Endress+Hauser Metrology
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| Brand | Endress+Hauser Metrology |
|---|---|
| Country of Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | MX 203 |
| Pricing | Upon Request |
| Wafer Diameter Range | 50 mm – 450 mm (2″ – 18″) |
| Thickness Accuracy | ±0.5 µm |
| Thickness Resolution | 50 nm |
| Thickness Measurement Range | 100 µm – 1000 µm |
| Measurement Principle | Dual-Sided Capacitive Sensing |
| Automation Level | Manual Operation |
| Compatible Substrates | Si, SiC, GaN, GaAs, InP |
| Brand | Endress+Hauser Metrology |
|---|---|
| Origin | Germany |
| Model | MX608 |
| Wafer Diameter Support | 150 mm, 200 mm, 300 mm |
| Thickness Range | 500–800 µm |
| Max Warp | 100 µm |
| Resistivity Range | 0.001–200 Ω·cm |
| Thickness Accuracy | ±0.3 µm |
| TTV Accuracy | ±0.1 µm |
| Thickness Repeatability | ±0.05 µm |
| Resistivity Accuracy | ±1% (0.001–80 Ω·cm), ±5% (200 Ω·cm) |
| Resistivity Repeatability | ±0.2% (0.001–80 Ω·cm), ±2% (200 Ω·cm) |
| Edge Measurement Capability | up to 130 mm (150 mm wafers), up to 180 mm (200 mm wafers) |
| Single-Point Measurement Time | ~7 s |
| Full-Surface Scan (130/180 points) | ~10 s |
| Multi-Angle Radial Scan (18 scans @ 10° intervals) | ~3 min |
| Carrier Type Detection | P/N identification via Surface Photovoltage (SPV) |