Flip Chip Bonder
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| Brand | JFP |
|---|---|
| Origin | France |
| Type | Imported Semiconductor Assembly & Packaging Equipment |
| Model | PP Stacker |
| Application | Precision Pick-and-Place, Stacking & De-stacking of Laser Diode Bars |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Software | JFP StackerControl v3.2 with Audit Trail & Event Logging |
| Power Supply | 100/230 VAC, 1 kW |
| Pneumatic Requirements | Dry air at 5 bar, vacuum ≥90% |
| Dimensions (W×D×H) | 900 × 830 × 1750 mm |
| Throughput | 600 units/hour (single bar + single spacer cycle) |
| Pick-up Force | <5 g (non-damaging micro-handling) |
| XY Stage Resolution | 1 µm (micrometer-adjustable manual stage) |
| Vision System | Triple 5 MP color cameras (vertical orientation), independent digital video control, LED illumination (adjustable intensity), field-of-view up to 20 mm, continuous optical zoom, 11× digital zoom, PIP mode (3 windows), calibrated scale bar (0.6 mm @ 20×) |
| Sample Compatibility | Laser diode bars (max. 18 mm length |
| Tooling Options | Manual blue-tape ejection kit |