ADVANCE RIKO
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| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Antares |
| Instrument Type | Automated Microcalorimetric Microbial Activity Monitoring System |
| Throughput | 19 samples |
| Sample Vessel | Ø40 × H86 mm ampoule |
| Temperature Range | 5–50 °C (water-circulating thermostat control) |
| Data Acquisition Interval | 60 s (continuous operation up to 166 days) |
| Dimensions | W465 × D650 × H500 mm |
| Weight | ~100 kg |
| Power Supply | AC 100 V, 10 A |
| Installation Requirement | Temperature-stabilized laboratory environment |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | APD |
| Pricing | Upon Request |
| Vacuum Chamber Dimensions | 400 × 400 × 300 mm (L×W×H) |
| Pumping System | 450 L/s Turbo-Molecular Pump |
| Plasma Source | 1 Standard, Up to 3 Optional |
| Operating Pressure | High Vacuum to Low-Pressure Reactive Gases (N₂, O₂, H₂, Ar) |
| Target Geometry | Cylindrical or Tubular, Ø10 mm × 17 mm |
| Target Resistivity | < 0.01 Ω·cm |
| Capacitance Bank | 360 µF × 5 (Optional Configurations Available) |
| Pulse Frequency | 1–5 Hz |
| Discharge Voltage Range | 70–400 V (Max 150 V at 1800 µF) |
| Human-Machine Interface | Industrial Touchscreen Control Panel |
| APD-P Powder Collector | Ø95 mm × 30 mm |
| Collection Rate | 13–20 cm³/h (Dependent on Particle Size & Density) |
| Rotation Speed | 1–50 rpm |
| APD-S Substrate Holder | Compatible with 2-inch (50.8 mm) Wafers/Foils |
| [Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | APD |
| Vacuum Chamber Dimensions | 400 × 400 × 300 mm (L×W×H) |
| Pumping System | 450 L/s Turbomolecular Pump |
| Plasma Source | Up to 3 Configurable Arc Cathodes |
| Operating Pressure Range | High Vacuum to Low-Pressure Reactive Gases (N₂, O₂, H₂, Ar) |
| Target Geometry | Cylindrical or Tubular, Ø10 mm × 17 mm |
| Target Resistivity | < 0.01 Ω·cm |
| Energy Storage Capacitance | 360 µF × 5 (Optional Expansion) |
| Pulse Frequency | 1–5 Hz |
| Discharge Voltage | 70–400 V (Max 150 V at 1800 µF) |
| Human-Machine Interface | Integrated Touchscreen Control Panel |
| Powder Collection Module (APD-P) | Ø95 mm × 30 mm Vessel, 1–50 rpm Rotation, Yield: 13–20 cm³/h (Density- and Size-Dependent) |
| Thin-Film Configuration (APD-S) | Uniform Deposition on 2-inch Substrates] |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CAS-AYII |
| Instrument Type | Non-Vacuum Rapid Thermal Annealing System |
| Sample Dimensions | 70 mm (W) × 220 mm (L) × 0.5–2.0 mm (T) |
| Temperature Range | 50 °C to 1000 °C (max. 1150 °C) |
| Max. Heating Rate | 30 °C/s |
| Max. Cooling Rate | −70 °C/s (from 1000 °C to 400 °C) |
| Annealing Temperature Accuracy | High |
| Annealing Temperature Uniformity | High |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | F-CAL |
| Measurement Principle | Heat Flow Method |
| Thermal Resistance Range | 1×10⁻⁵ m²·K/W |
| Repeatability | <2% fluctuation |
| Test Atmosphere | Ambient air |
| Hot-Side Temperature Setting | 50°C |
| Sample Geometry | Square, 25 mm or 40 mm edge length, thickness 1–5 mm |
| Instrument Type | Steady-State Thermal Resistance Analyzer |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | F-PEM |
| Operating Atmosphere | Ambient Air |
| Temperature Range | Room Temperature to 600 °C (Heating Zone) |
| Sample Size | Square, 40 mm × 40 mm × (5–30) mm Thickness |
| Power Supply | AC200V, 5 kW (Main Unit) |
| Dimensions | W600 × D600 × H1700 mm |
