AXIS-TEC PE-75 Plasma Surface Treater

Overview

The AXIS-TEC PE-75 Plasma Surface Treater is a benchtop, radio-frequency (RF) driven low-pressure plasma system engineered for precision surface modification, ultra-clean degreasing, and functionalization of solid substrates under controlled inert or reactive gas environments. Operating at the industrial standard frequency of 13.56 MHz, the system generates stable, uniform glow discharge plasma within a monolithic T-6 aluminum vacuum chamber. This non-thermal plasma environment facilitates energetic ion and radical interactions with material surfaces—cleaving weak boundary layers, oxidizing organic contaminants, and introducing polar functional groups (e.g., –OH, –COOH, –NH₂) without bulk thermal damage. Unlike wet chemical cleaning, the PE-75 achieves sub-monolayer cleanliness while preserving dimensional integrity and surface topography—critical for optical coatings, MEMS fabrication, and biofunctionalized substrates.

Key Features

• Monolithic T-6 aluminum chamber with integrated RF shielding and anodized interior—ensures mechanical rigidity, thermal stability, and long-term vacuum integrity (leak rate <1×10⁻⁷ mbar·L/s).
• Digitally regulated 13.56 MHz RF generator (0–150 W), coupled with automatic impedance matching network for consistent plasma ignition and power delivery across varying pressure and gas composition conditions.
• Cylindrical chamber geometry (273 mm ID × 254 mm depth) optimized for uniform plasma density distribution—validated by Langmuir probe mapping across axial and radial planes.
• Integrated Pirani vacuum gauge (0–1 Torr range) with real-time digital readout and programmable pressure setpoints; compatible with optional capacitance manometer for high-accuracy sub-mT control.
• Modular gas inlet system supporting single- or multi-channel configurations with stainless-steel precision needle valves (0–25 sccm range) and optional mass flow controllers (MFCs) for reproducible gas dosing.
• Full automation via embedded microcontroller: pre-programmed recipes store pressure, power, gas type, flow rate, and treatment duration; cycle logging includes timestamped operational parameters for GLP/GMP traceability.

Sample Compatibility & Compliance

The PE-75 accommodates substrates up to 250 mm in diameter and 20 mm in height—including wafers, microscope slides, polymer films, ceramic sensors, metallic implants, and microfluidic PDMS devices. Chamber loading is facilitated via front-loading O-ring sealed door with ISO-KF 63 flange interface. All wetted materials comply with USP Class VI biocompatibility standards. The system meets electromagnetic compatibility requirements per FCC Part 18 and CE/EMC Directive 2014/30/EU. Optional Venus PC software enables 21 CFR Part 11–compliant user authentication, electronic signatures, and audit-trail generation for regulated QC laboratories in medical device manufacturing and pharmaceutical R&D.

Software & Data Management

The optional Venus PC control platform provides remote operation via Ethernet or USB, enabling synchronized control of RF power, gas flow, vacuum sequencing, and process timing. Real-time parameter visualization includes plasma emission intensity (via optional optical port), reflected power, and chamber pressure trends. All executed protocols are archived in CSV and SQLite formats with SHA-256 hash verification for data integrity. Batch reports include operator ID, calibration status, chamber history, and pass/fail flags against predefined acceptance criteria—supporting ISO/IEC 17025 documentation workflows.

Applications

• Semiconductor: Removal of photoresist residuals and native oxide prior to ALD/PVD deposition; surface activation of SiO₂ and SiNₓ for improved adhesion of metal interconnects.
• Life Sciences: Sterilization of surgical tools and implantable polymers (e.g., PEEK, UHMWPE) without cytotoxic residue; hydrophilization of PDMS microchannels for enhanced protein adsorption and cell seeding uniformity.
• Optics & Photonics: Cleaning of fused silica, CaF₂, and sapphire optics prior to anti-reflective coating; surface functionalization of fiber end-faces to reduce back-reflection in telecom assemblies.
• Materials Science: Grafting of amine-terminated silanes onto glass substrates for biosensor immobilization; crosslinking of fluoropolymers to increase surface energy for inkjet printing.
• Academic Research: In-situ plasma-assisted polymerization of thin-film barriers; corona-free surface etching of 2D materials (graphene, MoS₂) for controlled defect engineering.

FAQ

What vacuum level is required for stable plasma ignition?
Stable glow discharge is achieved between 10–500 mT (1.3–67 Pa) depending on gas species and flow rate; optimal cleaning performance typically occurs at 50–200 mT using oxygen or argon/oxygen mixtures.
Can the PE-75 be integrated into a glovebox or nitrogen-purged environment?
Yes—the system features external electrical feedthroughs and gas/vacuum ports compatible with ISO-KF and Swagelok fittings, enabling direct integration into inert-atmosphere enclosures.
Is chamber cleaning required between different sample types?
No routine cleaning is needed; the plasma itself cleans chamber walls during operation. For high-organic-load applications (e.g., photoresist stripping), a 5-minute oxygen plasma “bake-out” cycle restores baseline performance.
Does the PE-75 support reactive ion etching (RIE) mode?
The base configuration operates in capacitive-coupled glow discharge mode. RIE capability requires optional RF bias electrode installation and dual-frequency (13.56 MHz + 400 kHz) generator upgrade—available as factory-configured option.
What calibration services are available?
AXIS-TEC offers NIST-traceable RF power calibration, vacuum gauge verification, and gas flow validation—performed annually or per ISO/IEC 17025-accredited service protocol.