Mask Photoresist Processing Cleaning Equipment
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| Brand | NIPPON FILCON |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Kayaku Advanced Materials SU-8 2000 Series Photoresists |
| Pricing | Upon Request |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | MaskTrack Pro |
| Application Scope | Automated cleaning, bake, and develop for photomasks & reticles |
| Compatibility | 90 nm to sub-1x nm half-pitch nodes |
| Process Capabilities | Front-side & backside cleaning, sulfur-free chemistry option, integrated particle detection readiness |
| Architecture | Cluster-compatible platform (with InSync, backside particle inspection, EUV mask storage) |
| Regulatory Context | Designed for ISO Class 1–5 cleanroom integration, supports GLP/GMP-aligned process documentation |
| Brand | MOJI-NANO |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) & Material Developer |
| Product Category | Domestic Advanced Photoresist for Maskless Direct Laser Writing |
| Model | 3D Micro/Nano-Scale Photoresist Series |
| Pricing | Available upon Technical Consultation |
| Brand | NIPPON FILCON |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | NIPPON KAYAKU KPM-500 DFR |
| Pricing | Upon Request |
| Brand | Ruipho |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | RZJ-304 |
| Viscosity Options | 25 mPa·s |
| Recommended Developer | RZX-3038 |
| Film Thickness Range (Spin-Coated) | 1.0–3.5 µm |
| Prebake | 100°C for 90 s |
| Exposure Dose | 50–75 mJ/cm² |
| Development | RZX-3038 at 23°C for 60 s |
| Post-Exposure Bake | 120°C for 120 s |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS300 |
| Application | Temporary bonding for 200 mm and 300 mm wafers |
| Substrate Compatibility | Silicon, glass carrier substrates (same or different diameters) |
| Alignment Method | Edge recognition + center alignment with GYRSET® technology |
| Coating Uniformity | Optimized via integrated non-contact multi-point thickness measurement |
| Process Steps Supported | Release layer deposition, adhesive spin-coating, low-force wafer bonding, UV or thermal curing, post-bond cooling |
| Platform Architecture | Modular, scalable throughput, minimized footprint |
| Adhesive Compatibility | Open platform supporting all commercially available temporary bonding adhesives |
| Compliance Context | Designed for semiconductor mask & reticle manufacturing environments compliant with ISO 14644-1 Class 5 cleanroom requirements and compatible with GLP/GMP-aligned process documentation workflows |