Lithography & Coating/Developing Equipment
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| Brand | Kingsemi |
|---|---|
| Origin | Liaoning, China |
| Model | KS-FT200/300 (8"/12" Front-End Process) |
| Application | ArF/KrF/I-Line photoresists, PI, BARC, SOC, SOD, SOG |
| Integration | Compatible with track-to-scanner inline lithography systems |
| Certification | Compliant with SEMI S2/S8 safety standards, ISO 14644-1 Class 5 cleanroom operation |
| Architecture | Modular stackable design |
| Thermal Control | Optional high-precision hot/cold plates (±0.1°C uniformity) |
| Inspection | Optional integrated Wafer Edge Exposure (WEE) and Automated Optical Inspection (AOI) modules |
| Maintenance | Front-accessible modular units with tool-less panel removal |
| Brand | Kingsemi |
|---|---|
| Model | KS-S150 |
| Configuration | Star-type fully automated coater/developer |
| Substrate Compatibility | Sapphire, GaAs, SiC wafers (4", 6") |
| Throughput | ≥190 wafers/hour (coating module) |
| Photoresist Consumption | 0.6 mL per 4" wafer |
| Certification | CSA Certified |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Coater/Developer for Patterning Processes |
| Application Scope | LED-PSS, compound semiconductor fabrication, sensor ICs, optical communication chips, power devices, patterned sapphire substrates |
| Brand | Kingsemi |
|---|---|
| Model | KS-S150-6ST |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Resist Stripping System |
| Configuration | 6-Station Wet Processing Platform |
| Vacuum Handling | Dual-Vacuum Dual-Clamp High-Speed Robotic Arm |
| Alignment | Automated Wafer Centering (AWC) with Vision-Based Recognition |
| Bath Compatibility | Multi-Size & Multi-Angle Immersion Modules (150 mm to 200 mm wafers) |
| Pressure Control | Closed-Loop High-Pressure Fluid Delivery (±0.2 MPa accuracy) |
| Heating System | In-Line High-Pressure Resistant Heater (PID-controlled, ≤120 °C) |
| Chuck Type | Actively Clamped, Backside-Protected Electrostatic/ Mechanical Chuck |
| Chemical Recovery | Integrated Solvent Recovery and Recirculation Loop |
| Compliance | Designed for Class 100 Cleanroom Integration |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | H6-15 |
| Maximum Speed | 12,000 rpm (at 100 mm Si wafer) |
| Substrate Compatibility | up to 300 mm wafers and 9″ × 9″ (229 mm × 229 mm) square substrates |
| Control Interface | Wireless tablet with Laurell Touch software |
| Firmware Upgradability | Field-upgradable via downloadable updates |
| Software | Spin3000 PC-based process management suite (free, includes virtual simulation mode) |
| Enclosure Compatibility | Designed for integration into gloveboxes |
| Modular Expansion | Field-upgradable via plug-in modules |
| Compliance | Supports GLP/GMP traceability requirements through audit-ready process logging |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | WS-650-8B |
| Maximum Substrate Size | 200 mm wafer or 178 mm × 178 mm square substrate |
| Max Speed | 12,000 rpm (at 100 mm Si wafer) |
| Controller | 650 Series Microprocessor-Based Process Controller |
| Software | Spin3000 PC Control & Simulation Suite (free, optional but fully compatible) |
| Housing Material | Chemically resistant solid copolymer blend (standard) or PTFE Hostaflon® TFM-1600 / Teflon® AF (optional, high-temp/ultra-clean) |
| Sealing | Proprietary labyrinth seal with N₂ purge capability |
| Compliance | Designed for ISO Class 5–4 cleanroom integration |
