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| Brand | Beam Convergence |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Direct Manufacturer |
| Model | GVC5000T |
| Dimensions | 480(L)×390(D)×460(H) mm |
| Power Supply | 220 VAC / 1200 W |
| Sputtering Target Diameter | φ57 mm |
| Sputtering Current Range | 5–200 mA |
| Sputtering Time Range | 0–999 s |
| Evaporation Source | φ0.8 mm Carbon Fiber |
| Evaporation Sources | 1–4 units |
| Evaporation Modes | Continuous & Pulsed |
| Vacuum Chamber | Borosilicate Glass, φ200×130 mm |
| Base Pressure | <5×10⁻³ Pa |
| Pumping Speed | 90 L/s (Turbo) + 1.1 L/s (Rotary) |
| Pump-Down Time | ≤5 min to 5×10⁻³ Pa |
| Human-Machine Interface | 7-inch TFT Color Touchscreen |
| Maximum Sample Stage Diameter | φ125 mm |
| Pre-Sputtering | Integrated Automatic Baffle |
| Protection Features | Overcurrent, Vacuum Interlock, Turbo Pump Thermal Protection |
| Anti-Contamination Design | Dual-Isolation Architecture for Sputtering & Evaporation Modules |
| Optional Quartz Crystal Thickness Monitor | Real-time Thickness Display, Setpoint Control, Resolution: 0.1 nm, Range: 1–999 nm per cycle, Max. Measurable Thickness: 10 μm |
| Brand | Beam Convergence |
|---|---|
| Origin | Shenzhen, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic Plasma Surface Treater |
| Model | TSPL200MA |
| RF Frequency | 13.56 MHz |
| Maximum RF Power | 1000 W |
| Chamber Volume | 200 L |
| External Dimensions (W×D×H) | 1250 × 1250 × 1850 mm (excl. tri-color indicator light) |
| Chamber Tray Material | Stainless Steel |
| Gas Inlets | 2 independent mass flow-controlled channels |
| Control System | Fully Automated PLC-based Interface with Programmable Process Sequencing |
| Brand | Beam Convergence |
|---|---|
| Model | GVC2000 |
| Origin | Beijing, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Pricing | Upon Request |
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