Anyty 3R-YD3D-S Portable 3D Extended-Depth-of-Field Digital Microscope
| Brand | Anyty |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Direct Manufacturer |
| Regional Classification | Domestic (China) |
| Model | 3R-YD3D-S |
| Imaging Sensor | CMOS |
| XY Stage Dimensions | 70 mm × 50 mm or 110 mm × 70 mm |
| Pricing | Upon Request |
Overview
The Anyty 3R-YD3D-S is a portable, high-integration 3D extended-depth-of-field (EDOF) digital microscope engineered for rapid acquisition of metrologically reliable surface topography and morphological data in field, lab, and production environments. Unlike conventional optical microscopes constrained by shallow depth of field at high magnifications, this system employs focus-stacking algorithms combined with precise Z-axis motorized actuation to capture serial optical sections across variable sample heights. These image stacks are reconstructed in real time into a single all-in-focus 2D composite image and a geometrically registered point-cloud-based 3D surface model—enabling simultaneous qualitative inspection and quantitative dimensional analysis without physical repositioning or mechanical scanning stages.
Key Features
- Sub-10-second 3D reconstruction cycle: Full-stack acquisition, alignment, and surface mesh generation completed within ≤10 s for typical industrial samples (e.g., PCB solder joints, machined surfaces, biological tissue sections).
- Dual-stage XY platform options: Standard 70 mm × 50 mm stage for handheld portability and compact workspace integration; optional 110 mm × 70 mm stage for expanded field coverage in QA/QC benchtop applications.
- CMOS imaging engine with adjustable white LED illumination: Optimized for signal-to-noise ratio across reflective, semi-transparent, and low-contrast specimens; supports manual and auto-exposure modes with histogram-based exposure control.
- Real-time co-focused 3D cloud rendering: Interactive OpenGL-accelerated visualization allows free-rotation, pan, zoom, section-cutting, and perspective projection—preserving native spatial fidelity without polygonal simplification artifacts.
- Integrated measurement suite: Supports calibrated 3D height profiling, step-height, roughness (Sa, Sq), volume, angle, and distance measurements traceable to NIST-traceable calibration standards; measurement uncertainty compliant with ISO 25178-601 for areal surface texture.
Sample Compatibility & Compliance
The 3R-YD3D-S accommodates non-vacuum, ambient-condition samples up to 150 mm in height and 200 mm in lateral dimension (with extended stage). It is routinely deployed for metallurgical grain structure assessment, semiconductor package inspection, forensic toolmark analysis, botanical epidermal mapping, and additive manufacturing layer fidelity verification. The system conforms to IEC 61000-4 electromagnetic compatibility requirements and meets CE marking directives for safety and radio-frequency emissions. Data integrity protocols align with GLP/GMP documentation practices, supporting audit-ready export of raw image stacks, processed 3D models (.STL, .OBJ), and measurement reports in PDF/A-1b and CSV formats.
Software & Data Management
Control and analysis are performed via the bundled Anyty 3D-MicroVision Suite (v4.2+), a Windows-based application supporting USB 3.0 real-time streaming and local SSD caching. The software implements role-based user accounts, electronic signature capability, and full audit trail logging per FDA 21 CFR Part 11 Annex 11 guidelines—including timestamped records of operator ID, parameter changes, measurement execution, and report generation. Export modules include DICOM-compliant metadata embedding, batch processing pipelines for multi-sample workflows, and API access for integration into LIMS or MES platforms via RESTful endpoints.
Applications
- Electronics: Solder joint void detection, BGA coplanarity verification, flex-circuit trace width/height metrology.
- Materials Science: Coating thickness uniformity mapping, corrosion pit depth quantification, fracture surface roughness characterization.
- Academic Research: Insect exoskeleton morphology, pollen grain surface topology, mineral cleavage plane orientation analysis.
- Forensics & Quality Assurance: Bullet striation comparison, wear-pattern documentation on mechanical components, cosmetic defect grading per ASTM E2923.
FAQ
Does the 3R-YD3D-S require external vibration isolation?
No—its passive damping architecture and short exposure stacking strategy enable stable operation on standard optical tables or even portable workbenches without active isolation.
Can third-party software import the native 3D point cloud data?
Yes—raw XYZI (intensity) point clouds are exportable in ASCII XYZ and PLY formats, compatible with Metrology software including PolyWorks, GOM Inspect, and CloudCompare.
Is calibration verification supported for ISO/IEC 17025 accredited labs?
Yes—the system includes a certified reference artifact kit (traceable to PTB/NIM) and automated calibration validation workflow embedded in the software.
What is the maximum achievable vertical resolution under optimal conditions?
Vertical resolution is dependent on objective lens magnification and Z-step precision; typical configuration achieves ≤0.5 µm Z-step repeatability and <2.5 µm axial measurement uncertainty per ISO 25178-603.
Is remote operation supported over LAN or VPN?
Yes—via optional Anyty RemoteView License, enabling full GUI mirroring, live streaming, and measurement control from offsite locations with TLS 1.2 encrypted session management.
