Bonding Machine
Filter
Showing all 9 results
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model Series | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Maximum Wafer Size | 200 mm |
| Heating Range | Up to 650 °C |
| Bonding Chamber Vacuum | ≤1 × 10⁻⁵ mbar (with turbomolecular pump) |
| Control Interface | Windows-based HMI with full process logging |
| Compliance | Designed for GLP/GMP-aligned R&D and pilot-line environments |
| Automation Level | Semi-automatic (manual load/unload, fully automated alignment, activation, and bonding) |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04 & AWB-08 Platform |
| Vacuum Base Pressure | ≤1×10⁻⁶ mbar |
| Maximum Bonding Force | 40 kN |
| Maximum Temperature | 560 °C |
| Anodic Bonding Voltage | 0–2.5 kV DC (up to 40 mA) |
| Alignment Accuracy | ±1 µm (in-situ, hot or cold) |
| Compatible Wafer Sizes | 2″, 3″, 4″, 5″, 6″, and 8″ |
| Bonding Environments | High vacuum, UHV (optional), controlled process gas (e.g., forming gas), or atmospheric inert gas |
| Optical System | Dual CCD microscope with through-the-lens illumination, visible + infrared imaging, real-time side-by-side wafer alignment display |
| Control Architecture | Fully automated PC-based system with recipe-driven operation, full parameter logging (voltage, current, integrated charge, temperature, pressure, force, separation, event timestamps), SPC-compliant data export, and remote diagnostic capability via secure network interface |
| Brand | Analysis |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Bonder300 |
| Pricing | Available Upon Request |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Wafer Size Support | Up to 200 mm |
| Maximum Bonding Temperature | 650 °C |
| Heating Control | Independent top/bottom platen |
| Vacuum Level | ≤10⁻⁵ mbar (with turbomolecular pump) |
| Bonding Processes Supported | Anodic, Thermocompression, Eutectic, Glass Frit, Direct Si–Si, Intermediate Layer Adhesive, SOI, and Plasma-Activated Bonding |
| Automation Level | Semi-automatic (manual load/unload, fully automated bonding cycle) |
| Nanopatterning Capability | Integrated nanoimprint functionality |
| Brand | SET/Sensor Electronic Technology |
|---|---|
| Origin | Germany |
| Model | G5/2017 Series |
| Bonding Accuracy | ±0.5 µm |
| Bonding Methods | Thermocompression, Reflow Soldering, UV Curing |
| Compatible Materials | Au, Au/Sn, In, Cu, Cu/Sn |
| Applications | Flip-Chip, Die-to-Substrate (D2S), Chip-to-Chip (C2C), Chip-to-Substrate (C2S), MEMS, MOEMS, MCM, Photonic Integrated Circuits (PICs), Silicon Photonics, Optoelectronic Assembly |
| Brand | JFP |
|---|---|
| Origin | France |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | WB200e |
| Pricing | Upon Request |
| Brand | Osiris |
|---|---|
| Origin | Germany |
| Model | AFIXX 30s |
| Maximum Wafer Size | 200 mm |
| Temperature Range | Up to 650 °C (Independent Top/Bottom Plate Control) |
| Bonding Processes Supported | Thermal Compression, Adhesive Bonding, Glass Frit Bonding, Anodic Bonding, Eutectic Bonding, Direct Si–Si Bonding, SOI Bonding |
| Compatibility | Silicon, Compound Semiconductors (GaAs, SiC, GaN), Glass, Quartz, and SOI Wafers |
| System Architecture | Modular Bonding Chamber with In-Situ Alignment & Activation |
| Nanopatterning Capability | Integrated Nanoimprint Functionality |
| Compliance | Designed for GLP/GMP-aligned R&D and low-volume production environments |
| Operating Interface | Windows 10-based GUI with 22" Touchscreen HMI |
| Safety | Transparent Viewport Door for Real-Time Process Monitoring |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB100 |
| Bonding Types | Ball & Wedge |
| Wire Diameter Range | 17–75 µm |
| Ultrasonic Frequency | 63.3 kHz (PLL-controlled, optional 110 kHz) |
| Ultrasonic Power | 0–10 W |
| Bonding Force | 10–200 cN·mm |
| Z-Axis Resolution | 0.5 µm |
| X-Y Resolution | 0.1 µm |
| X-Y Travel | 90 mm |
| Z Travel | 100 mm |
| Heating Stage | Ø90 mm, up to 200 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions (W×D×H) | 620 × 750 × 680 mm |
| Weight | 72 kg |
| Brand | Westech |
|---|---|
| Origin | USA |
| Model | 7476D |
| Bonding Angle Options | 45° & 90° (deep cavity) |
| Wire Diameter Range | 18–100 µm |
| Ribbon Dimensions | 0.0005 × 0.010 in or 0.001 × 0.010 in |
| Ultrasonic Power Output | 4 W |
| Bonding Force Control | Dual-range, programmable |
| Heating | Resistive tool heating |
| Motion Control | Direct-drive motor with programmable tail control |
| Platform | Adjustable height (0.625 in), 12 × 12 in |
| Display | LCD interface |
| ESD Protection | Standard |
| Deep Cavity Capability | ≥13 mm (1 in optional) |
| Software | Multi-device recipe storage |
| Compliance | ESD-safe architecture, designed for Class 100/ISO 5 cleanroom integration |