Process Measurement & Detection Equipment
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Showing 31–53 of 53 results
| Brand | AiYao Instruments |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | IRIS S |
| Pricing | Available Upon Request |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Hybrid WLI |
| Wafer Compatibility | 300 mm (fully backward-compatible with 200 mm and smaller wafers) |
| Instrument Category | Optical Defect Inspection & Hybrid Metrology System |
| Primary Application | In-line semiconductor process monitoring and defect characterization |
| Core Technology Integration | Co-registered AFM + WLI on single platform |
| Measurement Capability | Sub-ångström vertical resolution (AFM), nanometer-level lateral resolution, µm-to-mm field-of-view (WLI) |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Hybrid WLI |
| Primary Technology | Integrated White Light Interferometry (WLI) and Atomic Force Microscopy (AFM) |
| Optical Modes | WLI & Phase-Shifting Interferometry (PSI) |
| Objective Lenses | 2.5×, 10×, 20×, 50×, 100× (motorized turret) |
| Interferometric Objective Type | Mirau |
| Measurement Principle | Coherence scanning interferometry with sub-nanometer vertical resolution |
| Application Domain | Semiconductor front-end & back-end process control, advanced packaging metrology, wafer-level defect review, CMP characterization, GLP/GMP-compliant R&D and inline QA |
| Brand | Photonic Lattice |
|---|---|
| Origin | Japan |
| Model | PA-300-XL |
| Measurement Wavelength | 520 nm |
| Birefringence Range | 0–130 nm |
| Minimum Resolution | 0.001 nm |
| Repeatability | <0.1 nm |
| Field of View (Standard) | 40×48 mm to 240×320 mm |
| Polarization Camera | 2056×2464 pixels |
| Output Parameters | Retardance [nm], Fast-Axis Orientation [°], Stress-Converted Value [MPa] (optional) |
| Optional Modules | Real-time Analysis Software, Lens Aberration Analysis Software, External Control Interface, Interchangeable Lens Kits |
| Brand | ZENO |
|---|---|
| Origin | Shanghai, China |
| Model | PULSAR L-Series & PULSAR H-Series |
| Category | Semiconductor Wafer Defect Detection Instrument |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (China) |
| Pricing | Upon Request |
| Brand | PVA TePla |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | SAM Premium |
| Pricing | Available Upon Request |
| Brand | PVD |
|---|---|
| Origin | USA |
| Distributor Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Standard Particles |
| Price | Upon Request |
| Brand | Rayscience |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Semiconductor Instrument |
| Model | CDE ResMap |
| Automation Level | Fully Automated |
| Probe Tip Material | Tungsten Carbide |
| Typical Probe Load Force | 100–200 g |
| Compatible Wafer Sizes | 50 mm (2″) to 150 mm (6″) |
| Measurement Mode | Four-Point Collinear Probe (Van der Pauw geometry compatible) |
| Data Acquisition Rate | Up to 4,000 data points per measurement site |
| Interface | Windows-based GUI with recipe-driven operation |
| Calibration Interval | Extended (≥12 months under GLP-compliant usage) |
| Configurable Probe Heads | Dual–quadruple probe head options for 300 mm platform (not included in base model) |
| Brand | ROOKO |
|---|---|
| Model | FT-361 |
| Origin | Zhejiang, China |
| Automation Level | Manual |
| Compliance | GB/T 1551–2018 (Silicon Single Crystal Resistivity Test Method), ASTM F84–20 |
| Sheet Resistance Range | 10⁻⁶–2×10² Ω/□ |
| Resistivity Range | 10⁻⁷–2×10³ Ω·cm |
| Test Current | 0.1 μA, 1 μA, 10 μA, 100 μA |
| Current Accuracy | ±0.1% of reading |
| Resistance Measurement Accuracy | ≤0.3% |
| Overall System Uncertainty | ≤4% (verified against NIST-traceable standard wafers) |
| Probe Spacing Options | 1 mm, 2 mm, 3 mm |
| Probe Tip Materials | Tungsten Carbide, Stainless Steel, Gold-Plated Phosphor Bronze Hemispherical Tips |
| Display | 4.3-inch TFT LCD showing R, ρ, Rₛ, T, σ, d, αₜ, V, I, probe geometry, spacing, thickness, unit conversion |
| Power Input | AC 220 V ±10%, 50 Hz |
| Max Power Consumption | <30 W |
| Optional Accessories | PC control software (with audit trail & CSV/PDF export), square probe head, linear probe head, motorized XYZ test stage, thermal chamber interface kit |
| Brand | ROOKO |
|---|---|
| Origin | Zhejiang, China |
| Model | FT-371 |
| Measurement Range | 10¹–2×10¹⁰ Ω/□ |
| Resistivity Range | 10²–2×10¹¹ Ω·cm |
| Test Current | 1 mA – 1 pA |
| Current Accuracy | ±0.1% of reading |
| Resistance Accuracy | ≤5% (≤10⁸ Ω), ≤20% (>10⁸ Ω) |
