CYKY CY-MSV325-II Dual-Target DC Magnetron Sputtering Deposition System

Overview

The CYKY CY-MSV325-II is a compact, dual-target direct-current (DC) magnetron sputtering deposition system engineered for precision thin-film synthesis in academic and industrial R&D laboratories. Based on the fundamental principle of plasma-assisted physical vapor deposition (PVD), the system utilizes high-density argon plasma generated under low-pressure conditions (≤1.0 × 10⁻⁵ Pa) to eject atoms from conductive target materials via momentum transfer—enabling controlled, stoichiometric, and repeatable film growth on substrates up to 100 mm in diameter. Its modular architecture integrates two independently operated magnetron sources—configurable with either 1-inch or 2-inch targets—supporting sequential, co-sputtered, or alternating-layer deposition strategies essential for multilayer heterostructures such as ferroelectric/insulator stacks (e.g., PZT/SRO), transparent conductive oxides (ITO/ZnO), and metallic alloy films (NiFe, CoCrTa). Designed specifically for microelectronics process development, the system delivers robust thermal management (substrate heating up to 600 °C with ±1 °C uniformity), rotational sample stage control (0–20 rpm), and vacuum integrity compliant with ISO 27423 Class 5 cleanroom-compatible operation.

Key Features

• Dual independent DC magnetron sources (500 W each), compatible with 1″ or 2″ circular targets (Φ50.8 mm, ≤3 mm thickness), enabling flexible multi-material deposition without chamber break.
• High-vacuum architecture featuring a 600 L/s turbo-molecular pump backed by a dry scroll pump; base pressure consistently achieves ≤1.0 × 10⁻⁵ Pa after bake-out.
• Intelligent gas handling system with one standard mass flow controller (Ar, 0–200 SCCM); optionally expandable to four MFCs for reactive sputtering (e.g., Ar/O₂, Ar/N₂ mixtures) with digital setpoint calibration traceable to NIST standards.
• Electrically heated, water-cooled substrate stage (Ø150 mm) with PID-controlled temperature regulation (ambient to 600 °C, ±1 °C stability over 1 h), integrated rotation (0–20 rpm) for enhanced film uniformity.
• Top-opening stainless-steel vacuum chamber (SUS304, Ø325 mm × 500 mm) with Ø100 mm quartz viewport (UV-grade, AR-coated), rated for UHV-compatible flange interfaces (CF35/CF63).
• Full-system automation via CYKY’s proprietary Windows-based control software, supporting script-driven vacuum sequencing, power ramping, gas flow profiling, and real-time logging of all operational parameters with timestamped audit trails.

Sample Compatibility & Compliance

The CY-MSV325-II accommodates rigid planar substrates including silicon wafers (up to 100 mm), fused silica, alumina, sapphire, and glass slides. Substrate clamping is achieved via spring-loaded edge contact or optional electrostatic chuck integration. All wetted surfaces are electropolished SUS304 with helium-leak-tested welds (<1 × 10⁻⁹ mbar·L/s), meeting ISO 10110 optical surface finish requirements for chamber interior. The system complies with CE Machinery Directive 2006/42/EC, IEC 61000-6-2 EMC immunity, and IEC 61000-6-4 emission standards. Vacuum protocols align with ASTM F2627-20 (Standard Guide for Vacuum System Qualification), and software operation supports GLP/GMP-aligned data integrity per FDA 21 CFR Part 11 when configured with user role management and electronic signature modules.

Software & Data Management

CYKY’s embedded control suite runs on an optional integrated industrial PC (Windows 10 IoT Enterprise) and provides full remote operability via Ethernet. It enables synchronized control of vacuum pumps, gate valves, MFCs, DC power supplies, heater, and stage rotation—all accessible through a tabbed GUI with real-time analog waveform display (pressure, voltage, current, temperature). All process data—including timestamps, setpoints, actual values, and alarm events—are logged in CSV and SQLite formats with automatic daily backup. Audit trail functionality records operator ID, parameter changes, and session start/end times. Exported datasets conform to ASTM E2915-21 metadata conventions and support direct import into MATLAB, Python (pandas), or LabVIEW for statistical process control (SPC) analysis.

Applications

• Growth of piezoelectric and ferroelectric thin films (e.g., Pb(Zr,Ti)O₃, BaTiO₃) for MEMS actuators and non-volatile memory elements.
• Deposition of metallic electrode stacks (Ti/Pt, Cr/Au, Ni/Cu) for semiconductor interconnect test structures and bump metallization.
• Reactive sputtering of transparent conducting oxides (In₂O₃:Sn, ZnO:Al) for photovoltaic and display device research.
• Co-sputtering of magnetic multilayers (Co/Pt, Fe/Cr) for spintronic prototype fabrication and exchange bias studies.
• Preparation of corrosion-resistant alloy coatings (e.g., CrN, TiAlN) on MEMS packaging substrates under controlled nitrogen partial pressure.
• In-situ thickness calibration using optional QCM sensor (0.10 Å resolution) for real-time rate monitoring during nucleation-limited growth regimes.

FAQ

What substrate sizes can the CY-MSV325-II accommodate?
The system supports substrates up to 100 mm in diameter; the heated rotating stage has a usable diameter of 150 mm, allowing full coverage for standard 4-inch wafers and oversized coupons.
Is reactive sputtering supported out of the box?
Yes—the standard configuration includes one Ar MFC, but the gas manifold is pre-plumbed for up to four MFCs; reactive gas lines (O₂, N₂, CH₄) can be added with residual gas analyzer (RGA) integration upon request.
Can the system be upgraded for RF sputtering?
RF capability is available as a factory-installed option, including impedance-matched 13.56 MHz generator (300 W), auto-tuner, and RF-compatible target shields—fully retrofittable without chamber modification.
What vacuum certifications are provided with delivery?
Each unit ships with a factory-generated vacuum performance report (base pressure, pump-down curve, leak-check log), material certification for all vacuum components (EN 10204 3.1), and CE Declaration of Conformity.
Is remote diagnostics and firmware update supported?
Yes—via secure TLS-enabled web interface; CYKY offers annual remote maintenance contracts including firmware patches, calibration verification, and troubleshooting logs reviewed by application engineers.