KLA
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| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | Filmetrics (a KLA company) |
| Type | Benchtop Spectroscopic Reflectometry System |
| Model | F3-sX |
| Wavelength Options | 980 nm / 1310 nm / 1550 nm |
| Thickness Range | 15 nm – 3 mm (depending on configuration and film type) |
| Spot Size | 10 µm |
| Material Library | >130 preloaded optical constants |
| Software | FILMeasure 8 (local acquisition & analysis), FILMeasure Standalone (remote data processing) |
| Compliance | Designed for semiconductor fab, R&D, and QC environments supporting GLP/GMP traceability workflows |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported Semiconductor Process Metrology Instrument |
| Automation Level | Fully Automated |
| Probe Configurations | Four-Point Probe (4PP) and Eddy Current (EC) |
| Maximum Sample Diameter | 200 mm (R54-200) or 300 mm (R54-300) |
| Maximum Sample Height | 15 mm |
| Sheet Resistance Range | 10⁻² to 10⁸ Ω/sq |
| Measurement Coordinate Modes | Rectangular, Linear, Polar, Custom Grid |
| XY Stage Precision | High-resolution motorized stage with ±100 mm travel (200 mm total range) |
| Enclosed Chamber | Yes, for light- and environment-sensitive samples |
| Software Platform | RSMapper™ v5.x with GLP-compliant audit trail, 21 CFR Part 11 optional modules |
| Compliance | ASTM F84, ISO 10777, SEMI MF67, USP <1054>, supports GMP/GLP documentation workflows |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Optical Patterned Defect Inspection System |
| Model | Candela® 6300 |
| Detection Sensitivity | Sub-0.1 Å surface roughness change |
| Spatial Bandwidth | 0.22–2000 µm |
| Measurement Modes | Radial & tangential topography profiling, roll-off analysis, texture uniformity, particle/scratch detection |
| Compliance | Designed for semiconductor and data storage manufacturing environments |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported Instrument |
| Model | F54 Series |
| Pricing | Upon Request |
| Thickness Range | 4 nm – 100 µm (depending on configuration) |
| Wavelength Range | 190–1700 nm (F54-UVX) |
| Spot Size | Down to 1 µm (with 50× objective) |
| Aperture Options | 500, 250, 100, and 50 µm |
| Measurement Speed | Up to 2 points per second |
| Maximum Sample Diameter | 450 mm |
| Built-in Material Library | >130 refractive index & extinction coefficient datasets |
| Compliance | ASTM F398, ISO/IEC 17025-compatible operation environment |
| Software | Filmetrics F54 Metrology Suite v6.x (Windows 10/11, USB 3.0 interface) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported Instrument |
| Model | F54-XY Series |
| Pricing | Upon Request |
| Thickness Range (F54-XY) | 20 nm – 50 µm |
| Wavelength Range (F54-XY) | 380–1050 nm |
| Thickness Range (F54-XY-UV) | 4 nm – 35 µm |
| Wavelength Range (F54-XY-UV) | 190–1100 nm |
| Thickness Range (F54-XY-NIR) | 100 nm – 120 µm |
| Wavelength Range (F54-XY-NIR) | 950–1700 nm |
| Thickness Range (F54-XY-EXR) | 20 nm – 120 µm |
| Wavelength Range (F54-XY-EXR) | 380–1700 nm |
| Thickness Range (F54-XY-UVX) | 4 nm – 120 µm |
| Wavelength Range (F54-XY-UVX) | 190–1700 nm |
| Maximum Sample Size (F54-XY-200) | 200 mm |
| Maximum Sample Size (F54-XYT-300) | 300 mm |
| Measurement Speed | Up to 2 fields of view per second |
| Stage Type | Motorized XY stage (F54-XY-200) |
| Pattern Recognition | Yes, supports both arrayed and non-arrayed wafers |
| Software | FILMapper v6.x or later |
| Compliance | NIST-traceable calibration standards included |