| Brand | LEBO Science |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-2 |
| Wafer Compatibility | Fragments to 200 mm (customizable up to 300 mm with quad-nozzle configuration) |
| Development Modes | Single-step & Multi-step Programmable Process |
| Max. Spin Speed | 3000 rpm (no-load) |
| Speed Resolution | ±1 rpm |
| Acceleration Range | 10–10,000 rpm/sec (no-load) |
| Step Duration Range | 0–3000 sec |
| Time Resolution | 0.1 sec |
| Nozzle Control | Motorized XYZ-positioning with programmable trajectory |
| Fluid Delivery | 1 dedicated developer channel + 1 deionized water rinse channel + 1 N₂ purge channel |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Software | Onboard HMI with 100 user-editable process recipes |
| Brand | Makeway |
|---|---|
| Origin | USA |
| Model | MKW-280 |
| Mask Size | 5 in |
| Wafer/Substrate Size | 5 in |
| Alignment Accuracy | 1 µm (Vacuum Contact), 1.5 µm (Hard Contact), 3 µm (Soft Contact), 5 µm (Proximity Mode) |
| UV Source | 350 W, 365 nm, uniformity ±3%, irradiance 30 mW/cm² |
| Exposure Time Range | 0.1–999 s |
| Chuck Motion | Manual X/Y/Z/θ with wedge compensation leveling |
| Microscopy | Dual CCD-based system, 80×–400× standard, up to 1000× with optional lenses, working distance 50–150 mm |
| Display | 20" LCD monitor |
| Contact Modes | Vacuum contact (adjustable force), hard contact, soft contact, proximity (gap adjustable) |
| Power Supply | 220 V, single-phase, 15 A |
| Optional | Deep UV source, IR alignment mode, custom substrate chucks |
| Brand | Makeway |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Region of Origin | Domestic (China) |
| Model | MKW-320 |
| Price Range | USD 21,000 – 55,000 |
| Brand | Midas |
|---|---|
| Origin | South Korea |
| Manufacturer Status | Authorized Distributor |
| Origin Category | Imported |
| Model | MDA-400LJ |
| Pricing | Upon Request |
| Mask Size Max | 5-inch |
| Substrate Size Max | 4-inch circular wafers |
| Beam Shape | Circular |
| Beam Diameter | 125 mm |
| Light Source | UV LED |
| Wavelength | 365 nm |
| Beam Uniformity | < ±3 % |
| Peak Irradiance at 365 nm | 25 mW/cm² |
| Alignment Method | Manual |
| Alignment Accuracy | ±1 µm |
| Exposure Modes | Soft Contact, Hard Contact, Proximity (Vacuum-assisted) |
| Resolution | 1 µm (with 1 µm photoresist thickness under vacuum contact) |
| Weight | 150 kg |
| Dimensions (W×D×H) | 995 × 800 × 850 mm |
| Brand | MIDAS |
|---|---|
| Origin | South Korea |
| Model | MDA-400M |
| Exposure Source | Ushio 350W UV Lamp (or optional 365 nm LED, 10,000 h lifetime) |
| Resolution | 1 µm (vacuum/hard contact), 2 µm (soft contact), 5 µm (20 µm gap proximity) |
| Beam Size | 4.25 × 4.25 inch |
| Uniformity | ≤3% (over 4-inch field) |
| Intensity | >30 mW/cm² @ 365 nm |
| Exposure Time | 0.1–999.9 s |
| Alignment Accuracy | ±0.5 µm |
| Stage Travel | X/Y ±10 mm, θ ±5°, Z ±10 mm |
| Approach Step Resolution | 1 µm |
| Microscopy | Dual CCD zoom microscope (80×–480×), 17″ LCD monitor |
| Substrate Compatibility | 2″, 3″, 4″ wafers |
| Mask Size | 4″ and 5″ |
| Vacuum Requirement | < −200 mbar (integrated oil-free pump) |
| CDA | >5 kg/cm² |
| N₂ | >3 kg/cm² |
| Power | 220 V, 15 A, single-phase |
| Brand | Midas |
|---|---|
| Origin | Germany |
| Model | SPIN150X |
| Max. Rotation Speed | 12000 rpm |
| Speed Accuracy | ±1 rpm |
| Max. Acceleration | 30000 rpm/s |
| Substrate Diameter | up to 160 mm (6") |
