Accretech (ACCRETECH)
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| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Switzerland |
| Model | RONDCOM 65B |
| Measurement Capabilities | Roundness, Cylindricity, Straightness (axial & radial), Parallelism, Perpendicularity, Coaxiality, Concentricity, Taper, Diameter, Radial Runout, Total Radial Runout, Generatrix Straightness of Cylinders, Face Straightness, Face Runout, Flatness, Wall Thickness Variation, Angular Deviation, Small Arc Segments, Piston Profile |
| Spindle Accuracy | (0.01 + 4H/10,000) µm (H = height from table in mm) |
| Bearing Type | Air-bearing spindle |
| Max. External Diameter | 420 mm |
| Rotation Speed | 2–10 rpm (up to 20 rpm during positioning) |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | FP-2000 |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Sample Types | Bare Wafers, Thin Wafers, Singulated Dies, CSP Substrates on Dicing Frames |
| Alignment Capability | Auto-Wafer Alignment, Auto-Probe-to-Pad Alignment, Die-Level Position Correction Software |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | UF200R |
| Wafer Size Capacity | 200 mm (8-inch) |
| Automation Level | Fully Automatic |
| Probe Station Type | RF Probe Station |
| Compliance | Designed for ISO Class 5 cleanroom environments |
| Structural Rigidity | High-stiffness chuck with ITV fine alignment system |
| Thermal Operation Range | Up to +150 °C |
| Key Software Capabilities | Inkless wafer mapping, multisite parallel probing, OTS optical auto-alignment |
| Motion Control | Upgraded servo-driven XYZθ stage with sub-micron repeatability |
| Application Domain | LSI/VLSI wafer-level parametric testing, RF device characterization, high-reliability IC qualification |