Auniontech MicroFAB-3D Two-Photon Polymerization Direct-Write 3D Nanolithography System

Overview

The Auniontech MicroFAB-3D is a turnkey two-photon polymerization (TPP)-based direct-write 3D nanolithography system engineered for sub-diffraction-limit fabrication of functional micro- and nano-scale 3D structures. Unlike conventional photolithography or mask-based projection systems, the MicroFAB-3D employs nonlinear optical excitation—where simultaneous absorption of two near-infrared photons triggers localized polymerization only at the focal voxel—enabling true 3D freeform writing without layer-by-layer constraints. This principle allows fabrication of overhanging, interlocked, and topologically complex architectures with isotropic resolution down to 0.2 µm (200 nm), validated by SEM metrology across multiple independent laboratories. The system operates within standard ISO Class 5 (Class 100) laminar flow hoods or cleanroom environments and integrates seamlessly into semiconductor R&D labs, micro-optics prototyping facilities, and biomedical engineering suites requiring GLP-aligned traceability.

Key Features

• Sub-200 nm effective feature resolution (demonstrated at 67 nm under optimized resin and exposure conditions)
• Projection-mode TPP architecture enabling parallel voxel writing—significantly accelerating throughput versus point-scanning systems
• Fully motorized, closed-loop XYZZ stage with ≤50 nm repeatability and thermal drift compensation
• Open-material platform supporting >15 commercially available and custom-synthesized photoresists—including Ormocomp®, SU-8 derivatives, NOA-series acrylates, biocompatible hydrogels (e.g., GelMA, PEGDA), and protein-based formulations
• Compact footprint (650 × 600 × 580 mm) designed for integration into biosafety cabinets, gloveboxes, or semiconductor tool clusters
• Integrated environmental monitoring (temperature, humidity, vibration) with real-time logging compliant with ISO 14644-1 and ASTM E2919-21

Sample Compatibility & Compliance

The MicroFAB-3D accommodates substrates up to 100 mm diameter and 20 mm thickness—including silicon wafers, fused silica, ITO-coated glass, PDMS stamps, and flexible PET films. All optical paths are sealed and purged with dry nitrogen to prevent moisture-induced resin inhibition. The system conforms to IEC 61000-6-3 (EMC emissions) and IEC 61000-6-2 (immunity), carries CE marking per Machinery Directive 2006/42/EC and Low Voltage Directive 2014/35/EU, and supports audit-ready documentation packages aligned with FDA 21 CFR Part 11 (electronic records/signatures) when paired with optional validation modules. Material compatibility data sheets include ISO 10993-5 cytotoxicity reports for selected resins used in microfluidic organ-on-chip devices.

Software & Data Management

MicroFAB Control Suite provides deterministic path planning, adaptive dose calibration, and hierarchical structure assembly—from single-voxel primitives to multi-material lattices. Its native slicing engine implements advanced TPP-specific algorithms including Z-compensation for refractive index mismatch, voxel overlap optimization, and support-free topology generation. All processing parameters (laser power, scan velocity, voxel dwell time, z-step increment) are version-controlled and exportable as JSON or XML for reproducibility. Raw acquisition logs, stage position traces, and environmental metadata are stored in HDF5 format with SHA-256 checksums—ensuring full traceability per ISO/IEC 17025:2017 requirements for accredited testing laboratories.

Applications

• Micro-optics: Freeform microlens arrays, photonic crystals, waveguide splitters, and meta-optical elements
• Microfluidics: Monolithic 3D channels with embedded valves, mixers, and cell-trapping geometries
• Tissue engineering scaffolds: Biomimetic porous architectures with controlled pore interconnectivity and surface nanotopography
• Micro-robotics: Mechanically articulated microgrippers, hinges, and actuator-integrated frameworks
• Metamaterials: Chiral unit cells, negative-index lattices, and acoustic bandgap structures
• Semiconductor packaging: Embedded passive components, redistribution layers (RDL), and wafer-level test structures

FAQ

What is the minimum achievable feature size on the MicroFAB-3D?
The system achieves a nominal lateral resolution of 0.2 µm; users have reported stable fabrication of 67 nm line features using high-contrast resins and calibrated dose mapping.
Does the system support multi-material printing?
Yes—via sequential resin exchange and automated stage cleaning protocols; full process recipes for dual-resin microfluidic devices are included in the application library.
Is cleanroom certification provided with the instrument?
The MicroFAB-3D is supplied with a Class 100 (ISO 5) cleanroom compliance dossier, including particle count validation reports and airflow characterization data.
Can the software interface with third-party CAD or simulation tools?
Native import of STEP, IGES, and Parasolid files is supported; APIs (Python SDK) enable bidirectional coupling with COMSOL Multiphysics®, ANSYS®, and MATLAB® for design-for-manufacturing workflows.
What level of technical support and service coverage is offered?
Standard warranty includes 24-month parts-and-labor coverage, remote diagnostics, and annual on-site preventive maintenance; extended GLP-compliant IQ/OQ/PQ validation services are available upon request.