SET / Sensor Electronic Technology
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| Brand | SET/Sensor Electronic Technology |
|---|---|
| Origin | Germany |
| Model | G5/2017 Series |
| Bonding Accuracy | ±0.5 µm |
| Bonding Methods | Thermocompression, Reflow Soldering, UV Curing |
| Compatible Materials | Au, Au/Sn, In, Cu, Cu/Sn |
| Applications | Flip-Chip, Die-to-Substrate (D2S), Chip-to-Chip (C2C), Chip-to-Substrate (C2S), MEMS, MOEMS, MCM, Photonic Integrated Circuits (PICs), Silicon Photonics, Optoelectronic Assembly |
| Brand | SET / Sensor Electronic Technology |
|---|---|
| Origin | USA |
| Model | UV TOP Series |
| Component Type | UV Light Source |
| Spectral Range | 240–370 nm |
| Package Options | TO-18, TO-39 |
| Emission Configurations | Flat Window (120° full-angle divergence), Hemispherical Lens (7° full-angle quasi-collimated), Spherical Lens (focused + 7° quasi-collimated), Fiber-Coupled |
| Wavelength Options | Discrete peaks from 240 nm to 355 nm (e.g., 275 nm, 310 nm) with ceramic SMD variants available |
| Optical Power Output | 10 µW to 800 µW (varies by wavelength, package, and lens type) |
| Viewing Angle | 7° (collimated), 120° (broad emission) |
| Compliance | RoHS-compliant packaging, JEDEC-standard hermetic sealing for TO-can variants |