AML
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| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model Series | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Maximum Wafer Size | 200 mm |
| Heating Range | Up to 650 °C |
| Bonding Chamber Vacuum | ≤1 × 10⁻⁵ mbar (with turbomolecular pump) |
| Control Interface | Windows-based HMI with full process logging |
| Compliance | Designed for GLP/GMP-aligned R&D and pilot-line environments |
| Automation Level | Semi-automatic (manual load/unload, fully automated alignment, activation, and bonding) |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Application | In-situ alignment, surface activation, wafer bonding, and nanoimprint lithography (NIL) |
| Compliance | Designed for Class 100 cleanroom integration |
| Control Architecture | Motorized precision stages with sub-micron alignment repeatability |
| Vacuum Compatibility | <5×10⁻⁶ mbar base pressure |
| Thermal Bonding Range | Ambient to 500 °C |
| Alignment Accuracy | ≤±25 nm (3σ, optical auto-alignment mode) |
| NIL Capability | Compatible with rigid and soft stamps |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04 & AWB-08 Platform |
| Vacuum Base Pressure | ≤1×10⁻⁶ mbar |
| Maximum Bonding Force | 40 kN |
| Maximum Temperature | 560 °C |
| Anodic Bonding Voltage | 0–2.5 kV DC (up to 40 mA) |
| Alignment Accuracy | ±1 µm (in-situ, hot or cold) |
| Compatible Wafer Sizes | 2″, 3″, 4″, 5″, 6″, and 8″ |
| Bonding Environments | High vacuum, UHV (optional), controlled process gas (e.g., forming gas), or atmospheric inert gas |
| Optical System | Dual CCD microscope with through-the-lens illumination, visible + infrared imaging, real-time side-by-side wafer alignment display |
| Control Architecture | Fully automated PC-based system with recipe-driven operation, full parameter logging (voltage, current, integrated charge, temperature, pressure, force, separation, event timestamps), SPC-compliant data export, and remote diagnostic capability via secure network interface |
| Brand | AML |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AWB-04 |
| Pricing | Upon Request |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Wafer Size Support | Up to 200 mm |
| Maximum Bonding Temperature | 650 °C |
| Heating Control | Independent top/bottom platen |
| Vacuum Level | ≤10⁻⁵ mbar (with turbomolecular pump) |
| Bonding Processes Supported | Anodic, Thermocompression, Eutectic, Glass Frit, Direct Si–Si, Intermediate Layer Adhesive, SOI, and Plasma-Activated Bonding |
| Automation Level | Semi-automatic (manual load/unload, fully automated bonding cycle) |
| Nanopatterning Capability | Integrated nanoimprint functionality |
| Brand | AML |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SEMETROL HERA-DLTS |
| Price Range | USD 120,000 – 280,000 |
| Instrument Class | Semiconductor Defect Characterization System |
| Brand | AML |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SEMETROL HERA-DLTS |
| Price Range | USD 120,000 – 280,000 |
| Instrument Class | Semiconductor Defect Characterization System |