AXIS-TEC
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| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AX-LS100 |
| Maximum Linear Cutting Speed | 800 mm/s |
| Application Scope | Semiconductor Wafer Dicing |
| Maximum Wafer Size | 300 mm (12-inch) |
| Laser Class | Class 1 Enclosure |
| Dimensions (W×L×H) | 1530 × 900 × 2229 mm |
| Weight | 750 kg |
| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | AX-LS1000 |
| Maximum Linear Cutting Speed | 200 mm/s |
| Maximum Dicing Speed (YAG variant) | 140 mm/s |
| Maximum Dicing Speed (Semiconductor Laser variant) | 220 mm/s |
| Kerf Width | 30 µm |
| Cooling | Integrated Air-Cooling System |
| Configuration | T-Stage Dual-Station Platform |
| Laser Source Type | Fiber Laser (Standard), Optional YAG or Diode-Pumped Semiconductor Laser |
| Brand | AXIS-TEC |
|---|---|
| Origin | USA |
| Model | PE-100 |
| RF Frequency | 13.56 MHz |
| RF Power | 0–300 W (automatically adjustable) |
| Chamber Dimensions | 305 × 368 × 305 mm (L×D×H) |
| Chamber Volume | 34 L |
| Chamber Material | T6-aluminum monolithic construction |
| Operating Pressure Range | 1–2000 mTorr |
| Gas Flow Control | 0–50 sccm with precision needle valve |
| Vacuum Gauge | Pirani gauge (0–1 Torr) |
| Gas Inlet | Single or multi-channel configurable |
| Control System | PLC-based HMI automation |
| Configuration Options | Plasma cleaning, isotropic plasma etching, anisotropic RIE, and switchable mode architecture |
| Brand | AXIS-TEC |
|---|---|
| Origin | USA |
| Model | PE-75 |
| RF Frequency | 13.56 MHz |
| Power Output | 0–150 W (automatically regulated) |
| Chamber Dimensions | Cylindrical, ID 273 mm × Depth 254 mm |
| Chamber Volume | 13.8 L |
| Chamber Material | T-6 Aluminum Monolithic Construction |
| Operating Gas | Single- or Multi-Gas Inlet |
| Vacuum Range | 1–2000 mT (via Pirani gauge, 0–1 Torr) |
| Gas Flow Control | 0–25 sccm with Precision Needle Valve |
| Control Mode | Fully Automated |
| Brand | AXIS-TEC |
|---|---|
| Origin | USA |
| Model | PlasmaSTAR100 / PlasmaSTAR200 |
| RF Frequency | 40 kHz (LF) or 13.56 MHz |
| RF Power | 600 W |
| Chamber Volume | 10 L |
| Chamber Material | Anodized Aluminum |
| Maximum Substrate Size | 8-inch wafer |
| Process Gas Pressure | 10 PSI |
| Control Interface | Touchscreen PC with Multi-step Programmable Logic |
| Vacuum System | Rotary Vane Pump (standard), optional Roots-boosted configuration |
| Gas Delivery | Mass Flow Controllers (MFCs) standard, downstream pressure controller optional |