Chotest VX8000 One-Touch Flash Measurement System
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Model | VX8000 |
| Measurement Field | 300 × 200 mm (with 4 corner R50 fillets) |
| Max. Load Capacity | 7.5 kg |
| Image Sensor | 20 MP CMOS |
| Lens | High-Resolution Dual Telecentric Optics |
| XY Stage Travel | 210 × 110 × 75 mm |
| Dimensions (L×W×H) | 531 × 503 × 731 mm |
| Optional Height Probe | Spot Diameter Φ38 µm, Measurable Depth-to-Diameter Ratio h/φ = 1.5 |
Overview
The Chotest VX8000 One-Touch Flash Measurement System is a high-precision, vision-based geometric metrology instrument engineered for rapid, non-contact 2D profile and dimensional analysis of small-to-medium industrial components. It operates on the principle of dual telecentric optical imaging—eliminating perspective distortion across the entire field of view—and integrates advanced sub-pixel edge detection algorithms (achieving ≤1% pixel resolution) with automated feature recognition and template-matching logic. Unlike conventional coordinate measuring machines (CMMs) or manual optical comparators, the VX8000 executes full-part evaluation—including point, line, circle, arc, and complex contour extraction—within seconds after a single operator command. Its architecture supports both standalone operation and CNC-mode automation, enabling repeatable, operator-independent measurement sequences compliant with ISO 10360-7 (acceptance testing of vision measuring systems) and aligned with GD&T evaluation per ASME Y14.5 and ISO 1101 standards.
Key Features
- True one-touch operation: Automatic part recognition, template matching, and multi-feature measurement initiated by a single button press—no fixture alignment or manual positioning required.
- Dual telecentric optical path: Ensures uniform magnification and minimal depth-of-field error across the full 300 × 200 mm measurement field (with R50 corner fillets), critical for accurate GD&T assessment of stamped, machined, and molded parts.
- 20-megapixel CMOS sensor with real-time auto-focus: Delivers stable, reproducible focus across repeated measurements; eliminates inter-operator variability in focal plane selection.
- Simultaneous multi-location measurement: Up to 1024 discrete features (e.g., hole positions, edge distances, radii) evaluated in a single acquisition cycle.
- CAD-driven inspection: Direct import of DXF/DWG files; automatic overlay alignment and tolerance-driven measurement sequence generation.
- Integrated GD&T engine: Evaluates straightness, roundness, flatness, position, perpendicularity, concentricity, parallelism, symmetry, and profile tolerances—fully traceable to ASME Y14.5–2018 definitions.
- Modular expandability: Optional height probe (Φ38 µm spot size) enables non-contact Z-axis profiling (e.g., step height, planarity); optional horizontal rotary stage supports cylindrical part evaluation up to Φ60 mm diameter.
Sample Compatibility & Compliance
The VX8000 accommodates a broad range of production-grade components including PCBs, precision screws, springs, connectors, O-rings, smartphone glass covers, injection-molded housings, and stamped metal terminals. Parts are placed freely on the motorized XY stage (210 × 110 mm travel) without fixturing—ideal for high-mix, low-volume or high-volume batch verification workflows. Maximum sample weight is 7.5 kg; maximum Z-clearance allows integration of auxiliary probes or lighting configurations. The system meets electromagnetic compatibility (EMC) requirements per IEC 61326-1 and safety standards per IEC 61010-1. Measurement uncertainty is validated per ISO/IEC 17025–accredited protocols when operated within specified environmental conditions (20 ± 1 °C, humidity <60% RH, vibration-isolated bench). Data integrity complies with FDA 21 CFR Part 11 requirements when audit trail and electronic signature modules are enabled.
Software & Data Management
The embedded measurement software provides a unified interface for setup, execution, analysis, and reporting. It includes over 80 built-in geometric extraction tools (e.g., ellipse fitting, tangent line construction, intersection derivation, radius mapping) and application-specific wizards—for R-angle, pitch, spring pitch, sieve mesh, and O-ring cross-section analysis. All measurement results are timestamped and stored with full metadata (image capture, coordinate system definition, tolerance limits, operator ID). SPC functionality generates X̄-R charts, capability indices (Cp/Cpk), histogram distributions, and trend reports compliant with ISO 22514 series. Raw data exports to CSV, XML, or PDF; API support enables direct integration into MES (e.g., Siemens Opcenter, Rockwell FactoryTalk) and PLM platforms. Audit trails record all parameter changes, report modifications, and user logins—fully satisfying GLP/GMP documentation requirements.
Applications
The VX8000 serves as a dedicated metrology solution across industries where speed, repeatability, and GD&T fidelity are critical: electronics manufacturing (PCB fiducial alignment, connector pin pitch, flex circuit trace width); precision machining (gear tooth geometry, thread flank angles, micro-hole arrays); medical device production (catheter hub dimensions, syringe barrel wall thickness, implant component profiles); and consumer hardware (smartphone chassis flatness, camera module lens seat concentricity, watch case lug symmetry). Its ability to perform batch measurement without repositioning makes it especially suitable for first-article inspection (FAI), in-process statistical control, and final acceptance testing under ISO 9001 and IATF 16949 quality management systems.
FAQ
Does the VX8000 require calibration before each use?
No—factory calibration is traceable to NIST standards, and system stability is verified via daily check artifacts. Optional periodic recalibration follows ISO 17025 procedures.
Can CAD models be used for automated pass/fail evaluation?
Yes—DXF/DWG imports generate reference geometry; deviations are computed automatically against user-defined tolerances and color-coded in real time.
Is height measurement included in the base configuration?
No—Z-axis profiling requires the optional non-contact optical probe module, which extends measurement capability to surface topography and step height with 1.5 h/φ depth ratio support.
What stage motion accuracy does the XY platform provide?
The motorized stage delivers ±1.5 µm bidirectional repeatability over its full 210 × 110 mm range, certified per ISO 230-2 Annex A.
How is measurement data secured and auditable?
All sessions include immutable audit logs; user roles restrict access to calibration parameters and report editing; electronic signatures comply with 21 CFR Part 11 when configured with PKI authentication.
