SUSS MicroTec
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| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | MaskTrack Pro |
| Application Scope | Automated cleaning, bake, and develop for photomasks & reticles |
| Compatibility | 90 nm to sub-1x nm half-pitch nodes |
| Process Capabilities | Front-side & backside cleaning, sulfur-free chemistry option, integrated particle detection readiness |
| Architecture | Cluster-compatible platform (with InSync, backside particle inspection, EUV mask storage) |
| Regulatory Context | Designed for ISO Class 1–5 cleanroom integration, supports GLP/GMP-aligned process documentation |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | DSM8/200 Gen2 |
| Measurement Principle | Dual-microscope optical alignment metrology with TIS-compensated image registration |
| Accuracy | ≤ 0.2 µm (after TIS compensation) |
| Configuration Options | Manual loading (DSM8 Gen2) / Robotic handling with custom chuck (DSM200 Gen2) |
| Illumination Options | Visible + optional IR illumination (for through-silicon feature imaging) |
| Software Platform | Cognex PatMax®-powered automated image analysis with recipe-driven operation |
| Compliance Context | Designed for GLP/GMP-aligned semiconductor process development and high-reliability packaging workflows |
| Brand | SUSS MicroTec |
|---|---|
| Country of Origin | Germany |
| Model | MA/BA Gen4 |
| Type | Semi-Automated Mask Aligner & Thermal/Nanoimprint Lithography Platform |
| Application Scope | R&D, Pilot Production, High-Volume Prototyping |
| Compliance | ISO 9001 Certified Manufacturing, CE Marked, Compatible with ISO 14644-1 Class 5 Cleanroom Integration |
| Optical System | MO Exposure Optics® with Telecentric Illumination |
| Alignment Modes | Top-Side, Bottom-Side, IR Alignment |
| Optional Alignment Accuracy | ≤ 0.5 µm (with DirectAlign®) |
| Resolution | Down to 0.8 µm (hard/soft/vacuum contact mode) |
| Substrate Compatibility | 100–200 mm wafers, reticles, glass, quartz, SiC, GaAs, flexible substrates |
| Automation Level | Semi-Automated with SMILE™ Process Integration Framework |
| Software | LITHOGRAPH® v5.x with Audit Trail, User Role Management, Recipe Versioning, and GLP/GMP-Ready Data Logging |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SUSS MA200 Gen3 |
| Pricing | Upon Request |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | MA300 Gen3 |
| Wafer Size Support | 200 mm & 300 mm |
| Alignment Accuracy (Top-Side) | ±0.5 µm |
| Alignment Modes | Top-Side, Bottom-Side, Infrared (IR) |
| Exposure Method | Contact/Near-Contact Photolithography |
| Optical System | MO Exposure Optics® |
| Application Focus | Advanced Packaging (TSV, RDL, Bumping), MEMS, LED, Power Devices, WLP, Flip-Chip |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Automation Level | Full cassette-to-cassette robotic handling |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS200 |
| Maximum Wafer Size | 200 mm |
| Bonding Force | up to 100 kN |
| Temperature Range | up to 550 °C |
| Vacuum Chamber Pressure Range | 5×10⁻⁵ mbar to 3 bar |
| Heating/Cooling Rate | up to 40 K/min (heating), up to 30 K/min (cooling) |
| Bonding Force Repeatability | < 2% |
| Temperature Uniformity | < 1% |
| Process Control | Programmable ramp/soak profiles with independent pressure, temperature, and force regulation |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS300 |
| Application | Temporary bonding for 200 mm and 300 mm wafers |
| Substrate Compatibility | Silicon, glass carrier substrates (same or different diameters) |
| Alignment Method | Edge recognition + center alignment with GYRSET® technology |
| Coating Uniformity | Optimized via integrated non-contact multi-point thickness measurement |
| Process Steps Supported | Release layer deposition, adhesive spin-coating, low-force wafer bonding, UV or thermal curing, post-bond cooling |
| Platform Architecture | Modular, scalable throughput, minimized footprint |
| Adhesive Compatibility | Open platform supporting all commercially available temporary bonding adhesives |
| Compliance Context | Designed for semiconductor mask & reticle manufacturing environments compliant with ISO 14644-1 Class 5 cleanroom requirements and compatible with GLP/GMP-aligned process documentation workflows |