| Display | 4.3" LCD showing R, ρ, Rₛ, T, σ, probe geometry, spacing, thickness, temp. coeff., I/V |
| Measurement Method | Dual-electrode four-point probe (linear or square configuration) |
| Power Supply | AC 220 V ±10%, 50 Hz, <30 W |
| Overall Uncertainty | ≤4% (certified standard sample) |
| Optional Accessories | PC control software, square probe head, linear probe head, temperature-controlled test platform, probe spacing (1/2/3 mm), probe tip materials (tungsten carbide, stainless steel, gold-plated phosphor bronze hemispherical) |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | SENDIRA |
| Spectral Range | 400–6,000 cm⁻¹ (1.7–25 µm) |
| Detector Options | DTGS or MCT |
| Integrated FTIR Platform | Compatible with Thermo Fisher iS50 |
| Software | SpectraRay/4 + Dedicated FTIR Control Suite |
| Optical Configuration | Purged ellipsometer optics, motorized goniometer, horizontal sample stage, auto-collimating telescope |
| Application Domain | Vibrational spectroscopic ellipsometry for thin-film metrology |
| Brand | SOPTOP |
|---|---|
| Origin | Zhejiang, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (China) |
| Model | AWL Series |
| Pricing | Upon Request |
| Primary Applications | Front-end & back-end wafer process monitoring, outgoing wafer quality control |
| Supported Wafer Diameters | 100 mm, 150 mm, 200 mm, 300 mm |
| Configurations | AWL046 (4″/6″), AWL068 (6″/8″), AWL812 (8″/12″) |
| Macro Inspection | 360° full-rotation stage with dual-side tilt (front-side max 70°, back-side 1 max 90°, back-side 2 max 160°) |
| Micro Inspection | Semi-apochromatic metallurgical objectives supporting brightfield, darkfield, DIC, and polarized light modes |
| Vacuum Chuck | Manual quick-release mechanism |
| Control System | Motorized precision stage with μm-level defect resolution |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | SpectraRay/4 |
| Software Type | Spectroscopic Ellipsometry Data Acquisition, Modeling & Analysis Platform |
| Material Database | Integrated Comprehensive Library (Oxides, Nitrides, Metals, Polymers, Amorphous Si, Organic Layers, etc.) |
| Dispersion Models | Cauchy, Tauc-Lorentz, Cody-Lorentz, Drude, Sellmeier, B-Spline, User-Defined Custom Models |
| Mapping Capabilities | 2D Color/Contour/Deviation/3D Surface Plots, Statistical Summary (Mean, Std Dev, Min/Max, Histograms) |
| Simulation Engine | Wavelength-, Angle-, Energy-, Temperature-, Time-Dependent Optical Response Modeling |
| Reporting | Export to Microsoft Word (*.doc), Full Experiment Archiving (Raw Data, Model Definitions, Fitting Logs, Annotations) |
| Scripting | Python-based Automation Interface for Hardware Control (Stages, Heaters, Cryostats, Environmental Chambers) |
| Compliance Support | Audit Trail Logging, User Access Levels, Electronic Signature Ready (FDA 21 CFR Part 11–ready architecture) |
| Brand | SuPro Instruments |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Product Origin | Domestic (China) |
| Model | FST 5000 |
| Price | USD 84,000 (approx.) |
| Stress Measurement Range | 1–10,000 MPa (tensile or compressive) |
| Measurement Technology | Dual-Wavelength Laser Scanning |
| Operating Temperature | Ambient (20–25 °C) |
| Brand | TZTEK |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | TB Series |
| Instrument Category | Optical Patterned Wafer Defect Inspection System |
| Primary Application | Semiconductor Wafer Defect Detection |
| Supported Wafer Diameters | 200 mm (8-inch), 300 mm (12-inch) |
| Compliance | Designed for integration into semiconductor front-end and back-end process lines |
| Brand | Vistron |
|---|---|
| Manufacturer | Laser oFab GmbH |
| Origin | Germany |
| Model | Laser oFab EUV Tube |
| EUV Peak Wavelength | 13.5 nm |
| Spectral Bandwidth (FWHM) | ~1 nm |
| Power Output (2π, 2% BW @ 13.5 nm) | ≤20 µW |
| Long-Term Intensity Stability (72 h) | <1% RMS |
| Source Size (FWHM) | Adjustable from <10 µm to ≥100 µm |
| Vacuum Interface | DN 16 CF flange |
| Emission Cone | 30° full angle, centered on flange axis |
| Target Material | Solid-state (L2,3-transition optimized) |
| Operating Voltage/Current | Software-controlled |
| Compliance | Designed for UHV-compatible metrology environments |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | CC Series |
| Cooling Option | Optional Water-Cooled FXT 160.51 X-ray Tube |
| Detector Modes | Standard & Low-Dose Mode |
| Software Suite | micro3Dslice, FF CT, VoidInspect, eHDR Dynamic Enhancement Filters |
| Load Capacity (Optional) | < 20 kg |
| Voltage Range | Optimized for Low-Voltage High-Resolution Imaging (≤ 160 kV) |
