Dicing Saw
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| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Model | 6110 |
| Spindle Power | 2.2 kW |
| Max Spindle Speed | 60,000 rpm |
| Spindle Torque | 0.42 N·m |
| θ-Axis Drive | Direct-Drive (DD) Motor |
| Machine Width | 490 mm |
| Control Interface | 17-inch LCD Touchscreen GUI |
| Standard Features | Auto-Calibration, Auto-Cutting, Blade-Trace Inspection |
| Optional Features | Fragment Shape Recognition, One-Touch Position Verification |
| Sample Compatibility | Si, SiC, GaAs, Glass, Ceramic, Solar Wafers |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Region of Manufacture | Domestic (China) |
| Model | 7234 |
| Pricing | Upon Request |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Model | 7920 |
| Blade Diameter Range | 2"–3" |
| Maximum Spindle Speed | 60,000 rpm |
| Spindle Power | 1.2 kW per axis |
| Workpiece Capacity | Ø12" or 12" × 10" |
| X-Axis | Pneumatic Linear Slide |
| Y-Axis Resolution | 0.1 µm |
| Z1/Z2-Axis Resolution | 0.2 µm |
| Z1/Z2 Travel | 30 mm |
| Z1/Z2 Repeatability | ±1.0 µm |
| θ-Axis Repeatability | ±4 arc-sec |
| θ-Axis Travel | 350° |
| Cumulative Positioning Accuracy | ±1.5 µm |
| Step Positioning Accuracy | ±1.0 µm |
| Electrical Supply | 200–240 VAC, 50–60 Hz, Single-Phase |
| Dimensions (W×D×H) | 875 × 975 × 1450 mm |
| Weight | 900 kg |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (China) |
| Model | 8230 |
| Pricing | Available Upon Request |
| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AX-LS100 |
| Maximum Linear Cutting Speed | 800 mm/s |
| Application Scope | Semiconductor Wafer Dicing |
| Maximum Wafer Size | 300 mm (12-inch) |
| Laser Class | Class 1 Enclosure |
| Dimensions (W×L×H) | 1530 × 900 × 2229 mm |
| Weight | 750 kg |
| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | AX-LS1000 |
| Maximum Linear Cutting Speed | 200 mm/s |
| Maximum Dicing Speed (YAG variant) | 140 mm/s |
| Maximum Dicing Speed (Semiconductor Laser variant) | 220 mm/s |
| Kerf Width | 30 µm |
| Cooling | Integrated Air-Cooling System |
| Configuration | T-Stage Dual-Station Platform |
| Laser Source Type | Fiber Laser (Standard), Optional YAG or Diode-Pumped Semiconductor Laser |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | MPPS |
| Maximum Wire Saw Speed | 400 mm/s |
| Sample Stage | Vacuum-Chuck with Rotatable Platform (Max Ø200 mm) |
| Angular Adjustment Resolution | 0.006° (Range ±4°) |
| Scribing Stroke Length | 250 mm |
| Scribing Width | 240 mm |
| Positioning Accuracy | 0.01 mm |
| Max Sample Thickness | 10 mm |
| Adjustable Scribing Force | 5–581 g |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S100 Semi-Automatic Scribe & Break System |
| Scribing force range | 10–80 g (constant-weight mechanism, optional auxiliary weights) |
| Diamond scribe tip | adjustable angle and rotational orientation |
| Wafer chuck capacity | up to 4-inch diameter |
| Die size compatibility | 100 µm × 100 µm minimum to 10 mm × 10 mm maximum |
| Wafer thickness tolerance | ≥50 µm |
| XY stage resolution | 0.23 µm |
| Optical imaging system | 22″ TFT display + ultra-HD color camera |
| Digital zoom | ×10 electronic |
| Break mode | manual or programmable auto-actuation |
| Break mechanism | top rubber clamping + bottom linear blade actuation |
| Control interface | 7″ capacitive touchscreen |
