TSD
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| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IHG-2010 |
| Price | Upon Request |
| Maximum Wafer Size | 6-inch (150 mm) |
| Grinding Wheel OD | Ø200 mm |
| Spindle Speed Range | 0–3000 rpm |
| Chuck Table Speed | 0–400 rpm |
| Z-Axis Travel | 70 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional high-resolution mode: 0.01 µm/sec) |
| Industry Compliance Options | SECS/GEM interface, MES integration support |
| Brand | TSD |
|---|---|
| Model | IVG Series |
| Origin | Beijing, China |
| Type | Semi-Automatic Dual-Axis Wafer Thinning System |
| Maximum Wafer Size | 200 mm (IVG-2020) / 300 mm (IVG-3020) |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Chuck Rotation Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Range | 0–4800 µm |
| Thickness Repeatability | ±1 µm |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Model | IVG-2040 / IVG-3040 |
| Max Wafer Size | 200 mm (8") / 300 mm (12") |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Table Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Repeatability | ±0.001 mm |
| In-Line Thickness Range (OMM) | 0–4800 µm |
| Integrated Auto Load/Unload | Yes |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | POLI-500 |
| Maximum Wafer Size | 200 mm (8-inch) |
| Platen Diameter | 508 mm (20 inch) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Downforce Range | 70–500 g/cm² |
| Pressure Actuation | Pneumatic bladder-based compliant loading |
| Conditioning | Oscillating arm-type conditioner with optional reciprocating mode |
| Process Monitoring | Optional friction force & temperature sensing |
| Endpoint Detection | Optional Electrochemical Endpoint Detection (EPD) |
| Slurry Delivery | Three independent peristaltic pump channels |
| Loading Interface | Semi-automatic tray-based wafer handling |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-150A / TMP-200A |
| Wafer Size | 4"/6" (TMP-150A), 4"/6"/8" (TMP-200A) |
| Platen Diameter | 406 mm (TMP-150A), 508 mm (TMP-200A) |
| Platen & Carrier Rotation Speed | 0–120 rpm |
| Wafer Backside Pneumatic Pressure | 70–500 g/cm² |
| Retaining Ring Pressure | 70–700 g/cm² |
| Conditioner Type | Swing-Arm Diamond Dresser |
| Conditioner Speed | 0–80 rpm |
| Loading Mode | Semi-Automatic |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-200S / TMP-300S |
| Wafer Size | 6–8 inch (TMP-200S), 8–12 inch (TMP-300S) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Wafer Backside Pneumatic Pressure | 0–700 g/cm² |
| Zone-Based Pressure Control | 3-zone (TMP-200S), 3/6-zone (TMP-300S) |
| Retainer Ring Pressure | 0–700 g/cm² |
| Loading/Unloading | Semi-automatic dual-tray (load/unload trays) |
| Conditioning | Swing-arm diamond dresser |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model Series | TSC-100 / TSC-300S / TSC-200L |
| Configuration Types | Single-Station / Indexing / Inline (Cassette-to-Cassette) |
| Wafer Compatibility | 4–12 inch (TSC-300S), 4–6 inch (TSC-100), 6–8 inch (TSC-200L) |
| Cleaning Modules | DI Water Pre-Rinse, Dual-Side PVA Brush Scrubbing, Optional Megasonics, N₂ Dry Blow-Off, High-Speed Spin Dry |
| Control System | PLC with HMI Touchscreen Interface |
| Automation Level | Manual Loading (TSC-100/TSC-300S), Fully Automated Dual-Arm Robotic Handler (TSC-200L) |
| Footprint | Compact Design Optimized for Cleanroom Space Efficiency |
| Output State | Wet-in, Dry-out Process Flow |