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TRY Customized Push-Pull Bond Tester for Semiconductor IC Packaging and Automotive Electronics

2026-01-23 IC Test & Handler Equipment, Semiconductor Instruments, Signal Testing Systems and Semiconductor Automatic Test Equipment

Brand	TRY
Model	Customized
Application Scope	High-power IC packaging (e.g., IGBT modules), semiconductor manufacturing, materials R&D, automotive electronics
XY Stage	150 × 150 mm
Max Shear Force Capacity	1000 kg
Compliance	ASTM F468, ISO 13473-2, JEDEC JESD22-B116 (Bond Strength), MIL-STD-883 Method 2011
Sensor Technology	Digital load cell with thermal drift compensation
Control Interface	Touchscreen HMI + Ethernet/RS232 for integration into factory MES/LIMS
Software	TRY-BondTest Suite v3.2 with audit trail, user role management, and 21 CFR Part 11–compliant electronic signatures

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