| Y-axis scribing speed | 0.1–20 mm/s |
| Power supply | 100/230 VAC, 1 kW |
| Pneumatic supply | 70 psi |
| Vacuum requirement | full vacuum (100%), 15 L/min flow rate |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm (25 × 32 × 60 in) |
| Weight | 70 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S200 Semi-Automatic Scriber and Breaker |
| Power Supply | 100–230 VAC, 1 kW |
| Air Pressure | 80 psi |
| Vacuum System | 100% vacuum, 15 L/min |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm |
| Weight | 70 kg |
| Wafer Handling | 2″ to 8″ |
| Minimum Die Size | 100 µm × 100 µm |
| Maximum Die Size | 150 mm × 150 mm |
| Z-axis Force Range | 5–80 g (adjustable via calibrated weights) |
| Diamond Scribe Tip | Adjustable angle & rotation |
| XY Stage Resolution | 1 µm (display), ±5 µm (positioning accuracy) |
| Y-axis Scribing Speed | 0.1–100 mm/s |
| Optical System | 22″ TFT monitor, ultra-HD color camera, electronic zoom ×10, LED illumination, JFP crosshair reticle |
| Control Interface | 7″ touchscreen, programmable step indexing & vertical spacing, scribe count & die ID logging |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MR200 |
| Price Range | USD 13,500 – 40,500 (FOB) |
| Maximum Scribing Length | 200 mm |
| Scribing Force Range | 10 g – 130 g |
| Diamond Blade Contact Width | 5 µm – 10 µm |
| Zoom Microscope Magnification | 8× – 40× (continuous, stepless) |
| Optical Resolution at 10× | < 10 µm |
| X/Y Manual Stage Travel | 200 mm × 200 mm |
| Fine Positioning Accuracy | 0.01 mm (X/Y), 0.006° (rotation) |
| Wafer Chuck Diameter | 200 mm (standard), optional 100 mm |
| Vacuum Hold-Down Pressure | < 75 mbar |
| Power Supply | 100–220 V AC, 60 W |
| Dimensions (W×D×H) | 430 mm × 700 mm × 550 mm |
| Weight | ~16 kg |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | LatticeAx 225 |
| Maximum Scribe Line Speed | 600 mm/min |
| Application Scope | Semiconductor Wafers, MEMS, Optoelectronics, and Thin-Film Devices |
| Positioning Accuracy | ±20 µm |
| Scribe Impression Length | <1 mm |
| Impression Width | ~10 µm |
| Imaging System | USB 2.0 Digital Microscope with Polarizing Filter and Real-Time Capture Software |
| Vacuum Fixation | Pneumatically Actuated Valve-Controlled Pump |
| Sample Compatibility | Si, SiC, GaAs, Sapphire, Glass, Quartz, and Thin-Film Substrates (Ø50–300 mm, Thickness 100–1000 µm) |
| Origin | USA |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Imported |
| Model | PELCO LatticeAx 420 |
| Price Range | USD 0–15,000 |
| Maximum Scribe Speed | 500–600 mm/min |
| Application Scope | Laboratory Use |
| Positioning Accuracy | ±10 µm |
| Indentation Step Resolution | 5 µm |
| Optical Magnification | 0.58–7× (zoom, parfocal, monocular) |
| Camera | Color CCD |
| Diamond Scribing Tip | Polished Single-Point Diamond |
| Focusing Mechanism | Coarse + Fine Focus Stage |
| Footprint | Compact Industrial Platform |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Type | Manual Cleaving Instrument |
| Model | Small Sample Cleaver |
| Sample Width Capacity | 3–15 mm |
| Sample Thickness Range | 200–900 µm |
| Cleave Platform Dimensions | ≤2 × 2 mm |
| Indent Length | 0.5 mm |
| Compatibility | Designed for use with PELCO® LatticeAx® (1 mm indent) |
| Mounting | Four magnetic fixation points |
| Portability | Handheld, volume ≈ 100 mm³ |