High Temperature Aging Test Chamber OK-T Series

Overview

The OK-T Series High Temperature Aging Test Chamber is an engineered environmental simulation system designed for accelerated thermal aging evaluation of materials, components, and finished products under controlled, sustained elevated temperatures. Based on the principle of convective and radiant heat transfer within a sealed insulated chamber, it enables precise replication of long-term thermal stress conditions—critical for assessing material degradation, polymer cross-linking, sealant stability, solder joint reliability, and insulation performance over time. This chamber complies strictly with GB/T 2423.2—China’s national standard equivalent to IEC 60068-2-2 (Test B: Dry Heat)—and supports test protocols aligned with broader international frameworks including ASTM D3045 (Standard Practice for Heat Aging of Plastics) and ISO 188 (Rubber—Accelerated Ageing and Heat Resistance Tests). Its robust architecture ensures stable thermal profiles across extended dwell periods, making it suitable for both routine quality assurance and R&D validation in electronics manufacturing, automotive component suppliers, aerospace subcontractors, and polymer formulation laboratories.

Key Features

• Double-wall construction: 1.2 mm cold-rolled A3 steel outer shell with electrostatic powder coating; mirror-finished SUS304 stainless steel inner chamber for corrosion resistance and cleanability
• High-efficiency thermal insulation: 100 mm composite layer of rigid polyurethane foam (λ ≈ 0.022 W/m·K) combined with glass fiber lining—minimizing thermal bridging and external surface temperature rise
• Dedicated high-power heating system: 2 kW far-infrared nickel-chromium alloy heater with independent circuitry, enabling rapid ramp rates and stable steady-state operation at up to 500 °C (custom configuration)
• Precision temperature control: Fuji digital PID microprocessor controller with auto-tuning function, integrated Pt100 Class A platinum resistance sensor (IEC 60751), achieving ±0.5 °C control accuracy and ±1.5 °C uniformity across working volume
• Comprehensive safety architecture: Triple-layer protection including adjustable over-temperature alarm, hardware-based thermal cut-off relay, and residual-current circuit breaker (RCCB) compliant with IEC 61000-4-5
• Modular interior layout: Two-tier SUS304 adjustable shelf system with load capacity ≥15 kg per shelf; rear-mounted power inlet with standardized industrial-grade cable gland

Sample Compatibility & Compliance

The OK-T chamber accommodates a broad range of sample geometries via customizable internal dimensions (e.g., OK-T-72: 45 × 40 × 40 cm; OK-T-150: 50 × 60 × 50 cm), supporting PCB assemblies, elastomeric gaskets, wire harnesses, battery modules, and molded plastic housings. All configurations meet mechanical and thermal safety requirements defined in GB/T 2423.2 Clause 5.2 (chamber homogeneity verification), and support traceable calibration per ISO/IEC 17025 when paired with accredited external thermocouple mapping procedures. While not inherently certified to UL or CE for standalone safety marking, the unit is supplied with full technical documentation—including wiring diagrams, controller firmware revision logs, and thermal validation reports—to facilitate integration into GLP/GMP-compliant lab environments requiring audit-ready records.

Software & Data Management

The Fuji controller provides local data logging via built-in memory (up to 100 segments, 999 cycles), with real-time display of setpoint, process value, ramp rate, and elapsed time. Optional RS-485 Modbus RTU interface enables connection to SCADA systems or centralized LabVIEW-based monitoring platforms for remote supervision and automated report generation. When deployed in regulated settings, users may implement 21 CFR Part 11-compliant electronic record workflows using third-party validation packages—leveraging the controller’s password-protected parameter access, event log timestamping, and non-volatile memory retention. No proprietary cloud service or vendor-hosted software is required or embedded.

Applications

• Accelerated life testing of conformal coatings and encapsulants used in automotive ECUs
• Evaluation of thermal endurance limits for lithium-ion battery separator membranes
• Validation of solder paste reflow profile robustness under prolonged storage at elevated ambient
• Stability assessment of optical adhesives in LED packaging under continuous 150 °C exposure
• Pre-conditioning of elastomeric O-rings prior to low-temperature compression set testing
• Qualification of flame-retardant additives in engineering thermoplastics per UL 746B HTOL protocols

FAQ

What temperature ranges are available as standard configurations?
Standard models operate from ambient (RT) to 200 °C. Extended-range variants reach 300 °C; custom-engineered units support up to 500 °C with reinforced insulation and high-temp seals.

Is this chamber compatible with ISO/IEC 17025-accredited calibration?
Yes—the chamber’s mechanical design and sensor interface allow third-party calibration providers to perform spatial temperature mapping and uncertainty analysis per ISO/IEC 17025 requirements.

Can the controller be integrated into a centralized laboratory automation network?
Yes—via optional RS-485 Modbus RTU output, supporting interoperability with Siemens Desigo, Schneider EcoStruxure, or custom Python/Node-RED middleware.

Does the unit include documentation for GxP-regulated environments?
It includes factory-assembled IQ/OQ documentation templates, controller firmware version logs, and electrical schematics—enabling qualified users to complete PQ protocols under internal QA oversight.

Are replacement shelves and insulation kits available as spare parts?
Yes—SUS304 shelf sets, glass fiber door gasket kits, and polyurethane core panels are stocked and shipped globally with OEM part numbers and RoHS compliance certificates.