| Chamber Diameter | 202 mm |
| Controller Memory | 50 programs × 99 steps each |
| Programmable Outputs | 2 dry-contact relays |
| Dimensions (W×D×H) | 275 × 240 × 450 mm |
| Housing Material | Natural Polypropylene (NPP) or PTFE options |
| Sample Compatibility | 5 mm to 160 mm round wafers or 4" × 4" square substrates |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P130 / S130 |
| Price Range | USD 280,000 – 420,000 |
| UV Light Source | 405 nm LED |
| XY Resolution | 2–10 µm |
| Layer Thickness | 5–20 µm |
| Build Volume (P130) | 3.84 × 2.16 × 10 mm (Mode 1) / 38.4 × 21.6 × 10 mm (Mode 2) / 50 × 50 × 10 mm (Mode 3) |
| Build Volume (S130) | Up to 100 × 100 × 50 mm |
| Optical System | High-NA Projection Micro-Lithography Optics |
| Post-Processing | Integrated Vacuum Despersion + UV Curing Station |
| Power Requirement | 200–240 V AC, 50/60 Hz, 3 kW |
| Weight | 450 kg |
| Dimensions | 1720 × 650 × 1820 mm |
| Brand | Nanoscribe |
|---|---|
| Country of Origin | Germany |
| Model | Photonic Professional GT2 |
| Category | Two-Photon Polymerization (TPP) Microfabrication System |
| Automation Level | Fully Automated |
| User Interface | Intuitive Graphical Workflow Environment |
| Compliance Framework | Designed for ISO 14644-1 Class 5 cleanroom integration |
| Software Architecture | Windows-based, FDA 21 CFR Part 11–ready audit trail support (optional configuration) |
| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CNI V4.0 PV |
| Pricing | Upon Request |
| Imprint Area | Up to Ø210 mm (8″) |
| Chamber Height | 20 mm |
| Thermal NIL Max Temp | 200 °C (optional 250 °C module) |
| UV-NIL Wavelength | 365 nm (optional 405 nm module) |
| Vacuum Level | ≤0.1 mbar |
| Maximum Imprint Pressure | 11 bar |
| Control Interface | Laptop-based with dedicated software |
| Automation Level | Fully automated process execution (manual stamp/substrate loading) |
| Form Factor | Benchtop, modular, plug-and-play |
| Brand | NS |
|---|---|
| Origin | Japan |
| Model | 4 IBE |
| Sample Holder | 4" φ, single wafer |
| Ion Incidence Angle | 0° to ±90° |
| Ion Source | KDC-40 Kaufman-type (KRI, USA) |
| Base Pressure | ≤1×10⁻⁴ Pa |
| Turbomolecular Pump | Pfeiffer, 350 L/s |
| Etch Uniformity | ≤±5% |
| Cooling | Direct substrate cooling |
| Motion Control | Planetary rotation (rotation + revolution) |
| Gas Compatibility | Ar, O₂, N₂, CF₄, Xe, and mixed process gases |
| Brand | AYAO Instruments |
|---|---|
| Origin | South Korea |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | LithoMaskless |
| Exposure Mode | Projection-Based |
| Resolution | 0.5 µm |
| Light Source | UV LED |
| Wavelength Options | 365 nm / 385 nm / 405 nm |
| Maximum Exposure Area | 100 mm × 100 mm |
| DMD Chip Size | 0.65-inch |
| Compatibility | Broad photoresist & substrate support (Si, SiO₂, glass, quartz, flexible polymers) |
| Alignment Method | Integrated high-magnification optical alignment with real-time feedback |
| Brand | SPS-POLOS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Instrument |
| Model | BEAM |
| Resolution | 0.8 µm (CD) |
| Light Source | Laser Galvanometer + 405 nm Laser Diode |
| Exposure Field | 150 mm × 150 mm |
| Substrate Compatibility | 4″–6″ wafers |
| Focus Actuation | Piezoelectric auto-focus with closed-loop optics (<1 s settling time) |
| Alignment | Semi-automatic multi-layer collimation (completed in minutes) |
| Compatible Resist | AZ5214E |