| Weight | ~120 kg |
| Contact Force | Up to 160 kgf (via Constant-Pressure Spring Mechanism) |
| Measured Parameters | Maximum Output Power (P<sub>max</sub>), Heat Flow Rate (Q), Thermoelectric Conversion Efficiency (η) |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | HT-RTA59HD |
| Instrument Type | High-Vacuum Rapid Thermal Annealer (RTA) |
| Sample Size | 15 mm × 15 mm × 1 mm |
| Temperature Range | Ambient to 1800 °C |
| Max Heating Rate | ≥1500 °C/s (typical for 15 mm × 15 mm SiC wafer) |
| Cooling Method | Optional integrated water-quench (CAS-59AQ variant) |
| Heating Source | High-power focused infrared halogen lamps |
| Atmosphere Options | Vacuum (≤10⁻⁴ Pa), inert gas (N₂, Ar), or oxidizing (O₂) |
| Thermocouple Compatibility | JIS B standard sheathed thermocouples (W–Re optional) |
| Chamber Liner Material | High-purity alumina or graphite |
| Control Interface | USB-connected PC-based temperature programming and real-time thermal monitoring |
| Brand | Advance Riko |
|---|---|
| Origin | Japan |
| Model | HT-RTA59HD |
| Instrument Type | Non-vacuum Rapid Thermal Annealer |
| Sample Dimensions | 15 mm × 15 mm × 1 mm |
| Temperature Range | Ambient to 1800 °C |
| Maximum Heating Rate | 1800 °C in ≤10 s (for 15 mm × 15 mm sample) |
| Cooling Rate | 180 °C/s |
| Temperature Accuracy | High |
| Temperature Uniformity | High |
| Heating Method | High-intensity infrared lamp array with optimized reflective cavity |
| Sample Holder Material | Alumina or high-purity graphite |
| Thermocouple Compatibility | JIS B standard φ0.3 mm (W-Re optional) |
| Interface | USB-connected PC control and real-time temperature monitoring |
| Optional Quench Configuration | CAS-59AQ water-quench module |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | HT-RTA59HD |
| Heating Method | High-Power Focused Halogen Lamp |
| Max Temperature | 1800 °C (achieved in ≤10 s for □15 mm samples) |
| Sample Chamber Atmosphere | Dual-gas inlet (N₂ and Ar), quartz tube encapsulation |
| Cooling | Forced-air cooling for lamp assembly |
| Form Factor | Benchtop, manual slide-rail sample loading |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Advance Riko |
| Pricing | Available Upon Request |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | Mila-5000 Series |
| Instrument Type | High-Vacuum Rapid Thermal Annealing Furnace |
| Vacuum Level (Mila-5000UHV) | ≤1×10⁻⁵ Pa |
| Max Heating Rate | Up to 50 °C/s |
| Cooling Method | Integrated Water-Cooled Chamber |
| Atmosphere Options | Vacuum, Inert Gas (N₂, Ar), Ambient Air, Controlled Flow Gas |
| Sample Environment | O-Ring Sealed Quartz Tube |
| Real-Time Monitoring | Top-Mount Optical Viewport + Optional USB Camera Integration |
| Temperature Control | Built-in Programmable PID Controller with Dual Display (Setpoint vs. Actual) |
| Interface | USB 2.0 for PC-Based Program Configuration and Data Logging |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | MILA-5000 |
| Instrument Type | General-Purpose Vacuum Rapid Thermal Annealer |
| Sample Size | 2-inch wafer |
| Temperature Range | 0–1200 °C |
| Max. Heating Rate | 150 K/s |
| Max. Cooling Rate | 200 K/s |
| Temperature Accuracy | ±1% of setpoint |
| Temperature Uniformity | ±1% across sample surface |
| Atmosphere Options | Vacuum (down to 10⁻⁵ Pa for MILA-5000UHV variant), N₂, Ar, O₂, forming gas, ambient air |
| Heating Source | High-intensity infrared gold-coated halogen lamps |
