AnalysisTech Phase12B Thermal Analyzer

Overview

The AnalysisTech Phase12B Thermal Analyzer is a high-current-capacity thermal characterization instrument engineered for precision measurement of junction temperature (T_j), thermal resistance (R_th), and dynamic thermal behavior in power semiconductor devices, packaging substrates, and high-power electronic modules. Unlike standard thermal analyzers operating at ≤20 A, the Phase12B integrates a built-in 100 A power booster—enabling direct high-current pulse testing without external amplification. It operates on the principle of electrical test-based thermal transient analysis (ETTA), where controlled current pulses induce joule heating, and real-time voltage and thermocouple (Type T) signals are acquired at up to 1 MHz to reconstruct thermal impedance curves (Z_th(t)). This method complies with JEDEC JESD51-1, JESD51-14 (structure function analysis), and IEC 60747-19 for power device thermal qualification. The system is designed for laboratory-grade reproducibility in R&D, reliability validation, and failure analysis workflows under GLP-aligned data integrity practices.

Key Features

• Integrated 100 A high-current source with ±10 mA accuracy (full-scale 20 V), eliminating need for external power boosters in most high-power device testing scenarios
• Sub-microsecond thermal response capture: 1 MHz sampling rate synchronized across voltage, current, and thermocouple channels
• Dual-range T_j sensing with programmable excitation currents (1–50 mA, adjustable in 0.1 mA steps) optimized for low-noise, high-resolution junction temperature tracking
• Calibrated Type T thermocouple input with ±0.15°C typical accuracy and hardware-level cold-junction compensation
• Rugged 17″ rack-mount chassis (25 lb) with industrial-grade thermal management and EMI-shielded signal paths
• GPIB-controlled Keysight power supply included in discount accessory bundle—compatible with 230 VAC (1φ), 208 VAC (3φ), or 400 VAC (3φ) inputs per IEC 61000-3-12

Sample Compatibility & Compliance

The Phase12B supports thermal characterization of discrete power semiconductors (Si, SiC, GaN), bare die, packaged modules (e.g., IGBTs, MOSFETs, diodes), and PCB-mounted assemblies requiring high-current stimulus. Its 20 V / 100 A output accommodates low-impedance DUTs such as paralleled dies or busbar-integrated packages. All measurements adhere to ASTM E2005 (standard practice for thermal resistance measurements of semiconductor devices) and support traceable calibration per ISO/IEC 17025 requirements when operated with certified reference thermocouples and shunt resistors. Data audit trails—including operator ID, timestamp, instrument firmware version, and parameter configuration—are automatically logged to meet FDA 21 CFR Part 11 and EU Annex 11 expectations for regulated environments.

Software & Data Management

Control and analysis are performed via AnalysisTech’s proprietary ThermalStudio™ software (v5.2+), compatible with Windows 7/10 Professional (64-bit). The software provides real-time waveform visualization, automatic Z_th(t) curve extraction, structure function generation (via cumulative/differential formulation), and thermal interface material (TIM) performance comparison tools. Raw binary data (.tdat) files are stored with embedded metadata (sample ID, test conditions, calibration coefficients) and support batch export to CSV, MATLAB (.mat), or HDF5 formats. Audit logs record all user actions, parameter edits, and report generations—enabling full retrospective review during internal audits or regulatory inspections. Optional integration with LabArchives ELN or Siemens Teamcenter is available via REST API.

Applications

• Dynamic thermal resistance mapping of wide-bandgap power devices under pulsed gate-drive conditions
• Thermal interface degradation analysis during accelerated life testing (e.g., temperature cycling per JEDEC JESD22-A104)
• Validation of thermal simulation models (e.g., ANSYS Icepak, COMSOL Multiphysics) using experimentally derived structure functions
• Comparative evaluation of substrate materials (AlN, SiC, diamond) and bonding techniques (sintered Ag, transient liquid phase) in high-power modules
• Root-cause analysis of thermal runaway mechanisms in automotive traction inverters and renewable energy converters

FAQ

What distinguishes the Phase12B from the standard Phase12 model?

The Phase12B incorporates an integrated 100 A power booster and is limited to a 20 V maximum heating voltage—optimized for low-impedance, high-current thermal transient testing. Standard Phase12 units support 2 A, 10 A, or 20 A configurations with up to 50 V output.
Is the Keysight GPIB power supply mandatory for operation?

No—it is bundled as part of the discount accessory package but not required for basic functionality. The Phase12B’s internal power stage operates autonomously; the Keysight unit extends flexibility for variable AC input configurations and higher-power auxiliary loads.
Can the Phase12B perform steady-state thermal resistance (R_th(j-c)) measurements per JEDEC JESD51-2?

Yes—software includes dedicated steady-state mode with configurable dwell times, automatic thermal equilibrium detection, and reporting compliant with JESD51-2 Annex A.
Does the system support third-party thermocouple types beyond Type T?

Only Type T is natively calibrated and supported. Use of other thermocouple types requires user-provided NIST-traceable correction tables and is not covered under warranty or compliance certification.
How is data integrity ensured during long-duration thermal aging tests?

ThermalStudio™ implements cyclic buffering with automatic disk-write verification, SHA-256 checksum logging, and optional network-attached storage (NAS) mirroring—ensuring bit-for-bit fidelity across multi-day acquisitions.