ULVAC
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| Brand | ULVAC |
|---|---|
| Model | EI-5Z |
| Evaporation Sources | Dual-mode (Electron Beam + Resistive Thermal) |
| Substrate Compatibility | 2–8 inch wafers (Si, GaAs, glass, ceramics) |
| Base Pressure | ≤3.0 × 10⁻⁵ Pa |
| Pumping Speed | Achieves 3.0 × 10⁻⁴ Pa in ≤20 min |
| Thickness Uniformity | ±5% across substrate |
| Control System | Fully Automated PLC-Based Interface |
| Chamber Configuration | Vertical-Incidence Deposition |
| Optional Integration | Wall-Through (Penetrating) Design |
| Material Compatibility | Au, Ag, Al, Cr, Ni, Ti, ITO, SiO₂, Al₂O₃, and other conductive/insulating evaporants |