| Cooling Method | Integrated water-cooled chamber base and forced convection |
| Control Interface | USB-connected PC software + front-panel programmable controller |
| Real-time Monitoring | Top-mounted quartz viewport with optional high-speed camera integration |
| Electrical Measurement Compatibility | Built-in 4-point probe interface for in-situ resistivity monitoring |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | MILA-5000 |
| Instrument Type | General-Purpose Vacuum Rapid Thermal Annealer |
| Sample Diameter | 2-inch (50.8 mm) |
| Temperature Range | 0–1200 °C |
| Maximum Heating Rate | 150 K/s |
| Maximum Cooling Rate | 200 K/s |
| Temperature Accuracy | ±1% of setpoint |
| Temperature Uniformity | ±1% across wafer surface |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | MILA-5000 Series |
| Instrument Type | High-Vacuum Rapid Thermal Annealer |
| Sample Size | 2-inch wafer |
| Temperature Range | Ambient to 1200 °C |
| Max. Heating Rate | 50 °C/s |
| Cooling Rate | 30 °C/s |
| Temperature Accuracy | ±2.0 °C |
| Temperature Uniformity | ±2.0 °C |
| Base Vacuum (MILA-5000UHV) | 1×10⁻⁵ Pa |
| Atmosphere Options | Vacuum, N₂, Ar, O₂, forming gas, ambient air |
| Heating Source | Gold-coated infrared halogen lamps |
| Cooling Method | Integrated water-cooled chamber base |
| Control Interface | USB-connected PC software + front-panel touchscreen |
| Real-time Monitoring | Top quartz viewport + optional integrated CCD camera system |
| Optional Integration | Four-point probe resistivity measurement module |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | Mila-5050 |
| Sample Diameter | 50 mm (2 inch) |
| Temperature Range | 25–1200 °C |
| Max. Heating Rate | 50 °C/s |
| Cooling Rate | 20 °C/s |
| Temperature Accuracy | ±1% of setpoint |
| Temperature Uniformity | ±1% across sample zone at 1000 °C |
| Vacuum Capability | Standard configuration supports low-vacuum rapid thermal processing |
| Control Interface | USB-connected PID temperature controller with real-time monitoring and programmable ramp/soak profiles |
| Brand | Advance Riko |
|---|---|
| Origin | Japan |
| Model | Mini-PEM |
| Operating Temperature Range (Hot Side) | 50–500 °C |
| Sample Dimensions | 2–10 mm × 1–20 mm (square/rectangular bulk) |
| Atmosphere | Vacuum-compatible |
| Measured Parameters | Thermoelectric conversion efficiency (η), electrical power output, heat flux |
| Measurement Principle | Simultaneous four-probe electrical characterization + calibrated heat flux sensor (thermopile-based) |
| Compliance | Designed for ASTM E3049–22 (Standard Practice for Measuring Thermoelectric Module Efficiency) and ISO 14405-1:2016 (Geometrical product specifications) alignment |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | Mini-PEM |
| Price Range | USD 85,000 – 170,000 |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | Mini-PEM |
| Measurement Principle | Simultaneous electrical power output & heat flux quantification for η calculation |
| Compliance | ASTM D8251 (2022), ISO 14405-1, GLP-aligned thermal-electrical co-calibration protocol |
| Price Range | USD 82,000 – 163,000 (FOB Yokohama) |
| Brand | Advance Riko |
|---|---|
| Origin | Japan |
| Model | Peltier Evaluation System |
| Measurement Atmosphere | Vacuum |
| Temperature Range | 27–80 °C |
| Sample Dimensions | Square, 10–25 mm side length, thickness ≤ 3 mm |
