G&N
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| Brand | G&N |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MPS R300 CM |
| Pricing | Upon Request |
| Drive Motor | 3.7 kW |
| Spindle Speed at 50 Hz | 2300 rpm |
| Power Supply Connection | 6 kVA |
| Rotary Table Diameter | 400 mm |
| Table Speed Range | 0–30 rpm |
| Axial Runout | < 2 µm |
| Grinding Wheel Diameter | 200 mm |
| Maximum Grinding Height (Ceramic Wheel) | 45 mm |
| Maximum Grinding Height (CBN/Diamond Wheel) | 110 mm |
| Fine Cross-Feed Travel Range | approx. 170 mm |
| Minimum Feed Increment | 1 µm per pass |
| Machine Dimensions (L × W) | 1550 × 1130 mm |
| Net Weight | 1130 kg |
| Brand | G&N |
|---|---|
| Origin | Germany |
| Model | MPS R400CV |
| Wafer Compatibility | 2″, 3″, 4″, 5″, 6″, 8″ |
| Chuck Flatness Error | ≤2 µm |
| Grinding Method | Z-axis plunge grinding with synchronized wafer and spindle rotation |
| Spindle Type | Integrated high-precision air-bearing spindle |
| Spindle Speed | 2560 rpm |
| Spindle Power | 3.7 kW |
| Grinding Wheel Diameter | 200 mm |
| Number of Spindles | 1 |
| Coarse/Fine Feed Range | 170 mm |
| Feed Resolution | ≤1 µm |
| Minimum Step Size | 0.1 µm |
| Coarse Grinding Rate | 2–1000 µm/min |
| Fine Grinding Rate | 2–1000 µm/min |
| Surface Roughness (Ra) | Down to 0.016 µm (with D7 diamond wheel) |
| Total Thickness Variation (TTV) | ≤3 µm per wafer |
| Inter-wafer Thickness Uniformity | ≤2 µm |
| Wheel Material | Diamond or CBN |
| Wheel Mounting | Single or dual-wheel configuration (manual or optional automatic change) |
| Chuck Sizes | Multiple vacuum chucks for 2″–8″ wafers |
| Sample Table Diameter | 400 mm |
| Sample Table Speed | 2–20 rpm |
| Control System | High-precision PLC-based controller with touchscreen HMI |
| Recipe Storage | Multiple programmable process recipes |
| Optional Module | In-situ thickness measurement unit |
| Enclosure | Fully enclosed grinding chamber |
| Machine Weight | 1130 kg |
| Footprint | 1640 × 1210 mm |