DAIN HITECH
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| Brand | DAIN HITECH |
|---|---|
| Origin | South Korea |
| Model | DH-OBCP5000 |
| Wafer Compatibility | 6", 8", 12" (flat & notch) |
| OCR Recognition Rate | ≥99.8% |
| Throughput | 90 wafers/hour (12" standard orientation) |
| Printing Method | Thermal Transfer |
| Print Resolution | 305 dpi |
| Max Print Speed | 150 mm/s |
| Label Dimensions | 22–131 mm (W) × 6–356 mm (L) |
| ESD Protection | <100 V (10 s) |
| Acoustic Noise | ≤70 dB(A) |
| UPS Backup Duration | 3 min |
| Safety | Dual emergency stop buttons, magnetic safety sensors on all access doors |
| Software Features | MES integration (T-card scanning), dual-label printing mode, post-print barcode verification, server-based auto-backup, wafer mapping synchronization |