| Software Interface | GDSII-native GUI with wafer-level navigation, layer overlay, and CNC-style motion control |
| Brand | PolyPico |
|---|---|
| Origin | Denmark |
| Model | UniA6 |
| Imprint Methods | Thermal, UV (365 nm), Vacuum-assisted |
| Max Substrate/Stamp Diameter | 210 mm (8″) |
| Chamber Height | 20 mm |
| Max Imprint Pressure | 11 bar |
| Thermal Range | Up to 200 °C (optional 250 °C module) |
| UV Wavelengths | 365 nm (standard), 405 nm (optional) |
| Vacuum Level | ≤ 0.1 mbar |
| Control | Fully automated via laptop-based software |
| Form Factor | Benchtop, modular, plug-and-play |
| Brand | Alpha Plasma |
|---|---|
| Origin | Germany |
| Model | Q235 (Q-Series) |
| Type | Benchtop Microwave Plasma Asher/Stripper |
| Application Domain | Semiconductor Front-End-of-Line (FEOL) & MEMS Fabrication |
| Compliance | CE-marked, ISO 9001–certified manufacturing, compatible with cleanroom Class 100/ISO 5 environments |
| Brand | Raith / Simax |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | PicoMaster XF ATE-200 |
| Exposure Mode | Proximity Mode |
| Resolution | 600 nm |
| Light Source | GaN Laser Diode |
| Wavelength | 405 nm |
| Illumination Uniformity | ±5% |
| Maximum Exposure Area | 200 mm × 200 mm |
| Maximum Write Speed | 280 mm²/min |
| Minimum Feature Size | 600 nm |
| Brand | Raith |
|---|---|
| Origin | Germany |
| Model | Pioneer Two |
| Electron Source | Thermal Field Emission Gun |
| Accelerating Voltage Range | 20 V – 30 kV |
| Minimum Guaranteed Resolution (Line Width) | ≤8 nm |
| Stage Travel (X/Y/Z) | 50 mm × 50 mm × 25 mm |
| XY Positioning Accuracy | ±2 nm |
| Overlay/Pattern Stitching Accuracy | ≤50 nm |
| Imaging Magnification Range | 20× – 1,000,000× |
| Optional Add-ons | Backscattered Electron Detector (BSED), Energy-Dispersive X-ray Spectrometer (EDS), Tilt-Rotation Stage Module |
| Brand | SAMCO |
|---|---|
| Origin | Japan |
| Model | UV-300H |
| Maximum Sample Diameter | Ø800 mm (8-inch) |
| Operating Environment | Ambient Atmospheric Pressure |
| Heating Stage Temperature Range | Room Temperature to 150 °C |
| Safety Features | Interlocked Lid, Ozone Catalyst Scrubber, N₂ Purge Cycle, Thermal Fuse Protection, Emergency Stop |
| Compliance | Designed for ISO Class 5–7 Cleanroom Integration |
| Brand | SCIL |
|---|---|
| Origin | Netherlands |
| Model | LabSCIL |
| Wafer Size | Up to 8-inch (200 mm) |
| Alignment Accuracy | < 1 µm |
| Imprint Technology | Low-Force Soft-Mold Substrate-Conformal Nanoimprint |
| Compatible Resists | Thermal Sol-Gel, UV Sol-Gel, UV Organic |
| Wafer Thickness Range | 0.3–2.5 mm |
| Footprint (W×L×H) | 1.8 × 1.4 × 2.2 m |
| Resist Application | External Spin-Coater Required |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Software | SCIL Control Suite with Audit Trail & Parameter Logging |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SI 500 |
| Price | USD 295,000 (FOB Hamburg) |
| RF Source Frequency | 13.56 MHz |
| ICP Power | 1200 W |
| Bias RF Power | 600 W |
| Plasma Source | Planar Triple Spiral Antenna (PTSA) |
| Endpoint Detection | Interferometric In-situ Monitoring |
| Vacuum System | High-throughput Dry Pumping with Independent Gas Flow & Pressure Control |
| Software | SENTECH Advanced Plasma Process Control (APPC) v5.x |
| Brand | Sindin |
|---|---|
| Model | ST-2100MW |
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (PRC) |
| Pricing | Available Upon Request |
| Brand | SUNJUNE |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | VP-RS6 |
