Plating Equipment
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| Brand | ULVAC KIKO |
|---|---|
| Origin | Japan |
| Model | CS-200Z |
| Configuration | Load-lock type, high-vacuum DC/RF magnetron sputtering system |
| Substrate Compatibility | Ti trays for Φ2″–Φ4″ wafers (max. Φ320 mm) and custom-shaped substrates (e.g., 50×50 mm²) |
| Control System | ULVAC GPCS-2700 integrated PLC + PC-based HMI (English interface) |
| Data Logging | Real-time parameter logging to PC with Excel export capability |
| Footprint | 1500 × 4500 mm (including service clearance) |
| Environment | Designed for Class 100–Class 1000 cleanroom integration |
| Brand | ZhiCheng |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-3 |
| Wafer Size | 150 mm – 300 mm |
| Uniformity Performance | Within-Wafer (WiW) ≤ 5%, Within-Lot (WtW) ≤ 5%, Run-to-Run (RtR) ≤ 5% |
| Configuration | Up to 3 Loadports, Up to 24 Plating Chambers (Cu, Ni, Sn/Ag, Au), Up to 4 Pre-wet Chambers, Up to 4 Rinse Chambers |
| Chamber Architecture | Horizontal, Cross-Contamination-Free |
| Maintenance Design | Modular |
| Sealing Technology | Elastomeric Gasket Sealing |
| Electrode Isolation | Anode-Cathode Separation for Electrolyte Stability |