AGUS
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| Brand | AGUS |
|---|---|
| Origin | Japan |
| Model | SAL-3000Plus |
| Substrate Size | 4-inch (100 mm) |
| Process Temperature Range | 350–800 °C |
| Number of Precursor Lines | 6 |
| Vacuum Base Pressure | ≤5 Pa |
| Film Thickness Uniformity | ≤3% @ 100 mm |
| System Dimensions (W × H × D) | 835 × 1644 × 700 mm |
| Weight | 160 kg |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Model | SAL1000 Series |
| Substrate Size | 4-inch (φ100 mm) |
| Process Temperature | Up to 350 °C |
| Precursor Channels | 2 |
| Uniformity | ≤3% (1σ, across 4-inch wafer) |
| Vacuum Base Pressure | ≤5 Pa |
| Dimensions (W×H×D) | 582 × 450 × 410 mm |
| Weight | 50 kg |
| Optional Accessories | Powder deposition stage (0–45° tilt, 5 cm³ capacity), ozone generator, N₂ purge module, glovebox integration kit, precursor heaters (up to 200 °C), dry vacuum pump, exhaust abatement unit |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Model | SAL3000 |
| Substrate Size | Ø100 mm (4-inch) |
| Process Temperature Range | 350–800 °C |
| Precursor Channels | 6 |
| Uniformity | ≤3% (at Ø100 mm) |
| Dimensions (W × H × D) | 1418 × 1728 × 840 mm |
| Weight | 200 kg |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Model | SAL3000 |
| Substrate Compatibility | Up to φ100 mm (4-inch) |
| Maximum Precursor Channels | 6 |
| Uniformity | ≤3% @ 100 mm |
| Process Temperature Range | Ambient to 800 °C (with optional heater) |
| Precursor Temperature Control | Up to 200 °C |
| Vacuum System | Dry Pump Compatible |
| Exhaust Treatment | Optional Scrubber Integration |
| Software | Touchscreen GUI with ≥30 Programmable Recipes |
| System Architecture | Integrated Mainframe and Control Enclosure |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Model | SPS-2000 |
| Maximum Axial Pressure | 15–75 kN |
| Maximum Pulse Current | 1000–3000 A |
| Base Vacuum | ≤2 Pa (reached in ≤5 min from atmosphere) |
| Ultimate Vacuum (with optional high-vacuum pump) | ≤5×10⁻³ Pa |
| Chamber Accessibility | Enhanced ergonomic loading/unloading design |
| Architecture | Modular, field-upgradeable platform |
| Core Heating Mechanism | Unidirectional pulsed DC current through conductive die/mold assembly |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SPS-Rx Series |
| Pricing | Available Upon Request |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SPS-Sx Series |
| Pricing | Available Upon Request |
| Brand | AGUS |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SSP-1000 |
| Price Range | USD 110,000 – 138,000 |
| Maximum Substrate Diameter | φ100 mm |
| Thickness Uniformity | ±5% over φ100 mm area |
| RF Power Mode | Pulsed RF (13.56 MHz) |
| Gas Inlets | Standard 1, Optional 2 |
| Sputtering Orientation | Upward, Lateral, Downward (reconfigurable cubic chamber) |
| Target Compatibility | Metallic, Oxide (e.g., Al₂O₃, SiO₂), Nitride, and Magnetic Targets (optional) |
| Substrate Holder | Rotatable or Fixed |
| Viewport | Integrated Quartz Observation Window |
| Cathode Shielding | Removable Cathode Protection Plate with Integrated Sputter Timer for Thickness Estimation |