Mask Repair System
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| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Mask |
| Application | EUV photomask defect repair and metrology |
| Technology | Non-contact atomic force microscopy (AFM) |
| Key Capabilities | Defect detection, nanoscale mechanical removal, post-repair 3D topography verification |
| Compliance | Designed for cleanroom-integrated semiconductor mask shops |
| Deployment | Dual-pod compatible for inline EUV reticle handling |
| Operational Environment | Ambient air, no vacuum, no beam-induced charging, no chemical reagents |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Mask |
| Application | EUV photomask defect repair, AFM-based nanomechanical removal and verification |
| Compliance | Designed for ISO 14644-1 Class 1–5 cleanroom integration |
| Software | XEI™ with automated defect-to-repair workflow, audit-trail logging per FDA 21 CFR Part 11 requirements |
| Repair Mechanism | Non-contact, voltage-controlled AFM tip nanoscrubbing and localized mechanical lift-off |
| Resolution | Sub-5 nm lateral resolution in topography and phase imaging |
| Sample Handling | Dual-pod EUV reticle cassette compatibility (SEMI F47 compliant) |
| Vacuum Requirement | None |
| Charging Risk | Electrostatically neutral operation |
| Chemical Usage | Dry, solvent-free process |