| Compliance | Designed for ISO/IEC 17025-aligned QA workflows, supports GLP/GMP audit trails via software logging |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF Series |
| Operating Voltage | Up to 600 kV |
| Detector | 3-Line Detector Array (LDA) with 254 µm pixel pitch |
| Dynamic Range | High |
| Signal-to-Noise Ratio | Exceptional |
| Scan Modes | 2D, 3D, Helical (HeliExtend), Field-of-View Extension (Horizontal/Vertical), Virtual Rotation Axis |
| Image Enhancement | ScatterFix 2.0, Beam Hardening Correction (BHC), Metal Artifact Reduction (MAR) |
| Applications | R&D material analysis, dimensional metrology, failure analysis, assembly verification, digital dissection |
| Sample Compatibility | Aluminum, steel, superalloys, AM parts, Li-ion battery cells/modules/systems, CFRP, injection-molded plastics, cultural heritage objects, geological/paleontological/biological specimens, mechatronic assemblies |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Wafer Handling | Full 200 mm (8-inch) diameter |
| Imaging Mode | Field Emission Scanning Electron Microscopy (FE-SEM) |
| Primary Application | Semiconductor Process Defect Inspection & CD Metrology |
| Vacuum System | Differential pumping with cold trap |
| Stage Type | Motorized polar-coordinate stage with collision-avoidance logic |
| Detector Configuration | In-lens EsB, SE2, and STEM-in-SEM options |
| Operating Voltage Range | 0.1–30 kV |
| Resolution | ≤1.0 nm @ 1 kV (in-lens SE mode) |
| Software Platform | SmartSEM Engineering Edition with wafer map navigation and recipe-driven automation |
| Brand | ZENO |
|---|---|
| Model | QUASAR-S Series |
| Application | In-line optical metrology for semiconductor wafer fabrication |
| Wafer Sizes | 150 mm (6″), 200 mm (8″), 300 mm (12″) |
| Measurement Principle | Spectroscopic Ellipsometry (SE) and Spectral Reflectometry (SR) |
| Spectral Range | UV–Vis–NIR (e.g., 190–1700 nm) |
| Thickness Resolution | ≤ 0.005 nm (3σ) |
| Throughput | Up to 120 wafers/hour |
| Sample Interfaces | Open cassette, SMIF pod, FOUP |
| Measurement Capabilities | Single-layer & multi-layer film thickness, refractive index (n), extinction coefficient (k), patterned & unpatterned wafer alignment, waferless recipe setup |
| Compliance | Designed for integration into ISO Class 1–5 cleanroom environments |
| Software | ZENO MetroSuite™ with audit trail, user access control, and 21 CFR Part 11–compliant electronic records |
| Brand | ZENO |
|---|---|
| Model | R100 |
| Origin | Shanghai, China |
| Type | Benchtop Spectral Reflectometer |
| Measurement Principle | Broadband Spectral Reflectance Analysis (350–1000 nm) |
| Sample Compatibility | 4–8 inch wafers, square substrates, irregular shapes |
| Measurable Parameters | Film Thickness, Refractive Index (n), Extinction Coefficient (k), Reflectance (R) |
| Repeatability | ≤±0.15 nm (for 500 nm SiO₂ on Si, n=30) |
| Optical Spot Size | Standard 2 mm Ø |
| Software | ZENO-Metro v4.x with GLP-compliant audit trail, data export (CSV, XML), and ASTM E2372-22 compliant reporting |
| Compliance | ISO/IEC 17025-ready workflow architecture, supports FDA 21 CFR Part 11 electronic signature configuration |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM300 |
| Excitation Wavelength | 532 nm (standard), 275 nm UV optional |
| Laser Power | 50 mW |
| Autofocus Precision | < 0.2 µm |
| Spatial Resolution | < 2 µm |
| Raman Shift Range | 80–9000 cm⁻¹ |
| Spectral Resolution | < 2.0 cm⁻¹ |
| Mapping Scan Area | > 300 × 300 mm² |
| Minimum Step Size | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" customizable) |
| Objective | 100× semi-apochromatic |
| Detection Mode | Confocal Raman + PL + Fluorescence Lifetime (TCSPC) |
| Software Compliance | Supports ASTM E2912, ISO/IEC 17025 workflows, GLP/GMP audit trail logging per FDA 21 CFR Part 11 requirements |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM900 |
| Instrument Type | Steady-State and Time-Resolved Photoluminescence (PL) Mapping System |
| Excitation Wavelengths | 213 nm, 266 nm, 375 nm, 405 nm |
| Autofocus Accuracy | < 0.2 µm |
| Scan Range | > 300 × 300 mm² |
| Minimum Spatial Resolution | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" optional) |
| Objective Lenses | UV (5×), NUV (20×/100×), Visible (20×/50×/100×) |
| Spectrometer | 320 mm focal length, 1200 g/mm grating, spectral resolution ≤ 0.2 nm |
| PL Lifetime Range | 50 ps – 1 ms |
| Lifetime Precision | 8 ps |
| Detection Modes | Confocal steady-state PL, time-resolved PL (TRPL), fluorescence lifetime imaging (FLIM), Raman mapping, photocurrent mapping |