High Temperature Aging Test Chamber – OK-T Series (RT+20°C to 500°C, PID-Controlled Environmental Test Chamber)

Overview

The OK-T Series High Temperature Aging Test Chamber is an engineered environmental simulation system designed for accelerated thermal aging, stability assessment, and reliability validation of electronic components, automotive parts, polymer materials, and electrical insulation systems. Operating on the principle of controlled convective heat transfer within a thermally isolated chamber, it maintains precise, stable, and uniform elevated temperatures—up to 500°C—to replicate long-term thermal stress conditions in compressed timeframes. Its architecture adheres to the fundamental requirements of IEC 60068-2-2 (equivalently implemented as GB/T 2423.2 in China), supporting standardized high-temperature exposure protocols used in qualification testing, failure mode analysis, and shelf-life estimation. The chamber’s forced horizontal airflow ensures minimal thermal stratification, while its dual-layer insulation minimizes energy loss and external surface temperature rise—critical for laboratory safety and operational continuity.

Key Features

• Wide operational temperature range: ambient +20°C to 500°C (standard models up to 300°C; 500°C capability available upon specification)
• PID + SSR (Solid-State Relay) heating control system for stable setpoint maintenance and reduced thermal overshoot
• High-reliability Pt100 platinum resistance thermometer (PRT) sensor with traceable calibration path for accurate real-time feedback
• Forced horizontal air circulation using a high-temperature-rated turbine fan and optimized duct geometry to achieve ±1.5°C uniformity across the working volume
• Dual-wall construction: inner chamber fabricated from seamless SUS304 stainless steel (non-reactive, oxidation-resistant); outer shell from 1.2 mm precision-cut A3 steel with electrostatic powder coating
• Multi-layer thermal insulation comprising rigid polyurethane foam (closed-cell, low thermal conductivity) and glass fiber—ensuring <0.8 W/m²·K surface heat loss at 300°C
• Integrated safety architecture including independent over-temperature cut-off (mechanical backup), earth-leakage circuit interruption, and dual-stage audible/visual alarm activation

Sample Compatibility & Compliance

The OK-T chamber accommodates a broad spectrum of test specimens—from PCB assemblies and lithium-ion battery modules to elastomeric seals and aerospace-grade composites—without compromising thermal integrity or dimensional stability. Its interior dimensions (e.g., 50×60×50 cm for OK-T-150) support standard test fixtures and multi-tier stainless steel sample racks (SUS304, two levels included). All operational parameters comply with GB/T 2423.2 “Environmental Testing – Part 2: Tests – Test B: Dry Heat”, which aligns with IEC 60068-2-2 Ed. 4.0. While not inherently 21 CFR Part 11-compliant, the system supports GLP-aligned documentation when paired with external data loggers meeting audit-trail and electronic signature requirements. Calibration certificates for Pt100 sensors and temperature mapping reports (per ISO/IEC 17025 guidelines) are available upon request.

Software & Data Management

The OK-T series employs a microprocessor-based push-button controller with intuitive menu navigation, real-time display of chamber temperature, setpoint, elapsed time, and fault status. Though not equipped with embedded Ethernet or cloud connectivity, the controller outputs analog (4–20 mA) and digital (RS485 Modbus RTU) signals compatible with third-party SCADA systems, LIMS platforms, or programmable logic controllers (PLCs). Users may integrate external USB or SD-card data loggers to record time-stamped temperature profiles with ≥1 Hz sampling—supporting retrospective analysis, deviation investigation, and regulatory reporting. All firmware revisions are version-controlled and field-upgradable via secure serial interface.

Applications

• Accelerated life testing of printed circuit boards (PCBs) and solder joint reliability under sustained thermal load
• Thermal degradation studies of polymeric encapsulants, adhesives, and cable jacketing materials per ASTM D3045
• Pre-conditioning of sensors and actuators prior to functional verification in automotive ECUs
• Validation of thermal cutoff devices, fuses, and overcurrent protection circuits
• Stability testing of pharmaceutical packaging materials under ICH Q1A(R2) long-term and accelerated storage conditions (when operated within 40–60°C range)
• Outgassing behavior assessment of space-grade materials per ECSS-Q-ST-70-02C

FAQ

What standards does this chamber meet?
It conforms to GB/T 2423.2 and its international counterpart IEC 60068-2-2 for dry heat testing.
Can the chamber operate continuously at 500°C?
Yes—when specified with high-temperature grade insulation, fan bearings, and door gasket materials; continuous operation requires adherence to manufacturer-specified duty cycles and cooling intervals.
Is calibration documentation provided with shipment?
A factory calibration report for the primary Pt100 sensor is included; full ISO/IEC 17025-accredited calibration with uncertainty budget is available as an optional service.
How is temperature uniformity verified?
Uniformity is validated through 9-point thermal mapping per IEC 60068-3-5, conducted at three representative setpoints (e.g., 100°C, 250°C, 450°C) with stabilized dwell times ≥30 minutes.
What power supply configurations are supported?
Dual-voltage compatibility: AC 220V ±5% / 50 Hz or AC 380V ±5% / 50 Hz, with dedicated grounding and circuit breaker protection recommended.