TPT
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| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB10 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter Range | 17–75 µm (gold/aluminum) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Ultrasonic Power Output | 0–5 W |
| Bond Time | 0–10 s |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-Axis Stroke | 17 mm |
| Deep-Cavity Bond Head Clearance | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage Capacity | 100 recipes |
| Temperature Control Range | up to 250 °C (±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB100 |
| Bonding Types | Ball & Wedge |
| Wire Diameter Range | 17–75 µm |
| Ultrasonic Frequency | 63.3 kHz (PLL-controlled, optional 110 kHz) |
| Ultrasonic Power | 0–10 W |
| Bonding Force | 10–200 cN·mm |
| Z-Axis Resolution | 0.5 µm |
| X-Y Resolution | 0.1 µm |
| X-Y Travel | 90 mm |
| Z Travel | 100 mm |
| Heating Stage | Ø90 mm, up to 200 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions (W×D×H) | 620 × 750 × 680 mm |
| Weight | 72 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB16 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter | 17–75 µm (Au/Al) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-axis Travel | 17 mm |
| Motorized Y-axis Travel | 7 mm |
| Bond Head Depth | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage | 100 recipes |
| Temperature Control | up to 250 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions | 680 × 640 × 490 mm |
| Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Z-Axis Drive | Motorized |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | Sub-10 µm (typical, under optimized conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Placement Time | 1–10,000 ms (optional extension to 20,000 ms) |
| Placement Force | 10–150 cN·m (350 cN·m optional) |
| Vacuum Source | Integrated pump |
| Nozzle Diameter | Ø1.58 mm, 19 mm length |
| Z-Travel | 17 mm |
| Arm Length | 165 mm |
| X-Y Manipulator Range | ±10 mm |
| Mechanical Lever Ratio | 6:1 |
| Temperature Control | Up to 250 °C ±1 °C |
| Power Supply | 100–240 VAC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Mounting Type | Desktop |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | ±2 µm (typical, under calibrated lab conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Z-Axis Stroke | 17 mm (motorized) |
| Placement Force Range | 10–150 cN·m (350 cN·m optional) |
| Placement Time | 1–10,000 ms (extendable to 20,000 ms) |
| Dispensing Capability | Optional adhesive dispensing module |
| Dip-Coating Function | Integrated |
| Vacuum Source | Onboard integrated vacuum pump |
| Motion Architecture | True orthogonal X-Y-Z kinematics |
| Tool Changer | Rotating nozzle turret |
| Programmable Recipes | Up to 100 stored programs |
| Operating Modes | Manual, semi-automatic, and step-by-step guided placement |
| Heating Stage | Optional temperature-controlled platform (up to 250 °C ±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |