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| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Wafer Handling | Full 200 mm (8-inch) diameter |
| Imaging Mode | Field Emission Scanning Electron Microscopy (FE-SEM) |
| Primary Application | Semiconductor Process Defect Inspection & CD Metrology |
| Vacuum System | Differential pumping with cold trap |
| Stage Type | Motorized polar-coordinate stage with collision-avoidance logic |
| Detector Configuration | In-lens EsB, SE2, and STEM-in-SEM options |
| Operating Voltage Range | 0.1–30 kV |
| Resolution | ≤1.0 nm @ 1 kV (in-lens SE mode) |
| Software Platform | SmartSEM Engineering Edition with wafer map navigation and recipe-driven automation |
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