Teltec Semiconductor Pacific Limited
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| Brand | Teltec Semiconductor Pacific Limited |
|---|---|
| Origin | Hong Kong |
| Model | RIE-ICP FA System |
| Configuration | RIE/PE and ICP dual-mode plasma etching platform |
| Wafer Compatibility | Up to 300 mm |
| Etch Modes | Reactive Ion Etching (RIE), Plasma Enhanced (PE), Inductively Coupled Plasma (ICP) |
| Process Flexibility | Anisotropic and isotropic etching capability |
| Target Materials | SiO₂, Si₃N₄, poly-Si, Al, Cu, low-k dielectrics, PI (polyimide), TEOS-based films |
| Application Domain | Failure Analysis (FA), Cross-sectioning, Delayering, Package-level and Die-level deprocessing |