| Price Range | USD 7,000 – 14,000 |
| RF Power | 500 W |
| RF Frequency | 13.56 MHz |
| Chamber Material | 304 Stainless Steel |
| Max Operating Temperature (Chamber Wall) | ≤45 °C at Full Power (3 min) |
| Vacuum Display | Digital Pressure Readout |
| Gas Inlets | Dual Mass-Flow Controlled Ports |
| Control Interface | 7-inch Capacitive Touchscreen |
| Software Certification | China Copyright Registration No. 2021SR1026389 |
| Warranty | 24 Months Limited Hardware Warranty |
| Brand | WUXI CAS PHOTONICS INC |
|---|---|
| Origin | Sichuan, China |
| Model | URE-2000S/25A |
| Exposure Area | 6-inch wafer |
| Exposure Wavelength | 365 nm (i-line) |
| Irradiance | >25 mW/cm² |
| Resolution | 1 µm |
| Alignment Accuracy | ±2 µm (double-side, 0.8 mm substrate thickness), ±0.8 µm (single-side) |
| Illumination Uniformity | ≤2.5% (Φ100 mm), ≤4% (Φ150 mm) |
| Mask-to-Wafer Motion Range | X: ±5 mm, Y: ±5 mm, Θ: ±6° |
| Mercury Lamp | 350 W DC, imported (OSRAM) |
| Collimation Angle | 3.5° |
| Maximum Photoresist Thickness | 350 µm (SU-8, under specified process conditions) |
| Dimensions (L×W×H) | 1300 × 900 × 1800 mm |
| Origin | Sichuan, China |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Domestic (China) |
| Model | G-33D4 |
| Pricing | Available Upon Request |
| Exposure Mode | Contact Printing |
| Resolution | 1 µm (at 10× line depth ratio) |
| Light Source | High-Stability 365 nm UV LED |
| Illumination Uniformity | ±3% |
| Exposure Area | 110 mm × 110 mm |
| UV Intensity Range | 0–30 mW/cm² (adjustable) |
| Beam Divergence | ≤3° |
| UV Source Lifetime | ≥20,000 hours |
| Operating Surface Temperature | ≤30 °C |
| Alignment Accuracy | ≤1 µm |
| Optical Magnification | 91× to 570× (software-enhanced digital zoom) |
| Control System | 4-inch PLC with OMRON timing relay (0.1–999.9 s exposure) |
| Vacuum System | Direct-coupled vacuum pump with dual-stage anti-vibration isolation |
| Microscopy | Dual-field upright or horizontal stereo microscope with four 1/3″ CCD cameras and real-time imaging memory |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | ZEL304G |
| Pricing | Available upon request |
| Electron Source | Schottky field-emission gun |
| Acceleration Voltage | 20 V–30 kV |
| Image Resolution | ≤1 nm @ 15 kV, ≤1.5 nm @ 1 kV |
| Minimum Beam Spot Size | ≤2 nm |
| Beam Current | ≥100 nA |
| Beam Current Density | >7000 A/cm² |
| Beam Blanking Rise Time | <100 ns |
| Writing Field | ≥500 × 500 µm |
| Minimum Single-Exposure Line Width | <15 nm |
| Stage Travel | ≥105 mm |
| Stitching Accuracy | <50 nm (mean + 1σ) |
| Overlay Accuracy | <50 nm (mean + 1σ) |
| Scan Rate | ≥20 MHz (standard), up to 50 MHz (max) |
| D/A Resolution | 20-bit |
| Dwell Time Increment | 10 ns |
| Supported File Formats | GDSII, DXF, BMP |
| Scan Modes | Raster (Z-scan), serpentine (S-scan), spiral vector scanning |
| Exposure Modes | Field calibration, field stitching, multi-layer overlay, auto-exposure sequencing |
| Optional Features | Proximity effect correction (PEC), laser interferometric stage, Faraday cup beam current monitor, TTL-compatible beam blanking (5 V), external I/O for synchronized stage motion, beam blanking, SE detection, and scan control |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | ZML10A |
| Light Source | High-Intensity LED @ 405 nm |
| Uniformity | 96% |
| Minimum Achievable Feature Size | 0.5 µm |
| Exposure Field Size | 1.2 × 0.9 mm² (at 10× objective) |