Assembly & Packaging Equipment
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| Brand | TSD |
|---|---|
| Model | IVG Series |
| Origin | Beijing, China |
| Type | Semi-Automatic Dual-Axis Wafer Thinning System |
| Maximum Wafer Size | 200 mm (IVG-2020) / 300 mm (IVG-3020) |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Chuck Rotation Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Range | 0–4800 µm |
| Thickness Repeatability | ±1 µm |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Model | IVG-2040 / IVG-3040 |
| Max Wafer Size | 200 mm (8") / 300 mm (12") |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Table Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Repeatability | ±0.001 mm |
| In-Line Thickness Range (OMM) | 0–4800 µm |
| Integrated Auto Load/Unload | Yes |
| Non-Contact Gauging (NCG) | Optional |
| Brand | UniTemp |
|---|---|
| Origin | USA |
| Model | 2Z-HVS-200 |
| Vacuum Level | ≤1×10⁻⁶ hPa |
| Max Temperature | 450 °C |
| Programmable Steps | 100 per Recipe, 20 Recipes Stored |
| Optical Process Monitoring | 360° Quartz Viewing Cylinder |
| Cooling | Active Water-Cooled Lower Platen + External Closed-Loop Chiller Recommended (Optional Accessory WC-I) |
| Controller | Siemens SIMATIC® S7-1200 PLC with HMI Interface |
| Data Logging | Real-Time Temperature, Pressure, Gas Flow, and Time Stamping |
| Brand | UniTemp |
|---|---|
| Model | VSS-300 |
| Origin | Germany |
| Chamber Dimensions | 350 × 350 × 75 mm (expandable to 300 mm height) |
| Max Ramp-Up Rate | 150 K/min |
| Max Ramp-Down Rate | 120 K/min |
| Bottom Heating Power | 2 × 12-lamp arrays, 18 kW total |
| Cooling | Water-cooled graphite plate (310 × 310 mm) |
| Control System | SIMATIC PLC with 7" touchscreen HMI |
| Programmable Steps | 50 programs × 50 steps each |
| Process Gas Flow | Standard 1.5 sL/min MFC (up to 4 gas lines optional) |
| Vacuum Options | MPC (10 hPa) or RVP (10⁻³ hPa) |
| Power Supply | 3-phase + N + PE, 230 V, CEE 3×32 A |
| Weight | ~140 kg |
| Compliance | Designed for ISO 9001-compliant SMT manufacturing environments |
| Enclosure Material | Polished aluminum chamber walls (stainless steel optional) |
| Brand | Westech |
|---|---|
| Origin | USA |
| Model | 7476D |
| Bonding Angle Options | 45° & 90° (deep cavity) |
| Wire Diameter Range | 18–100 µm |
| Ribbon Dimensions | 0.0005 × 0.010 in or 0.001 × 0.010 in |
| Ultrasonic Power Output | 4 W |
| Bonding Force Control | Dual-range, programmable |
| Heating | Resistive tool heating |
| Motion Control | Direct-drive motor with programmable tail control |
| Platform | Adjustable height (0.625 in), 12 × 12 in |
| Display | LCD interface |
| ESD Protection | Standard |
| Deep Cavity Capability | ≥13 mm (1 in optional) |
| Software | Multi-device recipe storage |
| Compliance | ESD-safe architecture, designed for Class 100/ISO 5 cleanroom integration |
| Brand | XinSheng Technology |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (PRC) |
| Model | XSM-FA100 |
| Pricing | Available Upon Request |