High Low Temperature Test Chamber – OEM/ODM Supplier
| Brand | Other Brands |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Price Reference | USD 3,100 (excl. tax & freight) |
Overview
The High Low Temperature Test Chamber is an engineered environmental simulation system designed for precise thermal stress testing of electronic components, automotive parts, aerospace materials, and industrial assemblies under controlled extreme temperature conditions. Operating on a dual-zone refrigeration-heating principle with forced-air convection circulation, the chamber maintains stable and uniform thermal profiles across its working volume. It complies with fundamental thermal test methodology standards—including IEC 60068-2-1 (Cold), IEC 60068-2-2 (Dry Heat), MIL-STD-810G Method 501.6/502.6, and GB/T 5170.2—ensuring traceable performance validation for quality assurance, reliability engineering, and regulatory pre-compliance screening in R&D and production environments.
Key Features
- Robust all-steel welded chamber construction with seamless interior welds and high-gloss matte finish; ergonomic flat non-reactive door handle for safe, fatigue-free operation
- Hermetically sealed insulation design with high-density polyurethane foam (≥100 mm thickness) and double-glazed observation window with Philips LED lighting and integrated anti-fog heater
- Low-noise, high-efficiency hermetic compressor system coupled with axial-flow circulation fan delivering ≥2.5 m/s internal air velocity and ±0.5 °C temperature uniformity (at 25 °C setpoint)
- Integrated vibration-damping base mount to suppress mechanical resonance during extended thermal cycling, enabling stable operation in shared lab or production-floor environments
- Optional load-testing capability: configurable power feedthrough ports (IP65-rated) supporting real-time electrical monitoring of DUTs under thermal stress without chamber breach
- Multi-layer safety architecture including over-temperature cut-off, compressor high-pressure protection, phase failure detection, and door-open alarm with automatic heating shutdown
Sample Compatibility & Compliance
The chamber accommodates samples up to 500 mm × 500 mm × 500 mm (W×D×H) with maximum mass loading of 30 kg. Internal airflow dynamics are optimized to minimize thermal gradients per IEC 60068-3-5, ensuring representative exposure for PCBAs, sensors, battery modules, and polymer housings. All calibration and verification procedures follow GB/T 5170.2–2017 (equivalent to ISO/IEC 17025-aligned practices), with optional NIST-traceable temperature sensor certification available upon request. The unit meets structural and operational requirements defined in GB 10592–2008 and supports GLP-compliant test documentation when paired with validated software.
Software & Data Management
Equipped with a 7-inch resistive touchscreen HMI running embedded Linux OS, the controller provides real-time temperature logging at 1-second intervals, programmable ramp-soak cycles (up to 99 segments), and USB data export in CSV format. Optional Ethernet connectivity enables integration into centralized LabVantage or Siemens Desigo CC platforms via Modbus TCP. Audit trail functionality—supporting user login tracking, parameter change history, and event timestamping—is compliant with FDA 21 CFR Part 11 requirements when configured with digital signature authentication and role-based access control.
Applications
- Temperature cycling qualification per JEDEC JESD22-A104 for semiconductor packaging
- Thermal shock preconditioning prior to HALT/HASS testing
- Long-term aging studies under elevated temperature (e.g., 85 °C/85% RH derating validation)
- Automotive component validation per ISO 16750-4 (Environmental Conditions and Testing for Electrical and Electronic Equipment)
- Material coefficient of thermal expansion (CTE) screening using dimensional metrology integration
- Pre-shipment environmental stress screening (ESS) in contract manufacturing facilities
FAQ
What temperature range does this chamber support?
Standard operating range is −40 °C to +150 °C, with stabilization accuracy of ±1.0 °C over full span and recovery time ≤15 min (from −40 °C to +85 °C, no load).
Is remote monitoring supported out-of-the-box?
Yes—via optional RS485/Modbus RTU interface; Ethernet and Wi-Fi modules are available as field-upgradable accessories.
Can the chamber be calibrated to ISO/IEC 17025 standards?
Yes—factory calibration includes 9-point temperature mapping per GB/T 5170.2; accredited third-party calibration certificates (CNAS or A2LA) can be arranged separately.
Does it meet MIL-STD-810 compliance for military applications?
It satisfies Methods 501.6 (High Temperature) and 502.6 (Low Temperature) when operated within specified load and dwell parameters; full MIL-STD-810G qualification requires system-level test planning and report generation by end-user labs.
Are custom internal dimensions or port configurations available?
Yes—OEM/ODM configuration support includes modified chamber volume, additional cable ports, reinforced shelves, and specialized interior coatings (e.g., stainless steel liner, ESD-safe finish).