| Measured Parameters | ΔTₘₐₓ (maximum temperature difference), Qc,ₘₐₓ (maximum cooling power), COP (coefficient of performance) |
| Compliance | Designed for thermoelectric module characterization per ISO 14405-1 and ASTM D5470 practices |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | PEM-2 |
| Maximum Temperature Gradient | 500 °C (up to 800 °C heating surface) |
| Sample Geometry | Square, 20/30/40 mm × 5–30 mm thickness |
| Contact Pressure | 2 MPa (at 30 mm square sample) |
| Atmosphere | Inert gas compatible |
| Measurement Method | One-dimensional heat flux input method |
| Measured Parameters | Thermoelectric conversion efficiency (η), electrical power output (P), thermal input flux (Q) |
| Heating System | High-precision infrared gold-mirror furnace |
| Cooling System | Integrated water-cooled lower stage |
| Load Control | Automated variable resistive load adjustment |
| Software | Fully integrated control with thermal stability detection, real-time data logging, and automated test sequencing |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model Series | PS, PSS |
| Heating Zone Width (PS) | 40 mm |
| Heating Zone Width (PSS) | 20 mm |
| Compatible Substrate Diameter | 50–300 mm |
| Application Scope | Rapid thermal processing (RTP), wafer annealing, solar cell sintering, FPD substrate heating, thin-metal foil annealing |
| Configuration | Modular assembly for extended heating zones |
| Compliance | Designed for integration into Class 100–1000 cleanroom-compatible production lines |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | RHL-E Series |
| Heating Principle | Radiative heating via high-intensity near-infrared lamp array with water-cooled gold-coated elliptical reflector |
| Max Operating Temperature (E-type) | Up to 1200°C |
| Lamp Spectral Peak | ~1.15 µm |
| Reflector Material | Precision-polished aluminum substrate with vacuum-deposited Au coating |
| Cooling | Integrated water-circulation jacket for reflector and chamber housing |
| Sample Geometry Compatibility | Cylindrical/rod-shaped specimens |
| Reflective Geometry | Elliptical (E-series) |
| Compliance | Designed for ISO/IEC 17025-compliant lab environments |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | RHL-P Series |
| Sample Size | 1.2-inch (30.5 mm) wafers |
| Temperature Range | RT to 1350 °C |
| Max. Heating Rate | 50 °C/s |
| Max. Cooling Rate | 30 °C/s |
| Temperature Accuracy | ±3 °C |
| Temperature Uniformity | ±3 °C |
| Chamber Dimensions (varies by model) | Ø20 mm × 80 mm to Ø50 mm × 80 mm |
| Cooling Requirement | External recirculating water chiller (required) |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | RTP-6 |
| Instrument Type | Standard Vacuum Rapid Thermal Annealing Furnace |
| Sample Size | 6-inch wafer |
| Temperature Range | RT to 1000 °C |
| Maximum Ramp Rate | 80 °C/s |
| Annealing Temperature Accuracy | ±0.5 °C |
| Temperature Uniformity | ±10 °C |
| Cooling | Water-cooled chamber (forced convection cooling enabled via optional chiller) |
| Heating Zones | 9 independently controlled zones |
| Atmosphere Control | Vacuum + continuous gas flow (N₂, O₂, forming gas, Ar, etc.) |
| Optional Accessories | Quartz shielding plate, pyrometer (for non-contact temperature monitoring), vacuum pump, recirculating water chiller |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Super LIX-R |
| Price | Upon Request |
| Temperature Range (°C) | 0–50 |
| Heating/Cooling Rate (°C/min) | 0.01–1.5 |
| Temperature Accuracy (°C) | ±0.1 |
