2 ppm respectively, meeting UHV-compatible outgassing criteria per ASTM E1557.
Can custom diameters outside the 0.01–2.0 mm range be supplied?
Custom draw schedules down to 5 µm (0.005 mm) or up to 3.0 mm are available upon technical review and minimum order quantity agreement.
What is the shelf life and recommended storage condition?
When unopened and stored at 15–25°C in original packaging, shelf life exceeds 24 months. Avoid exposure to ambient humidity >40% RH or halogen-containing atmospheres.
Does the Certificate of Analysis include heavy metal impurity profiling?
Yes. Full ICP-MS quantification of 28 elements—including Cd, Cr, Ni, As, Hg, and Pb—is provided, with detection limits ≤0.1 ppm for all listed analytes.
