Automatic Optical Inspection Equipment
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| Key | Origin: Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | Eagle-I |
| Inspection Speed | 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | CAMTEK Eagle-I / Eagle-AP / EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Throughput | Up to 50 million bump measurement points per wafer |
| 2D Detection Resolution | 0.2 µm |
| 3D Height Measurement Accuracy | ±0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Feature Size | 2 µm bump / 2 µm line width |
| Defect Sensitivity | Down to 0.2 µm surface anomalies |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Speed | Up to 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Line Width/Spacing | 2 µm (post-RDL) |
| Defect Detection Limit | 0.2 µm surface anomalies |
| Compatible Substrates | Flat and warped wafers, square dies, compound semiconductor substrates |
| Brand | Camtek / FRT |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | MicroProf®100 |
| Detection Speed | Up to 50 million measurement points per wafer |
| 2D Lateral Resolution | 0.2 µm |
| 3D Vertical Height Accuracy | ±0.05 µm (measuring range: 2–100 µm) |
| Dual-Sided Measurement Capability | Yes (TTV/Bow/Warp/TIR/LTV) |
| Optical Principle | White-light Interferometry & Chromatic Confocal Sensing |
| Optional IR Sensor | Integrated for backside thickness monitoring of Si, GaAs, InP, SiC, GaN wafers |
| Compliance | SEMI Standard-compliant dual-probe architecture |
| Form Factor | Compact benchtop metrology platform |
| Brand | Onto Innovation |
|---|---|
| Model | Dragonfly® G3 |
| Origin | Malaysia |
| Equipment Type | Inline AOI for Front-End & Advanced Packaging |
| Minimum Detectable Line Width/Spacing | 0.7 µm |
| Wafer Size Support | 100 mm – 330 mm |
| Maximum Substrate Area | >6400 mm² |
| 翘曲晶圆 & Taiko Handling | Supported |
| Imaging Modes | Brightfield, Darkfield, Oblique Illumination, IR Transmission |
| 3D Metrology | Truebump® (Multi-Modal 3D Profilometry) |
| Residue Detection | Clearfind® |
| Software Platform | nLINE™ with Real-Time Analysis, Offline Review, and Exploratory Bump-Level Data Analytics |
| Compliance Framework | Supports ASTM F2598 (Wafer Defect Classification), ISO 14644-1 (Cleanroom Integration), and GLP/GMP-aligned Audit Trail Logging |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | DSM8/200 Gen2 |
| Measurement Principle | Dual-microscope optical alignment metrology with TIS-compensated image registration |
| Accuracy | ≤ 0.2 µm (after TIS compensation) |
| Configuration Options | Manual loading (DSM8 Gen2) / Robotic handling with custom chuck (DSM200 Gen2) |
| Illumination Options | Visible + optional IR illumination (for through-silicon feature imaging) |
| Software Platform | Cognex PatMax®-powered automated image analysis with recipe-driven operation |
| Compliance Context | Designed for GLP/GMP-aligned semiconductor process development and high-reliability packaging workflows |