| Sample Diameter (mm) | Φ5 ±0.5 |
| Sample Length (mm) | 12–20 |
| Measurement Range (µm) | 20 |
| Resolution (nm) | <0.2 |
| CTE Detection Limit | 5 × 10⁻⁹ K⁻¹ |
| Thermal Stability | <±0.001 °C/min at 0.1 °C/min ramp |
| Atmosphere | Low-pressure He (100 Pa) |
| Sensor | PT-100 Platinum RTD (JIS C 1604-1997 Class A) |
| Laser | He-Ne, 632.8 nm, 5 mW (IEC 60825-1 Class 3B) |
| Brand | Advance Riko |
|---|---|
| Origin | Japan |
| Model | TC-1200RH |
| Measurement Principle | Laser Flash Method (LFM) |
| Temperature Range | RT to 1150 °C (up to 1200 °C short-term) |
| Thermal Conductivity Range | 0.1–2000 W/m·K |
| Accuracy | ±5% |
| Repeatability | ±3% |
| Sample Dimensions | Ø10 mm × 1–3 mm (thickness), measured through-thickness |
| Atmosphere | Vacuum (standard) |
| Heating Rate | 10 °C/min (to 100 °C), 20 °C/min (to 300 °C), 50 °C/min (to 1150 °C) |
| Dimensions (W×D×H) | 900 × 1050 × 1700 mm |
| Weight | ~350 kg |
| Power Supply | AC200 V, single-phase, 8 kVA (main unit) |
| Cooling Water | ≥5 L/min, pressure ≥0.15 MPa |
| Compliance | JIS R 1611, JIS R 1650-3, JIS H 7801, ISO 13826, ASTM E1461 |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | TCN-2ω |
| Measurement Principle | 2ω Lock-in Thermography (Frequency-Domain Modulated Joule Heating) |
| Test Temperature | Ambient (23 ± 2 °C) |
| Sample Dimensions | 10–20 mm (L) × 10 mm (W) × 0.3–1 mm (total thickness, including substrate) |
| Substrate Materials | Si (recommended), Ge, Al₂O₃ |
| Metal Transducer Film | Au (100 nm, 1.7 mm × 15 mm) |
| Thermal Conductivity Range | 0.1–10 W·m⁻¹·K⁻¹ |
| Atmosphere | Ambient air |
| Compliance | ISO/IEC 17025-aligned methodology, compatible with GLP documentation workflows |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | TCN-2ω |
| Measurement Principle | 2ω Lock-in Thermography (Cross-Plane Thermal Conductivity) |
| Temperature Range | Ambient (23 ± 2 °C) |
| Sample Dimensions | 10–20 mm (L) × 10 mm (W) × 0.3–1 mm (total thickness, including substrate) |
| Substrate Options | Si (recommended), Ge, Al₂O₃ |
| Metal Transducer Film | Au, 100 nm thick, 1.7 mm × 15 mm |
| Thermal Conductivity Range | 0.1–10 W·m⁻¹·K⁻¹ |
| Atmosphere | Ambient air |
| Compliance | ISO/IEC 17025-aligned methodology, compatible with GLP documentation workflows |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | TCN-2ω |
| Measurement Principle | 2ω Lock-in Thermography (Frequency-Doubled Resistive Heating + Surface Thermal Reflectance Detection) |
| Temperature Range | Ambient (23 ± 2 °C) |
| Sample Dimensions | 10–20 mm (L) × 10 mm (W) × 0.3–1 mm (T, including substrate) |
| Substrate Materials | Si (recommended), Ge, Al₂O₃ |
| Metal Transducer Film | Au, 100 nm thick, 1.7 mm × 15 mm |
| Thermal Conductivity Range | 0.1–10 W·m⁻¹·K⁻¹ |
| Atmosphere | Ambient air |
| Compliance | ASTM E1461 (modified), ISO 22007-2 (principle-aligned), GLP-ready data traceability |
| Brand | ADVANCE RIKO |
|---|---|
| Origin | Japan |
| Model | TMS-E1S |
| Temperature Range | RT to 1600 °C |
| Atmosphere Options | Air, Vacuum, or Controlled Flow Gas (e.g., N₂, Ar, H₂) |
| Sample Capacity | Ø ≤ 4 mm × Thickness ≤ 2 mm |
| Heating/Cooling Rate | Up to 100 °C/s (dependent on sample and atmosphere) |
| Optical Configuration | Integrated Long-Working-Distance Objective with Real-Time Video Capture |
| Core Technology | Infrared Gold-Mirror Reflective Furnace Coupled with High-Resolution Optical Microscopy |