| Material Library | >130 built-in optical constants |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | iMicro |
| Instrument Type | Integrated Nanoindentation and Scratch Tester |
| Maximum Normal Load | 1 N |
| Load Resolution | <1 nN |
| Displacement Range | ±25 µm |
| Displacement Resolution | <0.05 nm |
| Indenter Types | Dozens of diamond indenters (Berkovich, cube corner, Vickers, spherical, flat punch, etc.) |
| Controller | InQuest high-speed controller (100 kHz data acquisition, 20 µs time constant) |
| Software | InView Suite (RunTest, ReviewData, InFocus, InView University, mobile app) |
| Compliance | Fully supports ISO 14577-1/2/3, ASTM E2546, and GLP/GMP-aligned audit trails |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Instrument Type | Nanoindentation and Scratch Tester |
| Model | iNano® |
| Force Range | 0.1 µN – 50 mN |
| Displacement Range | ±25 µm |
| Force Resolution | < 10 nN |
| Displacement Resolution | < 0.01 nm |
| Thermal Drift | < 0.05 nm/s (at 25 °C, stabilized) |
| Maximum Scratch Load | 50 mN |
| Available Indenter Types | Berkovich, Cube-Corner, Spherical (1–100 µm radius), Conical, Flat Punch |
| Integrated Microscope | 10×–100× digital zoom, 1 µm lateral resolution |
| Controller | InQuest™ high-speed electronics (100 kHz sampling, 20 µs time constant) |
| XY Stage Travel | 100 mm × 100 mm |
| Z-Stage Travel | 25 mm |
| Compliance with Standards | ASTM E2546, ISO 14577-1/2/3, JIS H 8509 |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Profilm 3D |
| Measurement Principle | Vertical Scanning Interferometry (VSI) & Phase-Shifting Interferometry (PSI) |
| Thickness Range (VSI) | 50 nm – 100 mm |
| Thickness Range (PSI) | 0 – 3 µm |
| Reflectance Range | 0.05% – 100% |
| Piezo Scan Range | 500 µm |
| XY Stage Options | 100 mm × 100 mm or 200 mm × 200 mm |
| Compliance | ISO 25178-604, ISO 9000, ASME B46.1 |
| Roughness Parameters | 47 standardized (ASME Y14.36M, ISO 4287, ISO 25178-2) |
| Software | ProfilmOnline cloud-based analysis platform |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | R54 |
| Automation Level | Semi-Automatic |
| Resistivity Measurement Range | 1 mΩ/□ to 200 Ω/□ |
| Resistivity Measurement Accuracy | < 0.02% |
| Z-Travel Range | 15 mm |
| XY Stage Type | Motorized |
| Max Sample Height | 15 mm |
| Max Sample Weight | 2.5 kg |
| 4PP Measurement Repeatability | < 0.02% |
| EC Measurement Repeatability | < 0.2% |
| Compatible Sample Sizes | Up to 300 mm Ø or A4 (210 × 297 mm) |
| Probe Configurations | Customizable rectangular, linear, polar, and user-defined mapping patterns |
| Dual-Mode Operation | Four-Point Probe (4PP) and Non-Contact Eddy Current (EC) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported |
| Model | Tencor® P-170 |
| Measurement Principle | Inductive |
| Vertical Measurement Range | 0.5 nm – 1000 µm |
| Vertical Resolution | Sub-nanometer (typical) |
| Probe Tip Radius | < 12 nm (standard diamond tip) |
| Normal Force Range | 0.03–15 mg (closed-loop force control) |
| Maximum Scan Length | 200 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤ 0.15 nm (1σ, over 24 h) |
| Maximum Sample Size | Ø200 mm × 25 mm thick |
| Optical System | 5 MP color camera with motorized zoom and dual-view (top + side) optics |
| Automation | Integrated robotic handler for opaque (e.g., Si) and transparent (e.g., sapphire) wafers (Ø75–200 mm) |
| Compliance | ASTM E1399, ISO 4287, ISO 25178-2, USP <1059>, FDA 21 CFR Part 11 (audit trail & electronic signature enabled) |