Analysis HC120SE Compact Programmable Spin Coater
| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HC120SE |
| Max. Rotation Speed | 12000 rpm |
| Speed Accuracy | ±1 rpm |
| Acceleration Range | 100–30000 rpm/s (no-load) |
| Substrate Diameter | 5–120 mm |
| Chamber Diameter | 200 mm |
| Programmable Steps per Recipe | 10 |
| Total Recipes Storage | 100 |
| Time Resolution | 0.1 s (max. step duration: 3000 s) |
| Display | 4.3-inch full-color TFT touchscreen GUI |
Overview
The Analysis HC120SE Compact Programmable Spin Coater is an engineered solution for precise, repeatable thin-film deposition in semiconductor fabrication, microelectronics R&D, and advanced materials laboratories. Based on centrifugal spin-coating principles, the instrument uniformly dispenses and spreads liquid photoresists, polymer solutions, sol-gels, or functional nanomaterials onto flat substrates via controlled rotational acceleration and deceleration profiles. Its compact benchtop architecture integrates high-torque brushless DC motor control, vacuum chuck stabilization, and chemically inert fluid pathways—enabling reproducible film thicknesses from sub-10 nm to several micrometers, depending on solution viscosity, concentration, and process parameters. Designed for integration into cleanroom workflows and inert-atmosphere gloveboxes, the HC120SE meets fundamental requirements for photolithography pre-processing, including ISO Class 5 compatibility when operated with appropriate filtration and exhaust management.
Key Features
- Compact footprint (W × D × H ≈ 320 × 360 × 310 mm) optimized for space-constrained labs and glovebox installation
- 4.3-inch full-color TFT touchscreen with intuitive graphical user interface (GUI), supporting alphanumeric input and real-time parameter visualization
- Stainless steel corrosion-resistant spin bowl (200 mm diameter) with optional disposable aluminum foil liners for rapid cross-contamination mitigation
- Transparent polycarbonate safety lid with integrated interlock circuitry—ensures automatic motor shutdown upon lid opening
- Advanced PLC-based motion control delivering ±1 rpm speed repeatability and 1 rpm resolution across the full 0–12000 rpm range
- Programmable acceleration/deceleration profiles (100–30000 rpm/s, no-load) to minimize edge bead formation and improve radial uniformity
- Vacuum chuck system with real-time pressure monitoring and interlocked safety cutoff to prevent substrate ejection
- Motor-protective anti-drip design prevents solvent ingress into drive electronics during dispense cycles
Sample Compatibility & Compliance
The HC120SE accommodates circular substrates from 5 mm to 120 mm in diameter—including silicon wafers, glass slides, quartz plates, flexible polymer films, and ceramic substrates—as well as square samples up to 120 mm diagonal. Standard chucks support 10 mm, 25 mm, and 50 mm diameters; custom chucks are available upon request. All wetted surfaces (bowl, chuck, tubing) exhibit broad chemical resistance to common photoresist solvents (e.g., PGMEA, acetone, IPA, NMP), developer formulations, and aqueous nanomaterial dispersions. The system complies with IEC 61000-6-2 (immunity) and IEC 61000-6-4 (emission) standards. While not certified to UL/CE for standalone deployment, it is routinely deployed in ISO 14644-1 Class 5–7 cleanrooms and nitrogen-purged gloveboxes meeting ASTM E509-22 guidelines for inert atmosphere processing.
Software & Data Management
The embedded firmware supports storage of up to 100 user-defined recipes, each comprising up to 10 sequential steps with independently adjustable speed, acceleration, dwell time (0.1–3000 s resolution), and dispense trigger timing. All parameter changes are logged with timestamp and operator ID (via optional network authentication). Audit-trail functionality satisfies basic GLP documentation needs; raw process logs (CSV export via USB port) include RPM vs. time traces, vacuum status, and error codes. Remote diagnostics and firmware updates are supported via Ethernet or Wi-Fi (optional module), enabling secure off-site troubleshooting under ITAR-compliant protocols. No proprietary cloud platform is required—data remains fully under user control.
Applications
- Photolithography pre-processing for MEMS, CMOS, and compound semiconductor devices
- Deposition of PEDOT:PSS, perovskite precursors, quantum dot inks, and conductive polymer layers in optoelectronics R&D
- Preparation of uniform oxide and nitride thin films for battery electrode and sensor development
- Spin-assisted layer-by-layer (LbL) assembly of polyelectrolytes and biomolecular coatings
- Quality assurance testing of resist shelf-life, batch-to-batch consistency, and solvent evaporation kinetics
FAQ
What vacuum pump is included with the HC120SE?
The system ships standard with one HCV300 oil-free diaphragm vacuum pump (50 L/min free-air displacement), rated for continuous operation and compatible with acidic and organic vapors.
Can the HC120SE be installed inside a nitrogen glovebox?
Yes—the unit operates at ambient temperature, requires only 100–240 VAC input, and features a fully removable spin bowl and low-outgassing materials (316 stainless steel, PTFE-sealed fittings, polycarbonate lid), making it suitable for Class 1000+ inert-atmosphere enclosures.
Is FDA 21 CFR Part 11 compliance supported?
The HC120SE does not include electronic signature or role-based access control natively; however, its CSV log export and timestamped audit trail can be integrated into validated LIMS or ELN systems that enforce Part 11 requirements.
What maintenance intervals are recommended?
Routine cleaning of the spin bowl and chuck is advised after each use; vacuum filter replacement every 6 months under typical lab usage; annual calibration verification of speed and time accuracy using traceable tachometer and stopwatch standards.
Are third-party dispense modules supported?
Yes—RS-232 and TTL trigger interfaces enable synchronization with external syringe pumps or piezoelectric dispensers; pinout specifications and communication protocol documentation are provided upon request.
