Park SYSTEMS
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| Brand | Park SYSTEMS |
|---|---|
| Origin | Germany |
| Model | i4 |
| Dimensions | 400 × 500 × 90 mm |
| Payload Capacity | 0–120 kg |
| Active Isolation Bandwidth | 0.6/1 Hz to 200 Hz |
| Degrees of Freedom | 6-DOF |
| Settling Time | ≤ 0.3 s |
| Power Supply | Standard AC Mains (No Compressed Air Required) |
| Stiffness at 1 Hz | 20–30× Higher Than Passive Air Tables |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Hybrid WLI |
| Wafer Compatibility | 300 mm (fully backward-compatible with 200 mm and smaller wafers) |
| Instrument Category | Optical Defect Inspection & Hybrid Metrology System |
| Primary Application | In-line semiconductor process monitoring and defect characterization |
| Core Technology Integration | Co-registered AFM + WLI on single platform |
| Measurement Capability | Sub-ångström vertical resolution (AFM), nanometer-level lateral resolution, µm-to-mm field-of-view (WLI) |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Hybrid WLI |
| Primary Technology | Integrated White Light Interferometry (WLI) and Atomic Force Microscopy (AFM) |
| Optical Modes | WLI & Phase-Shifting Interferometry (PSI) |
| Objective Lenses | 2.5×, 10×, 20×, 50×, 100× (motorized turret) |
| Interferometric Objective Type | Mirau |
| Measurement Principle | Coherence scanning interferometry with sub-nanometer vertical resolution |
| Application Domain | Semiconductor front-end & back-end process control, advanced packaging metrology, wafer-level defect review, CMP characterization, GLP/GMP-compliant R&D and inline QA |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Mask |
| Application | EUV photomask defect repair and metrology |
| Technology | Non-contact atomic force microscopy (AFM) |
| Key Capabilities | Defect detection, nanoscale mechanical removal, post-repair 3D topography verification |
| Compliance | Designed for cleanroom-integrated semiconductor mask shops |
| Deployment | Dual-pod compatible for inline EUV reticle handling |
| Operational Environment | Ambient air, no vacuum, no beam-induced charging, no chemical reagents |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Mask |
| Application | EUV photomask defect repair, AFM-based nanomechanical removal and verification |
| Compliance | Designed for ISO 14644-1 Class 1–5 cleanroom integration |
| Software | XEI™ with automated defect-to-repair workflow, audit-trail logging per FDA 21 CFR Part 11 requirements |
| Repair Mechanism | Non-contact, voltage-controlled AFM tip nanoscrubbing and localized mechanical lift-off |
| Resolution | Sub-5 nm lateral resolution in topography and phase imaging |
| Sample Handling | Dual-pod EUV reticle cassette compatibility (SEMI F47 compliant) |
| Vacuum Requirement | None |
| Charging Risk | Electrostatically neutral operation |
| Chemical Usage | Dry, solvent-free process |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-TSH |
| Instrument Type | Industrial AFM |
| Sample Stage Travel Range | 625 mm × 525 mm |
| Maximum Sample Dimensions | 520 mm × 520 mm × 10 mm (10 kg) |
| Acoustic Noise Attenuation | >20 dB with Integrated Acoustic Enclosure |
| XY Scanning Range (Closed-Loop) | 100 µm × 100 µm |
| Z Scanning Range | 15 µm |
| Z Sensor Noise Floor | Sub-nanometer (low-noise optical lever detection) |
| Probe Exchange | Automated Tip eXchanger (ATX) with vision-based tip recognition and magnetic probe handling |
| Laser Alignment | Motorized, auto-focused beam positioning |
| Electrostatic Control | Integrated bipolar ionizer for charge neutralization |
| Electrical Characterization Option | Conductive AFM (C-AFM) with micro-probe station and 2D encoder stage |