Pick and Place Machine
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| Brand | Amadyne |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Fab1 / catAP / EMU |
| Pricing | Upon Request |
| Brand | budatec® |
|---|---|
| Origin | Germany |
| Model | VS 160 |
| Chamber Size | 160 × 160 mm² |
| Max. Chamber Height | 50 mm |
| Max. Process Temperature | 450 °C |
| Heating/Cooling Rate | up to 3 K/s |
| Atmosphere Control | Programmable N₂, N₂/H₂ (95/5), or Formic Acid (HCOOH) via Proportional Flow Valves |
| Temperature Monitoring | Independent Thermocouple Feedback Loop |
| Max. Load Capacity | 2.5 kg |
| Power Supply | 400 V / 16 A |
| Cooling Water Requirement | 10 slm |
| Process Visualization | Real-time Graphical Component Overview |
| Brand | JFP |
|---|---|
| Country of Origin | France |
| Model | PP6 / PP7 / MPS |
| Type | Manual Semiconductor Die Bonder & Pick-and-Place System |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Control Interface | Ergonomic joystick + 7-inch capacitive touchscreen |
| Optical System | UHD coaxial camera with adjustable magnification (10×–100×) |
| Bonding Capabilities | Epoxy, solder, eutectic, and formic acid-compatible chucks |
| Max Substrate Thickness | 100 mm |
| Min Die Size | 70 µm × 70 µm |
| Placement Accuracy | ±1 µm (repeatability under controlled lab conditions) |
| Optional Modules | Flip-chip alignment stage, dispensing module, ultrasonic bonding head, thermal chuck (60–250 °C) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | PP7 |
| Type | Semi-Automatic Pick-and-Place Die Bonder for Precision Semiconductor Assembly |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Mechanical Architecture | Vibration-isolated granite base with motorized Z-axis and coaxial optical alignment system |
| Imaging | Dual-axis programmable high-magnification telecentric optics with real-time focus tracking |
| Placement Accuracy | ≤ ±1.5 µm (3σ, under controlled environmental conditions) |
| Bond Height Independence | Achieved via dynamic focus-servo loop synchronized with Z-motion control |
| Substrate Compatibility | Wafers (up to 8″), ceramic packages, leadframes, and custom carriers with curvature compensation |
| Tooling Interface | Standard vacuum nozzle exchange (ISO 9409-1-22-6-40) |
| Software Platform | JFP ControlSuite v4.x with audit trail, user-level permissions, and exportable placement logs (CSV/Excel) |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Z-Axis Drive | Motorized |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | Sub-10 µm (typical, under optimized conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Placement Time | 1–10,000 ms (optional extension to 20,000 ms) |
| Placement Force | 10–150 cN·m (350 cN·m optional) |
| Vacuum Source | Integrated pump |
| Nozzle Diameter | Ø1.58 mm, 19 mm length |
| Z-Travel | 17 mm |
| Arm Length | 165 mm |
| X-Y Manipulator Range | ±10 mm |
| Mechanical Lever Ratio | 6:1 |
| Temperature Control | Up to 250 °C ±1 °C |
| Power Supply | 100–240 VAC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Mounting Type | Desktop |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | ±2 µm (typical, under calibrated lab conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Z-Axis Stroke | 17 mm (motorized) |
| Placement Force Range | 10–150 cN·m (350 cN·m optional) |
| Placement Time | 1–10,000 ms (extendable to 20,000 ms) |
| Dispensing Capability | Optional adhesive dispensing module |
| Dip-Coating Function | Integrated |
| Vacuum Source | Onboard integrated vacuum pump |
| Motion Architecture | True orthogonal X-Y-Z kinematics |
| Tool Changer | Rotating nozzle turret |
| Programmable Recipes | Up to 100 stored programs |
| Operating Modes | Manual, semi-automatic, and step-by-step guided placement |
| Heating Stage | Optional temperature-controlled platform (up to 250 °C ±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |