Accretech ChaMP Series Chemical Mechanical Polishing (CMP) Systems

Overview

The Accretech ChaMP Series is a family of precision-engineered Chemical Mechanical Polishing (CMP) systems designed for semiconductor wafer fabrication at R&D, pilot-line, and full-scale production levels. Built upon Accretech’s legacy in ultra-precision metrology and process control—originating from Tokyo Seimitsu Co., Ltd., a publicly listed Japanese technology leader—the ChaMP platform integrates air-bearing carrier technology, zonal pressure actuation, and real-time optical endpoint detection to deliver exceptional planarization uniformity and repeatability across 100 mm to 300 mm silicon wafers. Unlike conventional mechanical carriers, the ChaMP air-bearing head utilizes a controlled laminar air film to distribute downforce uniformly across the wafer surface, minimizing edge non-uniformity and enabling sub-millimeter edge exclusion (≤1 mm). This architecture directly supports advanced node requirements—including low-k dielectric polishing, copper barrier removal, and STI (Shallow Trench Isolation) applications—where nanoscale thickness control and within-wafer non-uniformity (WIWNU) below 3% are critical.

Key Features

• Air-bearing carrier with integrated safety airbag and independent annular retaining ring pressure zones for enhanced edge profile control and process stability at low downforce (≤5 kPa typical)
• Modular head design supporting 2-inch to 8-inch carriers; field-upgradable to accommodate 100 mm, 150 mm, 200 mm, and 300 mm wafers across ChaMP-211, ChaMP-232, and ChaMP-332 configurations
• One-button retainer/diaphragm replacement mechanism reducing scheduled maintenance downtime to under 60 seconds
• Integrated optical endpoint detection system with real-time spectral analysis for precise slurry consumption control and layer-specific stop detection (e.g., Cu/Ta/Ni barrier layers)
• On-platform cleaning module with programmable rinse, scrub, and dry cycles compliant with SEMI F47 standards for particle control (<5 particles ≥0.12 µm per cm² post-clean)
• Compact footprint (<2.5 m²) engineered for cleanroom integration in ISO Class 5 or better environments; compatible with standard 300 mm FOUP load ports and AMHS interfaces

Sample Compatibility & Compliance

The ChaMP Series accommodates bare and patterned silicon wafers, SOI substrates, compound semiconductors (GaAs, SiC), and advanced packaging wafers (e.g., TSV, fan-out). All models conform to SEMI S2-0219 (safety), SEMI E10-0720 (definition of equipment reliability), and SEMI E173-0722 (CMP-specific performance metrics). The optical endpoint system meets ASTM F2129 requirements for spectral resolution and signal-to-noise ratio in thin-film monitoring. Data acquisition and audit trails comply with FDA 21 CFR Part 11 when operated with optional validated software modules, supporting GLP/GMP-aligned process documentation for qualification in foundry and OSAT environments.

Software & Data Management

ChaMP systems run on Accretech’s proprietary CMPControl™ software suite, built on a deterministic real-time OS (VxWorks) with dual redundancy for recipe execution integrity. The interface supports multi-layer recipe management, including slurry flow rate, platen/retainer rotation speed (0–120 rpm), downforce ramping profiles, and zone-specific pressure mapping. All process parameters, endpoint signals, and cleaning logs are timestamped and stored in SQLite-based local databases with optional OPC UA server integration for MES/SCADA connectivity. Audit trail functionality records user actions, parameter changes, and system alarms with immutable timestamps—fully traceable for internal QA reviews or external regulatory audits.

Applications

• Copper damascene planarization with <±2% within-wafer thickness variation (3σ) for logic and memory nodes ≤7 nm
• Low-k ILD (interlayer dielectric) polishing with minimal dishing and erosion via dynamic pressure zoning
• STI oxide removal with endpoint-triggered termination to prevent nitride recess
• Wafer-level packaging (WLP) processing including redistribution layer (RDL) planarization and microbump flattening
• R&D process development for novel abrasives, pH-tuned slurries, and electrochemical-assisted CMP chemistries
• High-mix, low-volume production of MEMS, RF filters, and power devices requiring rapid recipe changeover

FAQ

What wafer sizes does the ChaMP series support?
The ChaMP-211 supports 100 mm, 150 mm, and 200 mm wafers; ChaMP-232 extends compatibility to 200 mm and 300 mm; ChaMP-332 is optimized for high-throughput 300 mm manufacturing.
Is the optical endpoint system capable of detecting multiple film layers?
Yes—the system performs real-time spectral reflectance analysis and supports up to four independently configurable detection channels for stacked films (e.g., TaN/Cu/SiO₂).

How is process data secured and auditable?
All operational data is logged with cryptographic hashing and time-stamped metadata. Optional 21 CFR Part 11 compliance package includes electronic signatures, role-based access control, and automated backup to network-attached storage.

Can the ChaMP platform integrate with factory automation systems?
Standard SECS/GEM and optional OPC UA interfaces enable seamless integration with host MES, AMHS, and equipment monitoring platforms (e.g., PDF, APF, or FabLink XE).

What maintenance intervals are recommended for the air-bearing carrier?
Preventive maintenance is scheduled every 500 operating hours; air filter replacement and carrier surface inspection are performed during routine 8-hour shifts—no disassembly required.